KR101250186B1 - 콘택트 기판에 칩을 트랜스퍼하는 방법 및 디바이스 - Google Patents

콘택트 기판에 칩을 트랜스퍼하는 방법 및 디바이스 Download PDF

Info

Publication number
KR101250186B1
KR101250186B1 KR1020077025897A KR20077025897A KR101250186B1 KR 101250186 B1 KR101250186 B1 KR 101250186B1 KR 1020077025897 A KR1020077025897 A KR 1020077025897A KR 20077025897 A KR20077025897 A KR 20077025897A KR 101250186 B1 KR101250186 B1 KR 101250186B1
Authority
KR
South Korea
Prior art keywords
substrate
contact
chip
transfer
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020077025897A
Other languages
English (en)
Korean (ko)
Other versions
KR20070120583A (ko
Inventor
엘케 자켈
가셈 아즈다쉬트
Original Assignee
파크 테크-파카징 테크놀로지이스 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 파크 테크-파카징 테크놀로지이스 게엠베하 filed Critical 파크 테크-파카징 테크놀로지이스 게엠베하
Publication of KR20070120583A publication Critical patent/KR20070120583A/ko
Application granted granted Critical
Publication of KR101250186B1 publication Critical patent/KR101250186B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7428—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07202—Connecting or disconnecting of bump connectors using auxiliary members
    • H10W72/07204—Connecting or disconnecting of bump connectors using auxiliary members using temporary auxiliary members, e.g. sacrificial coatings
    • H10W72/07207—Temporary substrates, e.g. removable substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07235—Applying EM radiation, e.g. induction heating or using a laser
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07302—Connecting or disconnecting of die-attach connectors using an auxiliary member
    • H10W72/07304—Connecting or disconnecting of die-attach connectors using an auxiliary member the auxiliary member being temporary, e.g. a sacrificial coating
    • H10W72/07307—Connecting or disconnecting of die-attach connectors using an auxiliary member the auxiliary member being temporary, e.g. a sacrificial coating the auxiliary member being a temporary substrate, e.g. a removable substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020077025897A 2005-04-08 2006-04-10 콘택트 기판에 칩을 트랜스퍼하는 방법 및 디바이스 Expired - Lifetime KR101250186B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102005016521.4 2005-04-08
DE102005016521 2005-04-08
PCT/DE2006/000628 WO2006105782A2 (de) 2005-04-08 2006-04-10 Verfahren und vorrichtung zur übertragung eines chips auf ein kontaktsubstrat

Publications (2)

Publication Number Publication Date
KR20070120583A KR20070120583A (ko) 2007-12-24
KR101250186B1 true KR101250186B1 (ko) 2013-04-05

Family

ID=37073818

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077025897A Expired - Lifetime KR101250186B1 (ko) 2005-04-08 2006-04-10 콘택트 기판에 칩을 트랜스퍼하는 방법 및 디바이스

Country Status (7)

Country Link
US (1) US9401298B2 (https=)
EP (1) EP1869701B1 (https=)
JP (1) JP5964005B2 (https=)
KR (1) KR101250186B1 (https=)
CN (1) CN101164150B (https=)
DE (1) DE112006001493A5 (https=)
WO (1) WO2006105782A2 (https=)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100820741B1 (ko) 2007-03-30 2008-04-11 삼성전자주식회사 전자부품의 본딩장치
TW200947641A (en) 2008-05-15 2009-11-16 Gio Optoelectronics Corp Die bonding apparatus
WO2012142177A2 (en) * 2011-04-11 2012-10-18 Ndsu Research Foundation Selective laser-assisted transfer of discrete components
CN103302431B (zh) * 2012-03-09 2016-03-02 鸿富锦精密工业（深圳）有限公司 芯片焊接装置
WO2015085064A1 (en) * 2013-12-05 2015-06-11 Uniqarta, Inc. Electronic device incorporated into a sheet
US9624100B2 (en) 2014-06-12 2017-04-18 Apple Inc. Micro pick up array pivot mount with integrated strain sensing elements
CN113715458A (zh) * 2014-08-05 2021-11-30 库利克和索夫工业公司 用于传送分立元件的方法和装置
JP6367084B2 (ja) 2014-10-30 2018-08-01 株式会社東芝 半導体チップの接合方法及び半導体チップの接合装置
EP3289605A2 (en) * 2015-04-28 2018-03-07 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Transfer and soldering of chips
EP3221882A4 (en) * 2015-07-14 2018-05-02 Goertek Inc. Assembling method, manufacturing method, device and electronic apparatus of flip-die
US10446532B2 (en) * 2016-01-13 2019-10-15 Invensas Bonding Technologies, Inc. Systems and methods for efficient transfer of semiconductor elements
TW202524641A (zh) * 2016-01-15 2025-06-16 荷蘭商庫力克及索發荷蘭公司 放置超小或超薄之離散組件
EP3469424A4 (en) 2016-06-10 2020-01-15 Applied Materials, Inc. MASKLESS PARALLEL ASSEMBLY TRANSMISSION OF MICRO COMPONENTS
US11756982B2 (en) 2016-06-10 2023-09-12 Applied Materials, Inc. Methods of parallel transfer of micro-devices using mask layer
US11776989B2 (en) 2016-06-10 2023-10-03 Applied Materials, Inc. Methods of parallel transfer of micro-devices using treatment
JP6603412B2 (ja) * 2016-06-22 2019-11-06 株式会社鈴木 実装装置
TWI671844B (zh) * 2017-01-30 2019-09-11 日商新川股份有限公司 拾取裝置以及拾取方法
JP6720333B2 (ja) 2017-06-12 2020-07-08 ユニカルタ・インコーポレイテッド 基板上に個別部品を並列に組み立てる方法
US11201077B2 (en) 2017-06-12 2021-12-14 Kulicke & Soffa Netherlands B.V. Parallel assembly of discrete components onto a substrate
KR102077049B1 (ko) * 2017-12-21 2020-02-13 한국기계연구원 마이크로 소자 전사방법 및 마이크로 소자 전사장치
JP6900006B2 (ja) 2018-02-14 2021-07-07 東芝デバイス＆ストレージ株式会社 チップ移載部材、チップ移載装置、およびチップ移載方法
US10573543B2 (en) * 2018-04-30 2020-02-25 Cree, Inc. Apparatus and methods for mass transfer of electronic die
KR102171374B1 (ko) * 2018-07-27 2020-10-29 주식회사 비에스피 마이크로 소자 리워크 방법
DE102018006771B4 (de) 2018-08-27 2022-09-08 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger
US11069555B2 (en) * 2018-09-03 2021-07-20 Assembleon B.V. Die attach systems, and methods of attaching a die to a substrate
US11134595B2 (en) 2018-09-05 2021-09-28 Assembleon B.V. Compliant die attach systems having spring-driven bond tools
TWI690980B (zh) * 2018-12-07 2020-04-11 台灣愛司帝科技股份有限公司 晶片移轉方法及晶片移轉設備
US11107711B2 (en) * 2019-03-20 2021-08-31 Beijing Boe Display Technology Co., Ltd. Micro light emitting diode transferring apparatus, method for transferring micro light emitting diode, and display apparatus
WO2021164855A1 (de) * 2020-02-18 2021-08-26 Ev Group E. Thallner Gmbh Verfahren und vorrichtung zur übertragung von bauteilen
KR102182856B1 (ko) * 2020-03-11 2020-11-25 넥스타테크놀로지 주식회사 부품 실장 장치
KR102436955B1 (ko) * 2020-03-11 2022-08-26 넥스타테크놀로지 주식회사 실장 헤드 및 이를 포함하는 부품 실장 장치
KR102391169B1 (ko) * 2020-03-11 2022-05-03 넥스타테크놀로지 주식회사 실장 헤드 및 이를 포함하는 부품 실장 장치
TWI770612B (zh) * 2020-09-18 2022-07-11 歆熾電氣技術股份有限公司 晶片移轉系統與晶片移轉方法
KR102271499B1 (ko) * 2020-10-16 2021-07-01 넥스타테크놀로지 주식회사 실장 헤드 및 이를 포함하는 부품 실장 장치
CN115547895B (zh) * 2022-11-24 2023-03-10 深圳新控半导体技术有限公司 一种芯片粘贴工装

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR910019188A (ko) * 1990-04-04 1991-11-30 야마나까 가즈다까 Ic 소켓에 있어서 콘택트의 개폐장치
US20010017403A1 (en) 1995-12-05 2001-08-30 Kabushiki Kaisha Toshiba Push-up pin of a semiconductor element pushing-up device, a semiconductor element pushing-up device, and a method for separating a semiconductor element in a semiconductor element pushing-up device
JP2002026071A (ja) * 2000-07-05 2002-01-25 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62101040A (ja) * 1985-10-26 1987-05-11 Seiko Instr & Electronics Ltd 半導体素子の接続法および装置
EP0367705A3 (en) * 1988-10-31 1990-09-26 International Business Machines Corporation Laser assisted ultrasonic bonding
JP3195970B2 (ja) 1992-05-29 2001-08-06 澁谷工業株式会社 半導体チップボンダにおけるチップ加熱機構
JP3416979B2 (ja) * 1993-03-11 2003-06-16 セイコーエプソン株式会社 接合装置
DE19749909C2 (de) * 1996-12-10 2000-08-31 Fraunhofer Ges Forschung Vorrichtung zum Herstellen von Verbindungen zwischen jeweils zwei Kontaktelementen mittels Laserenergie
JPH11121481A (ja) * 1997-10-17 1999-04-30 Fujitsu Ltd 半導体部品の実装装置
US6284086B1 (en) * 1999-08-05 2001-09-04 Three - Five Systems, Inc. Apparatus and method for attaching a microelectronic device to a carrier using a photo initiated anisotropic conductive adhesive
WO2002084631A1 (en) * 2001-04-11 2002-10-24 Sony Corporation Element transfer method, element arrangmenet method using the same, and image display apparatus production method
US20030224581A1 (en) * 2002-06-03 2003-12-04 Robert Bosch Gmbh Flip chip packaging process using laser-induced metal bonding technology, system utilizing the method, and device created by the method
JP2005005245A (ja) * 2002-11-08 2005-01-06 Fuji Photo Film Co Ltd 転写素材の転写方法、形状転写方法及び転写装置
JP3743424B2 (ja) 2003-01-10 2006-02-08 松下電器産業株式会社 電子部品圧着装置および電子部品圧着方法
DE10313481B4 (de) * 2003-03-26 2005-07-07 Protechna S.A. Transport- und Lagerbehälter für Flüssigkeiten
US7244326B2 (en) * 2003-05-16 2007-07-17 Alien Technology Corporation Transfer assembly for manufacturing electronic devices
WO2005024908A2 (en) * 2003-09-05 2005-03-17 Si2 Technologies, Inc. Laser transfer articles and method of making

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR910019188A (ko) * 1990-04-04 1991-11-30 야마나까 가즈다까 Ic 소켓에 있어서 콘택트의 개폐장치
US20010017403A1 (en) 1995-12-05 2001-08-30 Kabushiki Kaisha Toshiba Push-up pin of a semiconductor element pushing-up device, a semiconductor element pushing-up device, and a method for separating a semiconductor element in a semiconductor element pushing-up device
JP2002026071A (ja) * 2000-07-05 2002-01-25 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器

Also Published As

Publication number Publication date
JP5964005B2 (ja) 2016-08-03
US9401298B2 (en) 2016-07-26
DE112006001493A5 (de) 2008-03-20
CN101164150A (zh) 2008-04-16
KR20070120583A (ko) 2007-12-24
EP1869701B1 (de) 2017-02-08
US20080210368A1 (en) 2008-09-04
EP1869701A2 (de) 2007-12-26
WO2006105782A2 (de) 2006-10-12
JP2008535275A (ja) 2008-08-28
CN101164150B (zh) 2010-08-18
WO2006105782A3 (de) 2007-08-30

Similar Documents

Publication Publication Date Title
KR101250186B1 (ko) 콘택트 기판에 칩을 트랜스퍼하는 방법 및 디바이스
JP6283679B2 (ja) ベア・チップ・ダイをボンディングする方法
JP2020188037A (ja) ディスプレイ装置の製造方法、およびソース基板構造体
US20070261233A1 (en) Method and system for fabricating a semiconductor device
US5275970A (en) Method of forming bonding bumps by punching a metal ribbon
JPH0961674A (ja) 光モジュール及びその製造方法
JP2012511814A (ja) 電子アセンブリ製造の方法および装置ならびにその電子アセンブリ
KR20200136807A (ko) 디스플레이 장치, 소스 기판 구조체, 구동 기판 구조체, 및 디스플레이 장치의 제조 방법
US6892927B2 (en) Method and apparatus for bonding a wire to a bond pad on a device
US10147702B2 (en) Method for simultaneously bonding multiple chips of different heights on flexible substrates using anisotropic conductive film or paste
US8142001B2 (en) Ink jet print head manufacturing method and ink jet print head
JP3992893B2 (ja) 半導体装置のアンダーフィル方法
CN101246826B (zh) 安装电子部件的方法
JP7335085B2 (ja) 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法
JPH05291397A (ja) コレットおよび半導体装置の製造方法
JP2003318218A (ja) 曲面チップ基板、その製造方法、および、バンプ形成装置
EP4383321A1 (en) Method and device for depositing components on a substrate
JP2007294989A (ja) 半導体装置のアンダーフィル方法
KR20260028573A (ko) 솔더 콘택트 핀의 형성 방법
KR20070038366A (ko) 스택 다이 본딩장치 및 본딩방법
JP2007266628A (ja) 半導体装置のアンダーフィル方法
JPH0748505B2 (ja) 半導体装置の実装方法
JP2001063070A (ja) 液体噴射記録ヘッドの製造方法および製造装置
JP2001347670A (ja) インクジェットヘッドのノズルプレート形成方法及びその製造装置
JPH02105458A (ja) 固体撮像装置とその製造方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20160315

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20180320

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20190318

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000