KR101240546B1 - 장방형 구조로 배열된 전자 부품의 이동 방법 및 장치 - Google Patents

장방형 구조로 배열된 전자 부품의 이동 방법 및 장치 Download PDF

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Publication number
KR101240546B1
KR101240546B1 KR1020077025730A KR20077025730A KR101240546B1 KR 101240546 B1 KR101240546 B1 KR 101240546B1 KR 1020077025730 A KR1020077025730 A KR 1020077025730A KR 20077025730 A KR20077025730 A KR 20077025730A KR 101240546 B1 KR101240546 B1 KR 101240546B1
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KR
South Korea
Prior art keywords
electronic components
parts
positioning table
flat carrier
transfer
Prior art date
Application number
KR1020077025730A
Other languages
English (en)
Korean (ko)
Other versions
KR20070121823A (ko
Inventor
윌헬머스 헨드리커스 조하네스 함센
Original Assignee
피코 비. 브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 피코 비. 브이. filed Critical 피코 비. 브이.
Publication of KR20070121823A publication Critical patent/KR20070121823A/ko
Application granted granted Critical
Publication of KR101240546B1 publication Critical patent/KR101240546B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/022—Feeding of components with orientation of the elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020077025730A 2005-04-20 2006-04-13 장방형 구조로 배열된 전자 부품의 이동 방법 및 장치 KR101240546B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL1028224 2005-02-08
NL1028824A NL1028824C2 (nl) 2005-04-20 2005-04-20 Werkwijze en inrichting voor het verplaatsen van in een rechthoekige structuur gerangschikte elektronische componenten.
PCT/NL2006/050084 WO2006112711A2 (en) 2005-04-20 2006-04-13 Method and device for displacing electronic components ordered in a rectangualr structure

Publications (2)

Publication Number Publication Date
KR20070121823A KR20070121823A (ko) 2007-12-27
KR101240546B1 true KR101240546B1 (ko) 2013-03-08

Family

ID=35447720

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077025730A KR101240546B1 (ko) 2005-04-20 2006-04-13 장방형 구조로 배열된 전자 부품의 이동 방법 및 장치

Country Status (6)

Country Link
KR (1) KR101240546B1 (nl)
CN (1) CN101160651B (nl)
MY (1) MY154558A (nl)
NL (1) NL1028824C2 (nl)
TW (1) TWI392047B (nl)
WO (1) WO2006112711A2 (nl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1028907C2 (nl) * 2005-04-29 2006-10-31 Fico Bv Werkwijze en inrichting voor het aanvoeren en het afvoeren van dragers met elektronische componenten.

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990071654A (ko) * 1995-11-27 1999-09-27 모리시타 요이찌 전자 부품 장착 장치 및 전자 부품 장착 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5040291A (en) * 1990-05-04 1991-08-20 Universal Instruments Corporation Multi-spindle pick and place method and apparatus
KR970007078Y1 (en) * 1994-06-03 1997-07-15 Lg Semicon Co Ltd Devices feeding apparatus
DE19625515C2 (de) * 1996-06-26 1999-03-18 Mci Computer Gmbh Vorrichtung zur Veränderung der Rasteranordnung von Aufnahmen einer Trägervorrichtung für Gegenstände, insbesondere elektronische Bauteile, und Verfahren zum Überführen von Gegenständen mittels einer derartigen Vorrichtung
WO2003015491A1 (en) * 2001-08-08 2003-02-20 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting electronic parts
AT414077B (de) * 2001-08-14 2006-08-15 Datacon Semiconductor Equip Verfahren und einrichtung zur positionsveränderung von elektronischen bauteilen
EP1510117A1 (en) * 2002-06-03 2005-03-02 Assembléon N.V. Method suitable for placing at least one component in a desired position on a substrate by means of a device, and such a device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990071654A (ko) * 1995-11-27 1999-09-27 모리시타 요이찌 전자 부품 장착 장치 및 전자 부품 장착 방법

Also Published As

Publication number Publication date
CN101160651B (zh) 2010-12-01
WO2006112711A2 (en) 2006-10-26
KR20070121823A (ko) 2007-12-27
TWI392047B (zh) 2013-04-01
TW200639964A (en) 2006-11-16
MY154558A (en) 2015-06-30
NL1028824C2 (nl) 2006-10-23
CN101160651A (zh) 2008-04-09
WO2006112711A3 (en) 2007-03-08

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