KR101232241B1 - 세라믹 전자부품 - Google Patents
세라믹 전자부품 Download PDFInfo
- Publication number
- KR101232241B1 KR101232241B1 KR1020117017076A KR20117017076A KR101232241B1 KR 101232241 B1 KR101232241 B1 KR 101232241B1 KR 1020117017076 A KR1020117017076 A KR 1020117017076A KR 20117017076 A KR20117017076 A KR 20117017076A KR 101232241 B1 KR101232241 B1 KR 101232241B1
- Authority
- KR
- South Korea
- Prior art keywords
- ceramic
- metal terminal
- junction
- ceramic element
- electrode
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 171
- 239000002184 metal Substances 0.000 claims abstract description 128
- 229910052751 metal Inorganic materials 0.000 claims abstract description 128
- 239000000463 material Substances 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 239000005022 packaging material Substances 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 5
- 239000003985 ceramic capacitor Substances 0.000 abstract description 34
- 230000002093 peripheral effect Effects 0.000 abstract description 16
- 238000005452 bending Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
- H01C1/014—Mounting; Supporting the resistor being suspended between and being supported by two supporting sections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Ceramic Capacitors (AREA)
- Thermistors And Varistors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009018639 | 2009-01-29 | ||
JPJP-P-2009-018639 | 2009-01-29 | ||
PCT/JP2010/050571 WO2010087250A1 (ja) | 2009-01-29 | 2010-01-19 | セラミック電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110096597A KR20110096597A (ko) | 2011-08-30 |
KR101232241B1 true KR101232241B1 (ko) | 2013-02-12 |
Family
ID=42395511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020117017076A KR101232241B1 (ko) | 2009-01-29 | 2010-01-19 | 세라믹 전자부품 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4941594B2 (ja) |
KR (1) | KR101232241B1 (ja) |
CN (1) | CN102232234B (ja) |
WO (1) | WO2010087250A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103811140B (zh) * | 2012-11-01 | 2016-10-05 | 无锡村田电子有限公司 | 引线型电子元器件 |
JP2014120524A (ja) * | 2012-12-13 | 2014-06-30 | Mitsubishi Materials Corp | リード付き電子部品 |
KR102191095B1 (ko) * | 2015-12-28 | 2020-12-15 | 한국전자기술연구원 | 전력모듈 및 그의 제조방법 |
JP6810526B2 (ja) * | 2016-03-08 | 2021-01-06 | Koa株式会社 | 抵抗器 |
CN112164591B (zh) * | 2020-10-09 | 2023-03-10 | 福建国光新业科技股份有限公司 | 一种提升叠层铝电解电容器高温高湿耐受能力的制造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007220751A (ja) | 2006-02-14 | 2007-08-30 | Tdk Corp | セラミックコンデンサの実装構造及びセラミックコンデンサ |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02146823U (ja) * | 1989-05-10 | 1990-12-13 | ||
JPH054448U (ja) * | 1991-06-27 | 1993-01-22 | 株式会社村田製作所 | 表面実装型電子部品 |
JPH06163315A (ja) * | 1992-11-17 | 1994-06-10 | Matsushita Electric Ind Co Ltd | 面実装用磁器コンデンサ |
JPH07230934A (ja) * | 1994-02-18 | 1995-08-29 | Rohm Co Ltd | 電子部品及びその基板実装構造 |
JP3520776B2 (ja) * | 1998-05-28 | 2004-04-19 | 株式会社村田製作所 | 電子部品 |
JP3687832B2 (ja) * | 1998-12-15 | 2005-08-24 | 株式会社村田製作所 | 積層セラミックコンデンサ |
-
2010
- 2010-01-19 JP JP2010548470A patent/JP4941594B2/ja active Active
- 2010-01-19 WO PCT/JP2010/050571 patent/WO2010087250A1/ja active Application Filing
- 2010-01-19 CN CN2010800034224A patent/CN102232234B/zh active Active
- 2010-01-19 KR KR1020117017076A patent/KR101232241B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007220751A (ja) | 2006-02-14 | 2007-08-30 | Tdk Corp | セラミックコンデンサの実装構造及びセラミックコンデンサ |
Also Published As
Publication number | Publication date |
---|---|
JP4941594B2 (ja) | 2012-05-30 |
WO2010087250A1 (ja) | 2010-08-05 |
KR20110096597A (ko) | 2011-08-30 |
CN102232234A (zh) | 2011-11-02 |
JPWO2010087250A1 (ja) | 2012-08-02 |
CN102232234B (zh) | 2012-10-24 |
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