KR101211724B1 - 반도체 패키지 및 그 제조방법 - Google Patents

반도체 패키지 및 그 제조방법 Download PDF

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Publication number
KR101211724B1
KR101211724B1 KR1020090038392A KR20090038392A KR101211724B1 KR 101211724 B1 KR101211724 B1 KR 101211724B1 KR 1020090038392 A KR1020090038392 A KR 1020090038392A KR 20090038392 A KR20090038392 A KR 20090038392A KR 101211724 B1 KR101211724 B1 KR 101211724B1
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South Korea
Prior art keywords
metal ball
solder mask
solder
metal
open area
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KR1020090038392A
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English (en)
Korean (ko)
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KR20100119328A (ko
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심성보
이영재
류성욱
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엘지이노텍 주식회사
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Priority to KR1020090038392A priority Critical patent/KR101211724B1/ko
Priority to PCT/KR2010/002683 priority patent/WO2010126302A2/en
Priority to TW099113894A priority patent/TWI406342B/zh
Publication of KR20100119328A publication Critical patent/KR20100119328A/ko
Application granted granted Critical
Publication of KR101211724B1 publication Critical patent/KR101211724B1/ko

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    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
KR1020090038392A 2009-04-30 2009-04-30 반도체 패키지 및 그 제조방법 KR101211724B1 (ko)

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PCT/KR2010/002683 WO2010126302A2 (en) 2009-04-30 2010-04-28 Semiconductor package with nsmd type solder mask and method for manufacturing the same
TW099113894A TWI406342B (zh) 2009-04-30 2010-04-30 具有非阻焊限定型防焊層之半導體封裝及其製造方法

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DE102012111358A1 (de) * 2012-11-23 2014-05-28 Osram Opto Semiconductors Gmbh Verfahren zum Vereinzeln eines Verbundes in Halbleiterchips und Halbleiterchip
CN105093853B (zh) * 2015-09-02 2017-06-23 广东海圣科技有限公司 自动防焊曝光台框模组及曝光机
KR101800367B1 (ko) * 2016-08-24 2017-11-28 한국기계연구원 마이크로 소자 전사방법 및 마이크로 소자 전사방법으로 제조된 마이크로 소자 기판
KR102094014B1 (ko) 2018-09-20 2020-03-27 주식회사 지엔테크 인쇄회로기판의 솔더링 장치 및 이를 이용한 공정방법

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US20090026633A1 (en) * 2007-07-26 2009-01-29 Phoenix Precision Technology Corporation Flip chip package structure and method for manufacturing the same

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TWI406342B (zh) 2013-08-21

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