KR101172723B1 - 동 도체 페이스트, 도체 회로판 및 전자부품 - Google Patents

동 도체 페이스트, 도체 회로판 및 전자부품 Download PDF

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Publication number
KR101172723B1
KR101172723B1 KR1020080007047A KR20080007047A KR101172723B1 KR 101172723 B1 KR101172723 B1 KR 101172723B1 KR 1020080007047 A KR1020080007047 A KR 1020080007047A KR 20080007047 A KR20080007047 A KR 20080007047A KR 101172723 B1 KR101172723 B1 KR 101172723B1
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KR
South Korea
Prior art keywords
glass frit
copper
copper conductor
powder
glass
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KR1020080007047A
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English (en)
Korean (ko)
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KR20080069922A (ko
Inventor
아키히로 하야시
Original Assignee
미츠보시벨트 가부시기가이샤
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Publication of KR20080069922A publication Critical patent/KR20080069922A/ko
Application granted granted Critical
Publication of KR101172723B1 publication Critical patent/KR101172723B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes

Landscapes

  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Glass Compositions (AREA)
  • Ceramic Capacitors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020080007047A 2007-01-24 2008-01-23 동 도체 페이스트, 도체 회로판 및 전자부품 KR101172723B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00014155 2007-01-24
JP2007014155A JP4291857B2 (ja) 2007-01-24 2007-01-24 銅導体ペースト、導体回路板及び電子部品

Publications (2)

Publication Number Publication Date
KR20080069922A KR20080069922A (ko) 2008-07-29
KR101172723B1 true KR101172723B1 (ko) 2012-08-14

Family

ID=39725486

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080007047A KR101172723B1 (ko) 2007-01-24 2008-01-23 동 도체 페이스트, 도체 회로판 및 전자부품

Country Status (4)

Country Link
JP (1) JP4291857B2 (ja)
KR (1) KR101172723B1 (ja)
CN (1) CN101236797B (ja)
TW (1) TWI409827B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180084529A (ko) * 2017-01-17 2018-07-25 주식회사 케이씨씨 세라믹 회로기판 및 이의 제조방법

Families Citing this family (15)

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KR100983219B1 (ko) * 2008-12-05 2010-09-20 조근호 직접인쇄방식에 의한 인쇄회로기판의 제조방법 및 이에 의하여 제조된 인쇄회로기판
CN103021511B (zh) * 2011-09-22 2016-05-11 比亚迪股份有限公司 一种晶体硅太阳能电池正面电极银浆及其制备方法
EP2774461B1 (de) * 2011-11-03 2018-09-12 CeramTec GmbH Leiterplatte aus ain mit kupferstrukturen
AT512041B1 (de) * 2012-05-04 2013-05-15 Mikroelektronik Ges Mit Beschraenkter Haftung Ab Verfahren zur Herstellung eines metallisierten Substrats
CN104112487A (zh) * 2013-04-18 2014-10-22 上海市灿晶电子材料有限公司 一种导电铜浆料及其制备方法和应用
US9799421B2 (en) 2013-06-07 2017-10-24 Heraeus Precious Metals North America Conshohocken Llc Thick print copper pastes for aluminum nitride substrates
JP6885188B2 (ja) * 2017-04-28 2021-06-09 住友金属鉱山株式会社 導電性組成物及び端子電極の製造方法
JP6879035B2 (ja) * 2017-04-28 2021-06-02 住友金属鉱山株式会社 導電性組成物、導体の製造方法及び電子部品の配線の形成方法
CN112602158B (zh) * 2018-08-23 2023-11-28 昭荣化学工业株式会社 导电性糊剂
US11222878B2 (en) 2019-04-30 2022-01-11 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Electronic power module
CN110942840A (zh) * 2019-12-13 2020-03-31 新昌中国计量大学企业创新研究院有限公司 用于氮化铝衬底的无铅铜导体浆料
CN112768110B (zh) * 2020-12-23 2022-07-01 广东风华高新科技股份有限公司 一种铜浆及片式多层陶瓷电容器
CN113314284B (zh) * 2021-03-10 2022-10-11 三之星机带株式会社 电阻体糊及其用途以及电阻体的制造方法
CN113724912B (zh) * 2021-08-27 2023-06-23 华昇电子材料(无锡)有限公司 一种mlcc用高烧结致密性铜浆及其制备方法
CN115831435B (zh) * 2022-11-28 2023-09-01 苏州三环科技有限公司 一种电阻器用浆料及其制备方法与应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003347148A (ja) 2002-05-27 2003-12-05 Murata Mfg Co Ltd 導電性ペースト及び積層セラミック電子部品

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JPH0349108A (ja) * 1989-07-18 1991-03-01 Mitsui Mining & Smelting Co Ltd 銅導体組成物
JPH06342965A (ja) * 1993-05-31 1994-12-13 Sumitomo Kinzoku Ceramics:Kk セラミックス回路基板及びその製造方法
JPH06349314A (ja) * 1993-06-03 1994-12-22 Murata Mfg Co Ltd 導電性ペースト
JP3433976B2 (ja) * 1993-06-25 2003-08-04 オリンパス光学工業株式会社 ガラス溶融ルツボ
JP2991609B2 (ja) * 1993-10-18 1999-12-20 日本碍子株式会社 ガス分離体と金属との接合体および水素ガス分離装置
JPH11111054A (ja) * 1997-10-07 1999-04-23 Showa Denko Kk 導電性ペースト用銅粉
JP3397125B2 (ja) * 1998-03-12 2003-04-14 株式会社村田製作所 電子部品
JP2000182435A (ja) * 1998-12-15 2000-06-30 Murata Mfg Co Ltd 導電性ペースト及びセラミック電子部品
JP2001028207A (ja) * 1999-07-14 2001-01-30 Murata Mfg Co Ltd 導電性ペーストおよびセラミック電子部品
JP3534684B2 (ja) * 2000-07-10 2004-06-07 Ｔｄｋ株式会社 導電ペーストおよび外部電極とその製造方法
JP3979813B2 (ja) * 2000-10-11 2007-09-19 松下電器産業株式会社 プラズマディスプレイパネル用基板の製造方法
US7176152B2 (en) * 2004-06-09 2007-02-13 Ferro Corporation Lead-free and cadmium-free conductive copper thick film pastes

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003347148A (ja) 2002-05-27 2003-12-05 Murata Mfg Co Ltd 導電性ペースト及び積層セラミック電子部品

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180084529A (ko) * 2017-01-17 2018-07-25 주식회사 케이씨씨 세라믹 회로기판 및 이의 제조방법
WO2018135755A3 (ko) * 2017-01-17 2018-09-27 주식회사 케이씨씨 세라믹 회로기판 및 이의 제조방법
KR102030688B1 (ko) * 2017-01-17 2019-10-10 주식회사 케이씨씨 세라믹 회로기판 및 이의 제조방법

Also Published As

Publication number Publication date
KR20080069922A (ko) 2008-07-29
CN101236797A (zh) 2008-08-06
TW200903519A (en) 2009-01-16
JP4291857B2 (ja) 2009-07-08
CN101236797B (zh) 2011-06-22
TWI409827B (zh) 2013-09-21
JP2008181759A (ja) 2008-08-07

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