KR101139561B1 - 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법 - Google Patents

감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법 Download PDF

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Publication number
KR101139561B1
KR101139561B1 KR1020097021752A KR20097021752A KR101139561B1 KR 101139561 B1 KR101139561 B1 KR 101139561B1 KR 1020097021752 A KR1020097021752 A KR 1020097021752A KR 20097021752 A KR20097021752 A KR 20097021752A KR 101139561 B1 KR101139561 B1 KR 101139561B1
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KR
South Korea
Prior art keywords
group
resin composition
photosensitive resin
formula
substituted
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KR1020097021752A
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English (en)
Korean (ko)
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KR20100009548A (ko
Inventor
쿠니아키 사토
토시즈미 요시노
마사야 오오카와
다카히로 히다카
히데야스 츠이키
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히다치 가세고교 가부시끼가이샤
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Publication of KR20100009548A publication Critical patent/KR20100009548A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
KR1020097021752A 2007-05-11 2008-05-08 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법 KR101139561B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007127217 2007-05-11
JPJP-P-2007-127217 2007-05-11
PCT/JP2008/058551 WO2008140016A1 (ja) 2007-05-11 2008-05-08 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Publications (2)

Publication Number Publication Date
KR20100009548A KR20100009548A (ko) 2010-01-27
KR101139561B1 true KR101139561B1 (ko) 2012-05-02

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KR1020097021752A KR101139561B1 (ko) 2007-05-11 2008-05-08 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법

Country Status (5)

Country Link
JP (1) JP4985767B2 (zh)
KR (1) KR101139561B1 (zh)
CN (2) CN101675388B (zh)
TW (1) TWI398728B (zh)
WO (1) WO2008140016A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011043565A (ja) * 2009-08-19 2011-03-03 Taiyo Holdings Co Ltd 光硬化性樹脂組成物
JP6402710B2 (ja) * 2013-03-07 2018-10-10 日立化成株式会社 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法
JP5864524B2 (ja) * 2013-12-26 2016-02-17 太陽ホールディングス株式会社 光硬化性樹脂組成物
JP6748419B2 (ja) * 2014-11-19 2020-09-02 三洋化成工業株式会社 感光性樹脂組成物
KR102329943B1 (ko) * 2016-03-16 2021-11-22 동우 화인켐 주식회사 네가티브 감광형 수지 조성물 및 이로부터 제조된 광경화 패턴
KR101910734B1 (ko) * 2017-03-28 2018-10-22 동우 화인켐 주식회사 착색 감광성 수지 조성물, 이를 사용하여 제조된 컬러필터, 및 상기 컬러필터를 포함하는 표시장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6448857A (en) * 1987-08-19 1989-02-23 Asahi Chemical Ind Novel photosensitive composition
JPH07278214A (ja) * 1994-02-15 1995-10-24 Hitachi Chem Co Ltd 光開始剤、感光性組成物、感光材料およびパターンの製造法
JP2006243648A (ja) 2005-03-07 2006-09-14 Fujifilm Electronic Materials Co Ltd 光硬化性組成物及びそれから得られるカラーフィルタ
WO2006129697A1 (ja) 2005-05-31 2006-12-07 Taiyo Ink Manufacturing Co., Ltd. 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5811218A (en) * 1993-07-28 1998-09-22 Hitachi Chemical Company, Ltd. Photoinitiator compositions including amino acids, coumarin and titanocene and photosensitive materials using the same
JP4165473B2 (ja) * 2004-08-17 2008-10-15 東洋紡績株式会社 ネガ型感光性ポリイミド前駆体組成物
JP4428151B2 (ja) * 2004-06-23 2010-03-10 Ｊｓｒ株式会社 着色層形成用感放射線性組成物およびカラーフィルタ
JP4627227B2 (ja) * 2005-06-22 2011-02-09 東京応化工業株式会社 感光性組成物およびブラックマトリクス
JP2007256845A (ja) * 2006-03-24 2007-10-04 Fujifilm Corp 感光性組成物、感光性フィルム、永久パターン形成方法、及びプリント基板
JP5031578B2 (ja) * 2006-03-29 2012-09-19 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
JP4660826B2 (ja) * 2006-08-18 2011-03-30 山栄化学株式会社 レジストパターンの形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6448857A (en) * 1987-08-19 1989-02-23 Asahi Chemical Ind Novel photosensitive composition
JPH07278214A (ja) * 1994-02-15 1995-10-24 Hitachi Chem Co Ltd 光開始剤、感光性組成物、感光材料およびパターンの製造法
JP2006243648A (ja) 2005-03-07 2006-09-14 Fujifilm Electronic Materials Co Ltd 光硬化性組成物及びそれから得られるカラーフィルタ
WO2006129697A1 (ja) 2005-05-31 2006-12-07 Taiyo Ink Manufacturing Co., Ltd. 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板

Also Published As

Publication number Publication date
CN101675388A (zh) 2010-03-17
TWI398728B (zh) 2013-06-11
CN102621810B (zh) 2014-05-28
TW200910007A (en) 2009-03-01
JPWO2008140016A1 (ja) 2010-08-05
CN102621810A (zh) 2012-08-01
JP4985767B2 (ja) 2012-07-25
WO2008140016A1 (ja) 2008-11-20
KR20100009548A (ko) 2010-01-27
CN101675388B (zh) 2012-07-18

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