KR101122442B1 - 적어도 하나의 광도파로를 포함하는 인쇄 회로 기판 엘리먼트 및 이 인쇄 회로 기판 엘리먼트를 제조하기 위한 방법 - Google Patents

적어도 하나의 광도파로를 포함하는 인쇄 회로 기판 엘리먼트 및 이 인쇄 회로 기판 엘리먼트를 제조하기 위한 방법 Download PDF

Info

Publication number
KR101122442B1
KR101122442B1 KR1020067015026A KR20067015026A KR101122442B1 KR 101122442 B1 KR101122442 B1 KR 101122442B1 KR 1020067015026 A KR1020067015026 A KR 1020067015026A KR 20067015026 A KR20067015026 A KR 20067015026A KR 101122442 B1 KR101122442 B1 KR 101122442B1
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
layer
optoelectronic
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020067015026A
Other languages
English (en)
Korean (ko)
Other versions
KR20060131816A (ko
Inventor
귄터 레이징
아르노 클라밍어
그레고르 랑어
폴커 슈미트
리이카 레이처
Original Assignee
에이티 앤 에스 오스트리아 테크놀로지 앤 시스템테크니크 악치엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이티 앤 에스 오스트리아 테크놀로지 앤 시스템테크니크 악치엔게젤샤프트 filed Critical 에이티 앤 에스 오스트리아 테크놀로지 앤 시스템테크니크 악치엔게젤샤프트
Publication of KR20060131816A publication Critical patent/KR20060131816A/ko
Application granted granted Critical
Publication of KR101122442B1 publication Critical patent/KR101122442B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/293—Configurations of stacked chips characterised by non-galvanic coupling between the chips, e.g. capacitive coupling
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083—Constructional arrangements
    • G02B2006/1213—Constructional arrangements comprising photonic band-gap structures or photonic lattices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12166—Manufacturing methods
    • G02B2006/1219—Polymerisation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12166—Manufacturing methods
    • G02B2006/12195—Tapering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
KR1020067015026A 2003-12-29 2006-07-25 적어도 하나의 광도파로를 포함하는 인쇄 회로 기판 엘리먼트 및 이 인쇄 회로 기판 엘리먼트를 제조하기 위한 방법 Expired - Fee Related KR101122442B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ATA2096/2003 2003-12-29
AT0209603A AT413891B (de) 2003-12-29 2003-12-29 Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements
PCT/AT2004/000459 WO2005064381A1 (de) 2003-12-29 2004-12-28 Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements

Publications (2)

Publication Number Publication Date
KR20060131816A KR20060131816A (ko) 2006-12-20
KR101122442B1 true KR101122442B1 (ko) 2012-03-09

Family

ID=34716005

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067015026A Expired - Fee Related KR101122442B1 (ko) 2003-12-29 2006-07-25 적어도 하나의 광도파로를 포함하는 인쇄 회로 기판 엘리먼트 및 이 인쇄 회로 기판 엘리먼트를 제조하기 위한 방법

Country Status (7)

Country Link
US (1) US20080044127A1 (https=)
EP (2) EP2309294A3 (https=)
JP (1) JP2007517248A (https=)
KR (1) KR101122442B1 (https=)
AT (1) AT413891B (https=)
CA (1) CA2551654A1 (https=)
WO (1) WO2005064381A1 (https=)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4304163B2 (ja) * 2005-03-09 2009-07-29 パナソニック株式会社 撮像モジュールおよびその製造方法
JP5317704B2 (ja) * 2006-01-12 2013-10-16 ピーピージー・インダストリーズ・オハイオ・インコーポレイテッド レーザ導入された光を再指向する機能を有する表示パネル
US8629610B2 (en) 2006-01-12 2014-01-14 Ppg Industries Ohio, Inc. Display panel
US7474815B2 (en) * 2006-03-14 2009-01-06 International Business Machines Corporation Interconnecting (mapping) a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array
JPWO2007111236A1 (ja) * 2006-03-24 2009-08-13 イビデン株式会社 光電気配線板、光通信用デバイス及び光通信用デバイスの製造方法
DE102007007269A1 (de) * 2006-04-04 2007-10-11 Man Roland Druckmaschinen Ag Applikation von elektronischen Bauelementen in Druckprodukten
AT503027B1 (de) * 2006-05-08 2007-07-15 Austria Tech & System Tech Leiterplattenelement mit optoelektronischem bauelement und licht-wellenleiter
AT503585B1 (de) * 2006-05-08 2007-11-15 Austria Tech & System Tech Leiterplattenelement sowie verfahren zu dessen herstellung
CN100510812C (zh) * 2006-11-09 2009-07-08 财团法人工业技术研究院 光电基板
JP2008158440A (ja) * 2006-12-26 2008-07-10 Toshiba Corp 光電気配線板及び光電気配線装置の製造方法
WO2008078680A1 (ja) * 2006-12-26 2008-07-03 Mitsui Chemicals, Inc. 光電気混載基板およびその製造方法
DE102007007355B4 (de) * 2007-02-14 2016-01-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung optischer Verbindungen und optische Anordnung
AT505834B1 (de) * 2007-09-21 2009-09-15 Austria Tech & System Tech Leiterplattenelement
AT505166B1 (de) * 2008-01-16 2008-11-15 Austria Tech & System Tech Verfahren und vorrichtung zum erzeugen eines licht-wellenleiters in einem leiterplattenelement
US8422837B2 (en) 2008-02-28 2013-04-16 Nec Corporation Semiconductor device
US8265432B2 (en) * 2008-03-10 2012-09-11 International Business Machines Corporation Optical transceiver module with optical windows
JP5063430B2 (ja) * 2008-03-25 2012-10-31 新光電気工業株式会社 光伝送機構を備えたモジュール基板およびその製造方法
US8390083B2 (en) 2009-09-04 2013-03-05 Analog Devices, Inc. System with recessed sensing or processing elements
AT12314U1 (de) * 2009-10-16 2012-03-15 Austria Tech & System Tech Leiterplattenelement und verfahren zur herstellung eines solchen leiterplattenelements
US7949211B1 (en) 2010-02-26 2011-05-24 Corning Incorporated Modular active board subassemblies and printed wiring boards comprising the same
TW201202769A (en) * 2010-07-07 2012-01-16 Nat Univ Tsing Hua Integrated optics for multiplexers transceiver module
AT12382U1 (de) 2010-10-14 2012-04-15 Austria Tech & System Tech Optische sensoreinrichtung
US10234545B2 (en) 2010-12-01 2019-03-19 Microsoft Technology Licensing, Llc Light source module
US9064080B2 (en) 2011-01-20 2015-06-23 International Business Machines Corporation Transferring heat through an optical layer of integrated circuitry
AT12749U1 (de) * 2011-04-01 2012-10-15 Austria Tech & System Tech Leiterplattenelement mit wenigstens einer led
DE102011101433A1 (de) 2011-05-10 2012-12-13 Technische Universität Dresden Integrierbares optisches Koppelelement und Verfahren zu seiner Herstellung
GB2502313A (en) * 2012-05-24 2013-11-27 Ibm Manufacturing three dimensional photonic device by two photon absorption polymerization
US9360620B2 (en) 2012-08-29 2016-06-07 Aurrion, Inc. Thermal management for photonic integrated circuits
US9509122B1 (en) 2012-08-29 2016-11-29 Aurrion, Inc. Optical cladding layer design
US9276335B2 (en) 2012-12-11 2016-03-01 Advanced Micro Devices, Inc. Double-sided circuit board with opposing modular card connector assemblies
HK1217366A1 (zh) 2013-01-11 2017-01-06 Multiphoton Optics Gmbh 光学组件及其制备方法
FI20135200L (fi) * 2013-03-01 2014-09-02 Tellabs Oy Sähkölaite
US9052597B2 (en) 2013-04-04 2015-06-09 Humboldt-Universität Zu Berlin Methods and fabrication tools for fabricating optical devices
US9383531B2 (en) * 2013-04-23 2016-07-05 Hon Hai Precision Industry Co., Ltd. Light signal gathering device and optical module used thereof
US9939578B2 (en) * 2013-05-10 2018-04-10 Intel Corporation Low cost integration of optical components in planar lightwave circuits
CN104576883B (zh) 2013-10-29 2018-11-16 普因特工程有限公司 芯片安装用阵列基板及其制造方法
AT14563U1 (de) * 2014-03-31 2016-01-15 At&S Austria Technologie & Systemtechnik Ag Verfahren zur Herstellung einer Leiterplatte mit zumindest einer optoelektronischen Komponente
US9641254B1 (en) * 2014-10-10 2017-05-02 Google Inc. Heat dissipation approach in chip on board assembly by using stacked copper microvias
CN106249361B (zh) * 2015-06-05 2019-06-28 胡迪群 嵌入式光纤模块
US9666558B2 (en) 2015-06-29 2017-05-30 Point Engineering Co., Ltd. Substrate for mounting a chip and chip package using the substrate
EP3130950A1 (de) * 2015-08-10 2017-02-15 Multiphoton Optics Gmbh Strahlumlenkelement sowie optisches bauelement mit strahlumlenkelement
US10257932B2 (en) 2016-02-16 2019-04-09 Microsoft Technology Licensing, Llc. Laser diode chip on printed circuit board
DE102016202765A1 (de) * 2016-02-23 2017-08-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Schaltkreisanordnung und Verfahren zum Herstellen einer Schaltkreisanordnung
US10141623B2 (en) 2016-10-17 2018-11-27 International Business Machines Corporation Multi-layer printed circuit board having first and second coaxial vias coupled to a core of a dielectric waveguide disposed in the circuit board
US10881001B2 (en) 2017-03-02 2020-12-29 Flex Ltd. Micro conductive thread interconnect component to make an interconnect between conductive threads in fabrics to PCB, FPC, and rigid-flex circuits
JP7145515B2 (ja) * 2017-04-28 2022-10-03 国立研究開発法人産業技術総合研究所 光電子集積回路及びコンピューティング装置
US10535845B1 (en) 2017-07-14 2020-01-14 Flex Ltd. Flexible and stretchable chain battery
US10163825B1 (en) * 2017-10-26 2018-12-25 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor structure and manufacturing method thereof
US10426029B1 (en) * 2018-01-18 2019-09-24 Flex Ltd. Micro-pad array to thread flexible attachment
US10687421B1 (en) 2018-04-04 2020-06-16 Flex Ltd. Fabric with woven wire braid
US10575381B1 (en) 2018-06-01 2020-02-25 Flex Ltd. Electroluminescent display on smart textile and interconnect methods
ES2967939T3 (es) * 2018-07-26 2024-05-06 Univ Vienna Emisor de luz de guía de ondas ópticas y pantalla táctil
US11557491B2 (en) 2019-10-31 2023-01-17 Nxp B.V. Selective underfill assembly and method therefor
US20220406686A1 (en) * 2021-06-16 2022-12-22 Intel Corporation Glass-based cavity and channels for cooling of embedded dies and 3d integrated modules using package substrates with glass core
US20220404568A1 (en) 2021-06-17 2022-12-22 Intel Corporation Package with optical waveguide in a glass core
US20230093438A1 (en) * 2021-09-21 2023-03-23 Intel Corporation Glass substrate embedded pic to pic and off-chip photonic communications
US11963291B2 (en) * 2022-04-21 2024-04-16 Nxp B.V. Efficient wave guide transition between package and PCB using solder wall
CN120693518A (zh) * 2023-02-16 2025-09-23 美光科技公司 阻焊层故障光纤传感器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020028045A1 (en) * 1998-10-09 2002-03-07 Tetsuzo Yoshimura Optical coupling structures and the fabrication processes
US20020164118A1 (en) * 2001-04-05 2002-11-07 Paddon Paul J. Photonic input/output port

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5749288A (en) * 1980-09-09 1982-03-23 Toshiba Corp Photo hybrid integrated circuit
US4666236A (en) * 1982-08-10 1987-05-19 Omron Tateisi Electronics Co. Optical coupling device and method of producing same
JPS6289914A (ja) * 1985-05-31 1987-04-24 Sumitomo Electric Ind Ltd 光素子一体型光導波路およびその製法
US5292620A (en) * 1988-01-15 1994-03-08 E. I. Du Pont De Nemours And Company Optical waveguide devices, elements for making the devices and methods of making the devices and elements
US5255070A (en) * 1989-07-20 1993-10-19 Pollak Fred H Method for determining interface properties of semiconductor materials by photoreflectance
JPH05502950A (ja) 1989-12-26 1993-05-20 アライド―シグナル・インコーポレーテッド 光学活性導波路の製造法
US5195154A (en) * 1990-04-27 1993-03-16 Ngk Insulators, Ltd. Optical surface mount technology (o-smt), optical surface mount circuit (o-smc), opto-electronic printed wiring board (oe-pwb), opto-electronic surface mount device (oe-smd), and methods of fabricating opto-electronic printed wiring board
US5367588A (en) * 1992-10-29 1994-11-22 Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of Communications Method of fabricating Bragg gratings using a silica glass phase grating mask and mask used by same
JPH06337320A (ja) * 1993-05-27 1994-12-06 Agency Of Ind Science & Technol 光導波路作製法および装置
DE19746508A1 (de) * 1997-10-22 1999-04-29 Daimler Chrysler Ag Anordnung und Verfahren zur Herstellung von Wellenleiterstrukturen mit optischen Komponenten
US6845184B1 (en) * 1998-10-09 2005-01-18 Fujitsu Limited Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making
US6343171B1 (en) * 1998-10-09 2002-01-29 Fujitsu Limited Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making
JP2000249873A (ja) * 1999-02-25 2000-09-14 Sony Corp 電子回路一体型光伝送モジュール及びその製造方法
US6477284B1 (en) * 1999-06-14 2002-11-05 Nec Corporation Photo-electric combined substrate, optical waveguide and manufacturing process therefor
AU7885900A (en) 1999-08-27 2001-03-26 Board Of Regents, The University Of Texas System Packaging enhanced board level opto-electronic interconnects
ATE433129T1 (de) 2000-06-15 2009-06-15 3M Innovative Properties Co Mikroherstellungsverfahren für organische optische bauteile
US7014988B2 (en) 2000-06-15 2006-03-21 3M Innovative Properties Company Multiphoton curing to provide encapsulated optical elements
JP2002006161A (ja) * 2000-06-19 2002-01-09 Sony Corp 光配線基板および光配線モジュール並びにそれらの製造方法
US6694069B2 (en) * 2000-10-30 2004-02-17 Kyocera Corporation Optical integrated circuit substrate and optical module
JP2002286959A (ja) * 2000-12-28 2002-10-03 Canon Inc 半導体装置、光電融合基板、及びそれらの製造方法
JP4284889B2 (ja) * 2001-05-28 2009-06-24 パナソニック電工株式会社 光導波路、光配線板、電気・光混載回路基板及び光導波路の製造方法
JP2003131058A (ja) * 2001-08-09 2003-05-08 Kanegafuchi Chem Ind Co Ltd 光導波路および光導波路の作製方法。
JP3768450B2 (ja) * 2002-02-14 2006-04-19 株式会社フジクラ 光導波路部品の製造方法
JP2003315608A (ja) * 2002-04-23 2003-11-06 Matsushita Electric Works Ltd 光部品接合部の光伝送路の結合方法
TWI294262B (en) * 2002-06-28 2008-03-01 Matsushita Electric Industrial Co Ltd A light reception/emission device built-in module with optical and electrical wiring combined therein and method of making the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020028045A1 (en) * 1998-10-09 2002-03-07 Tetsuzo Yoshimura Optical coupling structures and the fabrication processes
US20020164118A1 (en) * 2001-04-05 2002-11-07 Paddon Paul J. Photonic input/output port

Also Published As

Publication number Publication date
KR20060131816A (ko) 2006-12-20
ATA20962003A (de) 2005-10-15
US20080044127A1 (en) 2008-02-21
EP1706770A1 (de) 2006-10-04
CA2551654A1 (en) 2005-07-14
WO2005064381A1 (de) 2005-07-14
JP2007517248A (ja) 2007-06-28
AT413891B (de) 2006-07-15
EP2309294A2 (de) 2011-04-13
EP2309294A3 (de) 2011-08-17

Similar Documents

Publication Publication Date Title
KR101122442B1 (ko) 적어도 하나의 광도파로를 포함하는 인쇄 회로 기판 엘리먼트 및 이 인쇄 회로 기판 엘리먼트를 제조하기 위한 방법
JP6461786B2 (ja) 光電気混載デバイス及びその製造方法
JP7145515B2 (ja) 光電子集積回路及びコンピューティング装置
US7734125B2 (en) Optoelectronic wiring board, optical communication device, and method of manufacturing the optical communication device
US9201203B2 (en) Photoelectric composite substrate and method of manufacturing the same
JP2009198804A (ja) 光モジュール及び光導波路
JP4845333B2 (ja) 光電変換素子パッケージ、その作製方法及び光コネクタ
JP2005275405A (ja) 光回路板部品を接続する光学的構造及び方法
JP4433608B2 (ja) 光モジュール及びその製造方法
JP4690870B2 (ja) 光電気集積配線基板及び光電気集積配線システム
Chang et al. Chip-to-chip optoelectronics SOP on organic boards or packages
JP2006011046A (ja) 光導波路及びその光導波モジュール、並びに光伝送モジュール
JP2005062645A (ja) 光接続構造体およびその製造方法
JP2006259730A (ja) 光学素子を結合するための装置及び方法
JP4511291B2 (ja) 光接続装置の製造法及びその光接続装置
JP2006330697A (ja) 光結合構造並びに光伝送機能内蔵基板およびその製造方法
JP2008158388A (ja) 光電気回路基板、光モジュールおよび光電気回路システム
JP2004302325A (ja) 光電気複合基板の製造方法
JP2005338704A (ja) 光結合機能付配線基板及びその製造方法と光結合システム
JP2004170716A (ja) 光回路部材、光電気混載基板、光伝送モジュール、および光回路部材の製造方法
JP7808902B1 (ja) 光電融合モジュール
JP5047591B2 (ja) フレキシブル光導波路および光導波路モジュール
JP4698728B2 (ja) 光電気集積配線基板および光電気集積配線システム
CN119065075A (zh) 光子组件及其形成方法
KR20260043859A (ko) 반도체 패키지 및 그 제조 방법

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20150203

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20160126

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20170105

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20180119

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20181213

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20191227

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20220224

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20220224