AT413891B - Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements - Google Patents

Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements Download PDF

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Publication number
AT413891B
AT413891B AT0209603A AT20962003A AT413891B AT 413891 B AT413891 B AT 413891B AT 0209603 A AT0209603 A AT 0209603A AT 20962003 A AT20962003 A AT 20962003A AT 413891 B AT413891 B AT 413891B
Authority
AT
Austria
Prior art keywords
circuit board
layer
printed circuit
optoelectronic component
optoelectronic
Prior art date
Application number
AT0209603A
Other languages
German (de)
English (en)
Other versions
ATA20962003A (de
Inventor
Guenther Leising
Arno Klamminger
Gregor Langer
Volker Schmidt
Riikka Reitzer
Original Assignee
Austria Tech & System Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Austria Tech & System Tech filed Critical Austria Tech & System Tech
Priority to AT0209603A priority Critical patent/AT413891B/de
Priority to PCT/AT2004/000459 priority patent/WO2005064381A1/de
Priority to EP10183725A priority patent/EP2309294A3/de
Priority to JP2006545841A priority patent/JP2007517248A/ja
Priority to CA002551654A priority patent/CA2551654A1/en
Priority to US10/581,849 priority patent/US20080044127A1/en
Priority to EP04802021A priority patent/EP1706770A1/de
Publication of ATA20962003A publication Critical patent/ATA20962003A/de
Application granted granted Critical
Publication of AT413891B publication Critical patent/AT413891B/de
Priority to KR1020067015026A priority patent/KR101122442B1/ko

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/43Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004Combinations of two or more optical elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0274Optical details, e.g. printed circuits comprising integral optical means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/20Configurations of stacked chips
    • H10W90/293Configurations of stacked chips characterised by non-galvanic coupling between the chips, e.g. capacitive coupling
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083Constructional arrangements
    • G02B2006/1213Constructional arrangements comprising photonic band-gap structures or photonic lattices
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12166Manufacturing methods
    • G02B2006/1219Polymerisation
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12166Manufacturing methods
    • G02B2006/12195Tapering
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
AT0209603A 2003-12-29 2003-12-29 Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements AT413891B (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
AT0209603A AT413891B (de) 2003-12-29 2003-12-29 Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements
PCT/AT2004/000459 WO2005064381A1 (de) 2003-12-29 2004-12-28 Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements
EP10183725A EP2309294A3 (de) 2003-12-29 2004-12-28 Leiterplattenelement sowie Verfahren zur Herstellung eines Leiterplattenelements
JP2006545841A JP2007517248A (ja) 2003-12-29 2004-12-28 少なくとも一つの光導波路を含むプリント回路基板エレメント、およびそのようなプリント回路基板エレメントの製造方法
CA002551654A CA2551654A1 (en) 2003-12-29 2004-12-28 Printed circuit board element comprising at least one optical waveguide, and method for the production of such a printed circuit board element
US10/581,849 US20080044127A1 (en) 2003-12-29 2004-12-28 Printed Circuit Board Element Comprising at Least One Optical Waveguide, and Method for the Production of Such a Printed Circuit Board Element
EP04802021A EP1706770A1 (de) 2003-12-29 2004-12-28 Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements
KR1020067015026A KR101122442B1 (ko) 2003-12-29 2006-07-25 적어도 하나의 광도파로를 포함하는 인쇄 회로 기판 엘리먼트 및 이 인쇄 회로 기판 엘리먼트를 제조하기 위한 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT0209603A AT413891B (de) 2003-12-29 2003-12-29 Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements

Publications (2)

Publication Number Publication Date
ATA20962003A ATA20962003A (de) 2005-10-15
AT413891B true AT413891B (de) 2006-07-15

Family

ID=34716005

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0209603A AT413891B (de) 2003-12-29 2003-12-29 Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements

Country Status (7)

Country Link
US (1) US20080044127A1 (https=)
EP (2) EP2309294A3 (https=)
JP (1) JP2007517248A (https=)
KR (1) KR101122442B1 (https=)
AT (1) AT413891B (https=)
CA (1) CA2551654A1 (https=)
WO (1) WO2005064381A1 (https=)

Cited By (5)

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DE102007007355A1 (de) * 2007-02-14 2008-08-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung optischer Verbindungen und optische Anordnung
AT505166B1 (de) * 2008-01-16 2008-11-15 Austria Tech & System Tech Verfahren und vorrichtung zum erzeugen eines licht-wellenleiters in einem leiterplattenelement
WO2012048359A1 (de) 2010-10-14 2012-04-19 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Optischer evaneszenzfeldsensor
AT12749U1 (de) * 2011-04-01 2012-10-15 Austria Tech & System Tech Leiterplattenelement mit wenigstens einer led
EP3599541A1 (en) * 2018-07-26 2020-01-29 University of Vienna Optical waveguide light emitter and touchscreen

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4304163B2 (ja) * 2005-03-09 2009-07-29 パナソニック株式会社 撮像モジュールおよびその製造方法
JP5317704B2 (ja) * 2006-01-12 2013-10-16 ピーピージー・インダストリーズ・オハイオ・インコーポレイテッド レーザ導入された光を再指向する機能を有する表示パネル
US8629610B2 (en) 2006-01-12 2014-01-14 Ppg Industries Ohio, Inc. Display panel
US7474815B2 (en) * 2006-03-14 2009-01-06 International Business Machines Corporation Interconnecting (mapping) a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array
JPWO2007111236A1 (ja) * 2006-03-24 2009-08-13 イビデン株式会社 光電気配線板、光通信用デバイス及び光通信用デバイスの製造方法
DE102007007269A1 (de) * 2006-04-04 2007-10-11 Man Roland Druckmaschinen Ag Applikation von elektronischen Bauelementen in Druckprodukten
AT503027B1 (de) * 2006-05-08 2007-07-15 Austria Tech & System Tech Leiterplattenelement mit optoelektronischem bauelement und licht-wellenleiter
AT503585B1 (de) * 2006-05-08 2007-11-15 Austria Tech & System Tech Leiterplattenelement sowie verfahren zu dessen herstellung
CN100510812C (zh) * 2006-11-09 2009-07-08 财团法人工业技术研究院 光电基板
JP2008158440A (ja) * 2006-12-26 2008-07-10 Toshiba Corp 光電気配線板及び光電気配線装置の製造方法
WO2008078680A1 (ja) * 2006-12-26 2008-07-03 Mitsui Chemicals, Inc. 光電気混載基板およびその製造方法
AT505834B1 (de) * 2007-09-21 2009-09-15 Austria Tech & System Tech Leiterplattenelement
US8422837B2 (en) 2008-02-28 2013-04-16 Nec Corporation Semiconductor device
US8265432B2 (en) * 2008-03-10 2012-09-11 International Business Machines Corporation Optical transceiver module with optical windows
JP5063430B2 (ja) * 2008-03-25 2012-10-31 新光電気工業株式会社 光伝送機構を備えたモジュール基板およびその製造方法
US8390083B2 (en) 2009-09-04 2013-03-05 Analog Devices, Inc. System with recessed sensing or processing elements
AT12314U1 (de) * 2009-10-16 2012-03-15 Austria Tech & System Tech Leiterplattenelement und verfahren zur herstellung eines solchen leiterplattenelements
US7949211B1 (en) 2010-02-26 2011-05-24 Corning Incorporated Modular active board subassemblies and printed wiring boards comprising the same
TW201202769A (en) * 2010-07-07 2012-01-16 Nat Univ Tsing Hua Integrated optics for multiplexers transceiver module
US10234545B2 (en) 2010-12-01 2019-03-19 Microsoft Technology Licensing, Llc Light source module
US9064080B2 (en) 2011-01-20 2015-06-23 International Business Machines Corporation Transferring heat through an optical layer of integrated circuitry
DE102011101433A1 (de) 2011-05-10 2012-12-13 Technische Universität Dresden Integrierbares optisches Koppelelement und Verfahren zu seiner Herstellung
GB2502313A (en) * 2012-05-24 2013-11-27 Ibm Manufacturing three dimensional photonic device by two photon absorption polymerization
US9360620B2 (en) 2012-08-29 2016-06-07 Aurrion, Inc. Thermal management for photonic integrated circuits
US9509122B1 (en) 2012-08-29 2016-11-29 Aurrion, Inc. Optical cladding layer design
US9276335B2 (en) 2012-12-11 2016-03-01 Advanced Micro Devices, Inc. Double-sided circuit board with opposing modular card connector assemblies
HK1217366A1 (zh) 2013-01-11 2017-01-06 Multiphoton Optics Gmbh 光学组件及其制备方法
FI20135200L (fi) * 2013-03-01 2014-09-02 Tellabs Oy Sähkölaite
US9052597B2 (en) 2013-04-04 2015-06-09 Humboldt-Universität Zu Berlin Methods and fabrication tools for fabricating optical devices
US9383531B2 (en) * 2013-04-23 2016-07-05 Hon Hai Precision Industry Co., Ltd. Light signal gathering device and optical module used thereof
US9939578B2 (en) * 2013-05-10 2018-04-10 Intel Corporation Low cost integration of optical components in planar lightwave circuits
CN104576883B (zh) 2013-10-29 2018-11-16 普因特工程有限公司 芯片安装用阵列基板及其制造方法
AT14563U1 (de) * 2014-03-31 2016-01-15 At&S Austria Technologie & Systemtechnik Ag Verfahren zur Herstellung einer Leiterplatte mit zumindest einer optoelektronischen Komponente
US9641254B1 (en) * 2014-10-10 2017-05-02 Google Inc. Heat dissipation approach in chip on board assembly by using stacked copper microvias
CN106249361B (zh) * 2015-06-05 2019-06-28 胡迪群 嵌入式光纤模块
US9666558B2 (en) 2015-06-29 2017-05-30 Point Engineering Co., Ltd. Substrate for mounting a chip and chip package using the substrate
EP3130950A1 (de) * 2015-08-10 2017-02-15 Multiphoton Optics Gmbh Strahlumlenkelement sowie optisches bauelement mit strahlumlenkelement
US10257932B2 (en) 2016-02-16 2019-04-09 Microsoft Technology Licensing, Llc. Laser diode chip on printed circuit board
DE102016202765A1 (de) * 2016-02-23 2017-08-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Schaltkreisanordnung und Verfahren zum Herstellen einer Schaltkreisanordnung
US10141623B2 (en) 2016-10-17 2018-11-27 International Business Machines Corporation Multi-layer printed circuit board having first and second coaxial vias coupled to a core of a dielectric waveguide disposed in the circuit board
US10881001B2 (en) 2017-03-02 2020-12-29 Flex Ltd. Micro conductive thread interconnect component to make an interconnect between conductive threads in fabrics to PCB, FPC, and rigid-flex circuits
JP7145515B2 (ja) * 2017-04-28 2022-10-03 国立研究開発法人産業技術総合研究所 光電子集積回路及びコンピューティング装置
US10535845B1 (en) 2017-07-14 2020-01-14 Flex Ltd. Flexible and stretchable chain battery
US10163825B1 (en) * 2017-10-26 2018-12-25 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor structure and manufacturing method thereof
US10426029B1 (en) * 2018-01-18 2019-09-24 Flex Ltd. Micro-pad array to thread flexible attachment
US10687421B1 (en) 2018-04-04 2020-06-16 Flex Ltd. Fabric with woven wire braid
US10575381B1 (en) 2018-06-01 2020-02-25 Flex Ltd. Electroluminescent display on smart textile and interconnect methods
US11557491B2 (en) 2019-10-31 2023-01-17 Nxp B.V. Selective underfill assembly and method therefor
US20220406686A1 (en) * 2021-06-16 2022-12-22 Intel Corporation Glass-based cavity and channels for cooling of embedded dies and 3d integrated modules using package substrates with glass core
US20220404568A1 (en) 2021-06-17 2022-12-22 Intel Corporation Package with optical waveguide in a glass core
US20230093438A1 (en) * 2021-09-21 2023-03-23 Intel Corporation Glass substrate embedded pic to pic and off-chip photonic communications
US11963291B2 (en) * 2022-04-21 2024-04-16 Nxp B.V. Efficient wave guide transition between package and PCB using solder wall
CN120693518A (zh) * 2023-02-16 2025-09-23 美光科技公司 阻焊层故障光纤传感器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4762381A (en) * 1986-01-29 1988-08-09 Sumitomo Electric Industries, Ltd. Optical element integrated optical waveguide and production of the same
US20020081056A1 (en) * 2000-10-30 2002-06-27 Kyocera Corporation Optical integrated circuit substrate and optical module
EP1219994A2 (en) * 2000-12-28 2002-07-03 Canon Kabushiki Kaisha Semiconductor device, optoelectronic board, and production methods therefor

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5749288A (en) * 1980-09-09 1982-03-23 Toshiba Corp Photo hybrid integrated circuit
US4666236A (en) * 1982-08-10 1987-05-19 Omron Tateisi Electronics Co. Optical coupling device and method of producing same
US5292620A (en) * 1988-01-15 1994-03-08 E. I. Du Pont De Nemours And Company Optical waveguide devices, elements for making the devices and methods of making the devices and elements
US5255070A (en) * 1989-07-20 1993-10-19 Pollak Fred H Method for determining interface properties of semiconductor materials by photoreflectance
JPH05502950A (ja) 1989-12-26 1993-05-20 アライド―シグナル・インコーポレーテッド 光学活性導波路の製造法
US5195154A (en) * 1990-04-27 1993-03-16 Ngk Insulators, Ltd. Optical surface mount technology (o-smt), optical surface mount circuit (o-smc), opto-electronic printed wiring board (oe-pwb), opto-electronic surface mount device (oe-smd), and methods of fabricating opto-electronic printed wiring board
US5367588A (en) * 1992-10-29 1994-11-22 Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of Communications Method of fabricating Bragg gratings using a silica glass phase grating mask and mask used by same
JPH06337320A (ja) * 1993-05-27 1994-12-06 Agency Of Ind Science & Technol 光導波路作製法および装置
DE19746508A1 (de) * 1997-10-22 1999-04-29 Daimler Chrysler Ag Anordnung und Verfahren zur Herstellung von Wellenleiterstrukturen mit optischen Komponenten
US6845184B1 (en) * 1998-10-09 2005-01-18 Fujitsu Limited Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making
US6343171B1 (en) * 1998-10-09 2002-01-29 Fujitsu Limited Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making
US6684007B2 (en) 1998-10-09 2004-01-27 Fujitsu Limited Optical coupling structures and the fabrication processes
JP2000249873A (ja) * 1999-02-25 2000-09-14 Sony Corp 電子回路一体型光伝送モジュール及びその製造方法
US6477284B1 (en) * 1999-06-14 2002-11-05 Nec Corporation Photo-electric combined substrate, optical waveguide and manufacturing process therefor
AU7885900A (en) 1999-08-27 2001-03-26 Board Of Regents, The University Of Texas System Packaging enhanced board level opto-electronic interconnects
ATE433129T1 (de) 2000-06-15 2009-06-15 3M Innovative Properties Co Mikroherstellungsverfahren für organische optische bauteile
US7014988B2 (en) 2000-06-15 2006-03-21 3M Innovative Properties Company Multiphoton curing to provide encapsulated optical elements
JP2002006161A (ja) * 2000-06-19 2002-01-09 Sony Corp 光配線基板および光配線モジュール並びにそれらの製造方法
US6788847B2 (en) * 2001-04-05 2004-09-07 Luxtera, Inc. Photonic input/output port
JP4284889B2 (ja) * 2001-05-28 2009-06-24 パナソニック電工株式会社 光導波路、光配線板、電気・光混載回路基板及び光導波路の製造方法
JP2003131058A (ja) * 2001-08-09 2003-05-08 Kanegafuchi Chem Ind Co Ltd 光導波路および光導波路の作製方法。
JP3768450B2 (ja) * 2002-02-14 2006-04-19 株式会社フジクラ 光導波路部品の製造方法
JP2003315608A (ja) * 2002-04-23 2003-11-06 Matsushita Electric Works Ltd 光部品接合部の光伝送路の結合方法
TWI294262B (en) * 2002-06-28 2008-03-01 Matsushita Electric Industrial Co Ltd A light reception/emission device built-in module with optical and electrical wiring combined therein and method of making the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4762381A (en) * 1986-01-29 1988-08-09 Sumitomo Electric Industries, Ltd. Optical element integrated optical waveguide and production of the same
US20020081056A1 (en) * 2000-10-30 2002-06-27 Kyocera Corporation Optical integrated circuit substrate and optical module
EP1219994A2 (en) * 2000-12-28 2002-07-03 Canon Kabushiki Kaisha Semiconductor device, optoelectronic board, and production methods therefor

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007007355A1 (de) * 2007-02-14 2008-08-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung optischer Verbindungen und optische Anordnung
DE102007007355B4 (de) * 2007-02-14 2016-01-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung optischer Verbindungen und optische Anordnung
AT505166B1 (de) * 2008-01-16 2008-11-15 Austria Tech & System Tech Verfahren und vorrichtung zum erzeugen eines licht-wellenleiters in einem leiterplattenelement
WO2012048359A1 (de) 2010-10-14 2012-04-19 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Optischer evaneszenzfeldsensor
AT12749U1 (de) * 2011-04-01 2012-10-15 Austria Tech & System Tech Leiterplattenelement mit wenigstens einer led
EP3599541A1 (en) * 2018-07-26 2020-01-29 University of Vienna Optical waveguide light emitter and touchscreen
WO2020021037A1 (en) * 2018-07-26 2020-01-30 University Of Vienna Optical waveguide light emitter and touchscreen

Also Published As

Publication number Publication date
KR20060131816A (ko) 2006-12-20
ATA20962003A (de) 2005-10-15
US20080044127A1 (en) 2008-02-21
EP1706770A1 (de) 2006-10-04
KR101122442B1 (ko) 2012-03-09
CA2551654A1 (en) 2005-07-14
WO2005064381A1 (de) 2005-07-14
JP2007517248A (ja) 2007-06-28
EP2309294A2 (de) 2011-04-13
EP2309294A3 (de) 2011-08-17

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