DE29624438U1 - Optische Baugruppe zur Ankopplung eines Lichtwellenleiters - Google Patents

Optische Baugruppe zur Ankopplung eines Lichtwellenleiters

Info

Publication number
DE29624438U1
DE29624438U1 DE29624438U DE29624438U DE29624438U1 DE 29624438 U1 DE29624438 U1 DE 29624438U1 DE 29624438 U DE29624438 U DE 29624438U DE 29624438 U DE29624438 U DE 29624438U DE 29624438 U1 DE29624438 U1 DE 29624438U1
Authority
DE
Germany
Prior art keywords
optical assembly
assembly according
transmitting
carrier
receiving element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29624438U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE29624438U priority Critical patent/DE29624438U1/de
Priority claimed from DE19616969A external-priority patent/DE19616969A1/de
Publication of DE29624438U1 publication Critical patent/DE29624438U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
    • H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15156—Side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt

Claims (12)

1. Optische Baugruppe zur Ankopplung eines Licht­ wellenleiters, mit einem lichtdurchlässigen Träger (3) und einem Sende- oder Empfangselement (13), das auf einer ersten Seite (5) des Trägers (3) aufge­ bracht ist, gekennzeichnet durch eine optisch transparente Schicht (31), die zumindest das Sende- oder Empfangselement (13) umgibt.
2. Optische Baugruppe nach nach Anspruch 4, dadurch ge­ kennzeichnet, daß der Träger (3) auf der ersten Seite (5) zumindest eine vorzugsweise wannenförmige Vertiefung (7) aufweist, in die das Sende- oder Empfangselement (13) eingebracht ist, wobei der Strahlengang des Sende- oder Empfangselements zu einer schrägen Seitenwand (41) der Vertiefung (7) gerichtet ist.
3. Optische Baugruppe nach Anspruch 1 oder 2, da­ durch gekennzeichnet, daß benachbart zu der schrä­ gen Seitenwand (41) der Vertiefung (7) eine vor­ zugsweise V-förmige Nut (9) vorgesehen ist, deren eine Wandung (43) als Reflektionsfläche im Strah­ lengang liegt.
4. Optische Baugruppe nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß auf einer zwei­ ten der ersten Seite gegenüberliegenden Seite (35) des Trägers (3) eine Linse (37) vorgesehen ist.
5. Optische Baugruppe nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß auf der außen­ liegende Oberfläche der ersten Schicht (31) eine weitere Schicht (33) ausgebildet ist, die als Feuchtigkeitssperre dient.
6. Optische Baugruppe nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß das Material des Trägers (3) Silizium ist.
7. Optische Baugruppe nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, daß das Material der ersten Schicht (31) organisch ist.
8. Optische Baugruppe nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, daß das Sende- oder Empfangselement eine Halbleiter-Laserdiode ist, die Licht im Wellenlängenbereich oberhalb 1100 nm aus­ sendet.
9. Optische Baugruppe nach Anspruch 8, dadurch gekennzeichnet, daß die Laserdiode (13) Licht in einem Öffnungswinkel von 10° bis 50° aussendet.
10. Optische Baugruppe nach Anspruch 8 oder 9, dadurch gekennzeichnet, daß der Laserdiode (13) zu deren Überwachung eine auf der ersten Seite (5) des Trägers (3) ausgebildete Monitor-Fotodiode (21) zu­ geordnet ist, die ebenfalls von der ersten Schicht (31) umgeben ist.
11. Optische Baugruppe nach einem der Ansprüche 1 bis 10, dadurch gekennzeichnet, daß auf der ersten und/oder der zweiten Seite Markierungen zum Justie­ ren ausgebildet sind.
12. Optische Baugruppe nach einem der Ansprüche 1 bis 11, dadurch gekennzeichnet, daß die erste und/oder die zweite Seite des Trägers (3) mit einer Entspiegelungsschicht versehen ist.
DE29624438U 1996-04-27 1996-04-27 Optische Baugruppe zur Ankopplung eines Lichtwellenleiters Expired - Lifetime DE29624438U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29624438U DE29624438U1 (de) 1996-04-27 1996-04-27 Optische Baugruppe zur Ankopplung eines Lichtwellenleiters

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE29624438U DE29624438U1 (de) 1996-04-27 1996-04-27 Optische Baugruppe zur Ankopplung eines Lichtwellenleiters
DE19616969A DE19616969A1 (de) 1996-04-27 1996-04-27 Optische Baugruppe zur Ankopplung eines Lichtwellenleiters und Verfahren zur Herstellung derselben

Publications (1)

Publication Number Publication Date
DE29624438U1 true DE29624438U1 (de) 2003-10-23

Family

ID=29403666

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29624438U Expired - Lifetime DE29624438U1 (de) 1996-04-27 1996-04-27 Optische Baugruppe zur Ankopplung eines Lichtwellenleiters

Country Status (1)

Country Link
DE (1) DE29624438U1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020016185A1 (de) * 2018-07-19 2020-01-23 Osram Opto Semiconductors Gmbh Halbleiterlaser

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020016185A1 (de) * 2018-07-19 2020-01-23 Osram Opto Semiconductors Gmbh Halbleiterlaser
KR20210024176A (ko) * 2018-07-19 2021-03-04 오스람 오엘이디 게엠베하 반도체 레이저
CN112567579A (zh) * 2018-07-19 2021-03-26 欧司朗Oled股份有限公司 半导体激光器
US20210281041A1 (en) * 2018-07-19 2021-09-09 Osram Oled Gmbh Semiconductor laser
KR102525067B1 (ko) * 2018-07-19 2023-04-21 오스람 오엘이디 게엠베하 반도체 레이저
US11749959B2 (en) * 2018-07-19 2023-09-05 Osram Oled Gmbh Semiconductor laser

Similar Documents

Publication Publication Date Title
DE19616969A1 (de) Optische Baugruppe zur Ankopplung eines Lichtwellenleiters und Verfahren zur Herstellung derselben
EP0873534B1 (de) Optoelektronische sendebaugruppe
DE19508222C1 (de) Optoelektronischer Wandler und Herstellverfahren
EP2016449B1 (de) Verfahren zur herstellung eines optoelektronischen bauelements
DE19640423C1 (de) Optoelektronisches Modul zur bidirektionalen optischen Datenübertragung
EP1203414B1 (de) Optoelektronisches bauelement und verfahren zur herstellung
DE69816809T2 (de) Vorrichtung für fluoreszenznachweis
EP0238977A2 (de) Sende- und Empfangsmodul für ein bidirektionales Kommunikationsnetz, insbesondere ein Breitband-ISDN
DE4440976A1 (de) Optische Sende- und Empfangseinrichtung mit einem oberflächenemittierenden Laser
EP0397911A1 (de) Optoelektronisches Halbleiterbauelement
ATE17280T1 (de) Vorrichtung zum seitlichen einkoppeln von licht in einen glasfaser-lichtwellenleiter.
WO2002082148A3 (de) Optisches oder optoelektronisches modul
WO2004051335A1 (de) Optische sende- und/oder empfangsanordnung mit einem planaren optischen schaltkreis
DE19607107A1 (de) Anordnung zur Kopplung von Signallicht zwischen einem Lichtwellenleiter und einer optoelektronischen Komponente
DE3515195A1 (de) Faseroptik-koppler
DE29624438U1 (de) Optische Baugruppe zur Ankopplung eines Lichtwellenleiters
EP0103757B1 (de) Platte mit faseroptischer Matrix
EP1574880B2 (de) Sendeelement für Lichtschranken, Lichtgitter und dergleichen
EP0931357A1 (de) Optoelekronisches modul zur bidirektionalen optischen datenübertragung
EP0942302A2 (de) Elektrooptisches Modul
DE102004038530B3 (de) Verfahren und Vorrichtung zur Herstellung einer optischen Verbindung zwischen einem optoelektronischen Bauelement und einem Lichtwellenleiter
EP3791429A1 (de) Solargenerator
DE3925189C1 (en) Optical transmission detector using optical fibre and PIN-diode - is mounted in V-shaped trench of crystalline silicon chip with vaporised counter-electrode and integrated receiving electronics
DE10314495B3 (de) Optische Koppeleinheit
DE4240707C1 (de) Frequenzdemultiplexer

Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20031127

R151 Utility model maintained after payment of second maintenance fee after six years

Effective date: 20040503

R152 Utility model maintained after payment of third maintenance fee after eight years

Effective date: 20040817

R071 Expiry of right