KR101118361B1 - 도전성 페이스트 및 그 도전성 페이스트를 이용한 세라믹 다층회로기판 제조방법 - Google Patents

도전성 페이스트 및 그 도전성 페이스트를 이용한 세라믹 다층회로기판 제조방법 Download PDF

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Publication number
KR101118361B1
KR101118361B1 KR1020060032083A KR20060032083A KR101118361B1 KR 101118361 B1 KR101118361 B1 KR 101118361B1 KR 1020060032083 A KR1020060032083 A KR 1020060032083A KR 20060032083 A KR20060032083 A KR 20060032083A KR 101118361 B1 KR101118361 B1 KR 101118361B1
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KR
South Korea
Prior art keywords
conductive paste
powder
circuit board
multilayer circuit
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020060032083A
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English (en)
Korean (ko)
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KR20070079548A (ko
Inventor
마사토시 수에히로
히로시 오치
노부오 오치아이
키미히토 니시카와
히로마사 미요시
Original Assignee
교토 에렉스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 교토 에렉스 가부시키가이샤 filed Critical 교토 에렉스 가부시키가이샤
Publication of KR20070079548A publication Critical patent/KR20070079548A/ko
Application granted granted Critical
Publication of KR101118361B1 publication Critical patent/KR101118361B1/ko
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Conductive Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020060032083A 2006-02-02 2006-04-07 도전성 페이스트 및 그 도전성 페이스트를 이용한 세라믹 다층회로기판 제조방법 Expired - Fee Related KR101118361B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00025826 2006-02-02
JP2006025826A JP4819516B2 (ja) 2006-02-02 2006-02-02 導電性ペースト及びその導電性ペーストを用いたセラミック多層回路基板

Publications (2)

Publication Number Publication Date
KR20070079548A KR20070079548A (ko) 2007-08-07
KR101118361B1 true KR101118361B1 (ko) 2012-03-09

Family

ID=38486870

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060032083A Expired - Fee Related KR101118361B1 (ko) 2006-02-02 2006-04-07 도전성 페이스트 및 그 도전성 페이스트를 이용한 세라믹 다층회로기판 제조방법

Country Status (3)

Country Link
JP (1) JP4819516B2 (enrdf_load_stackoverflow)
KR (1) KR101118361B1 (enrdf_load_stackoverflow)
TW (1) TW200731293A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100866577B1 (ko) * 2007-09-28 2008-11-03 삼성전기주식회사 인쇄회로기판의 층간 도통방법
CN101911219B (zh) * 2008-01-17 2015-12-16 日亚化学工业株式会社 导电性材料及其制造方法、电子设备、发光装置及其制造方法
JP5313526B2 (ja) * 2008-03-17 2013-10-09 京都エレックス株式会社 低温焼成多層基板用導電性ペースト
KR100946589B1 (ko) * 2008-04-03 2010-03-09 엘지이노텍 주식회사 반도체 소자 제조용 접착 페이스트 조성물
JP5814204B2 (ja) * 2012-09-10 2015-11-17 京都エレックス株式会社 Ｌｅｄ用セラミックパッケージ用ペースト
JP5849036B2 (ja) * 2012-09-27 2016-01-27 富士フイルム株式会社 導電ペースト、プリント配線基板
CN118342158B (zh) * 2024-03-14 2025-04-11 广州汉源微电子封装材料有限公司 一种大面积封装互连用银焊膏及其制备方法与应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001307549A (ja) 2000-04-21 2001-11-02 Furuya Kinzoku:Kk 銀ペースト及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0613756A (ja) * 1992-06-25 1994-01-21 Matsushita Electric Ind Co Ltd 導体ペースト組成物
JP3757211B2 (ja) * 2003-03-14 2006-03-22 富士通株式会社 配線基板及びその製造方法
JP2005293851A (ja) * 2004-03-10 2005-10-20 Toyobo Co Ltd 導電性ペースト
JP2005267900A (ja) * 2004-03-16 2005-09-29 Sumitomo Osaka Cement Co Ltd 導電性ペースト及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001307549A (ja) 2000-04-21 2001-11-02 Furuya Kinzoku:Kk 銀ペースト及びその製造方法

Also Published As

Publication number Publication date
JP2007207604A (ja) 2007-08-16
JP4819516B2 (ja) 2011-11-24
TWI322995B (enrdf_load_stackoverflow) 2010-04-01
KR20070079548A (ko) 2007-08-07
TW200731293A (en) 2007-08-16

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