JP4819516B2 - 導電性ペースト及びその導電性ペーストを用いたセラミック多層回路基板 - Google Patents
導電性ペースト及びその導電性ペーストを用いたセラミック多層回路基板 Download PDFInfo
- Publication number
- JP4819516B2 JP4819516B2 JP2006025826A JP2006025826A JP4819516B2 JP 4819516 B2 JP4819516 B2 JP 4819516B2 JP 2006025826 A JP2006025826 A JP 2006025826A JP 2006025826 A JP2006025826 A JP 2006025826A JP 4819516 B2 JP4819516 B2 JP 4819516B2
- Authority
- JP
- Japan
- Prior art keywords
- powder
- conductive paste
- multilayer circuit
- circuit board
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000919 ceramic Substances 0.000 title claims description 61
- 239000000843 powder Substances 0.000 claims description 50
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 claims description 44
- 239000011230 binding agent Substances 0.000 claims description 29
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 22
- 229910001923 silver oxide Inorganic materials 0.000 claims description 22
- 238000010304 firing Methods 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 16
- 239000002245 particle Substances 0.000 claims description 15
- 150000002894 organic compounds Chemical class 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 35
- 238000000034 method Methods 0.000 description 8
- 238000011049 filling Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000006722 reduction reaction Methods 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 239000001856 Ethyl cellulose Substances 0.000 description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 3
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 3
- 229920001249 ethyl cellulose Polymers 0.000 description 3
- 235000019325 ethyl cellulose Nutrition 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 229940116411 terpineol Drugs 0.000 description 3
- 238000005979 thermal decomposition reaction Methods 0.000 description 3
- 229920000180 alkyd Polymers 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Conductive Materials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006025826A JP4819516B2 (ja) | 2006-02-02 | 2006-02-02 | 導電性ペースト及びその導電性ペーストを用いたセラミック多層回路基板 |
| TW095110878A TW200731293A (en) | 2006-02-02 | 2006-03-29 | Conductive glue and ceramics multi-layer circuit substrate using such conductive glue |
| KR1020060032083A KR101118361B1 (ko) | 2006-02-02 | 2006-04-07 | 도전성 페이스트 및 그 도전성 페이스트를 이용한 세라믹 다층회로기판 제조방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006025826A JP4819516B2 (ja) | 2006-02-02 | 2006-02-02 | 導電性ペースト及びその導電性ペーストを用いたセラミック多層回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007207604A JP2007207604A (ja) | 2007-08-16 |
| JP4819516B2 true JP4819516B2 (ja) | 2011-11-24 |
Family
ID=38486870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006025826A Active JP4819516B2 (ja) | 2006-02-02 | 2006-02-02 | 導電性ペースト及びその導電性ペーストを用いたセラミック多層回路基板 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4819516B2 (enrdf_load_stackoverflow) |
| KR (1) | KR101118361B1 (enrdf_load_stackoverflow) |
| TW (1) | TW200731293A (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100866577B1 (ko) * | 2007-09-28 | 2008-11-03 | 삼성전기주식회사 | 인쇄회로기판의 층간 도통방법 |
| US8968608B2 (en) | 2008-01-17 | 2015-03-03 | Nichia Corporation | Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device |
| JP5313526B2 (ja) * | 2008-03-17 | 2013-10-09 | 京都エレックス株式会社 | 低温焼成多層基板用導電性ペースト |
| KR100946589B1 (ko) * | 2008-04-03 | 2010-03-09 | 엘지이노텍 주식회사 | 반도체 소자 제조용 접착 페이스트 조성물 |
| JP5814204B2 (ja) * | 2012-09-10 | 2015-11-17 | 京都エレックス株式会社 | Ｌｅｄ用セラミックパッケージ用ペースト |
| JP5849036B2 (ja) * | 2012-09-27 | 2016-01-27 | 富士フイルム株式会社 | 導電ペースト、プリント配線基板 |
| CN118342158B (zh) * | 2024-03-14 | 2025-04-11 | 广州汉源微电子封装材料有限公司 | 一种大面积封装互连用银焊膏及其制备方法与应用 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0613756A (ja) * | 1992-06-25 | 1994-01-21 | Matsushita Electric Ind Co Ltd | 導体ペースト組成物 |
| JP2001307549A (ja) | 2000-04-21 | 2001-11-02 | Furuya Kinzoku:Kk | 銀ペースト及びその製造方法 |
| JP3757211B2 (ja) * | 2003-03-14 | 2006-03-22 | 富士通株式会社 | 配線基板及びその製造方法 |
| JP2005293851A (ja) * | 2004-03-10 | 2005-10-20 | Toyobo Co Ltd | 導電性ペースト |
| JP2005267900A (ja) * | 2004-03-16 | 2005-09-29 | Sumitomo Osaka Cement Co Ltd | 導電性ペースト及びその製造方法 |
-
2006
- 2006-02-02 JP JP2006025826A patent/JP4819516B2/ja active Active
- 2006-03-29 TW TW095110878A patent/TW200731293A/zh not_active IP Right Cessation
- 2006-04-07 KR KR1020060032083A patent/KR101118361B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007207604A (ja) | 2007-08-16 |
| KR20070079548A (ko) | 2007-08-07 |
| TWI322995B (enrdf_load_stackoverflow) | 2010-04-01 |
| KR101118361B1 (ko) | 2012-03-09 |
| TW200731293A (en) | 2007-08-16 |
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