JP5364833B1 - 導体ペースト及びそれを用いたセラミック基板 - Google Patents
導体ペースト及びそれを用いたセラミック基板 Download PDFInfo
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Abstract
【解決手段】ペースト組成物中の含有率が60〜95質量%のAg粉末、Ag粉末の質量に対し0.5〜5質量%のホウケイ酸系ガラス粉末、残部が白金族金属添加剤及び有機ビヒクルであり前記白金族金属添加剤は、少なくともRu及びRhの2種の金属を含有し、該白金族金属添加剤のRu及びRhの各含有量は、前記Ag粉末の質量に対し、金属分換算で0.05〜5質量%のRu及び0.001〜0.1質量%のRhである導体ペーストとする。
【選択図】なし
Description
その後、表面導体の表面には、半田付け性、ボンディング性、耐熱性等を向上させて信頼性の高い電気的接続を得ることを目的として、めっき処理を施すことにより、Ni、Sn、半田等のめっき膜が形成される。
前記白金族金属添加剤は、少なくともRu及びRhの2種の金属を含有し、該白金族金属添加剤のRu及びRhの各含有量は、前記Ag粉末の質量に対し、金属分換算で0.05〜5質量%のRu及び0.001〜0.1質量%のRhであることを特徴とするものである。
本発明の導体ペーストは、前述したように、Ag粉末、ガラス粉末、白金族金属添加剤、有機ビヒクルを含有する、拘束焼成法で同時焼成する低温焼成セラミックグリーンシート積層体上に印刷され表面導体を形成するのに好適な導体ペーストである。
有機ビヒクル中の有機溶剤としては、Ag粉末の分散性等を考慮して適宜選択すればよく、各種の炭化水素系、アルコール系等の有機溶媒を使用することができる。例えば、テルピネオール[TPO]、ブチルカルビトールアセテート[BCA]、エステルアルコール、テレピン油が例示される。有機溶剤は1種を単独で使用しても、2種以上を併用してもよい。
必要に応じて一般的な添加剤(界面活性剤、分散剤、増粘剤等)と混合することによって、本発明の導体ペーストの作製に用いる有機ビヒクルが得られる。
Ag粉末、ガラス粉末、白金族金属添加剤、及び残部として有機ビヒクル(エチルセルロースを樹脂成分とし、エステルアルコールを溶剤成分としたもの。)を、表1に記載の含有量となるように混練し、低温焼成セラミックグリーンシート積層体上に表面導体を形成するための導体ペーストを作製した。なお、Ag粉末については、球状粉を使用し、また、実施例8を除き、平均二次粒子径の異なる2種のAg粉末を混合したものを使用した。他のペースト組成物成分との混練前のAg粉末の平均二次粒子径は日機装製レーザー回折・散乱式粒度分析計MT−3000を用いレーザー回折法で測定した。ガラス粉末の平均粒子径はAg粉末の二次粒子径と同様にレーザー回折法により測定し、その平均粒子径(D50)は0.8〜2.5μmであった。また、白金族金属添加剤として用いた酸化Ru微粉及びRh微粉のBET比表面積は共に100〜150m2/gであった。
次いで、多層セラミック基板の各層を形成する基板用グリーンシートに、それぞれスルーホールを形成する貫通孔を穿孔するとともに前記導体ペーストを充填し、さらに必要に応じてインダクタやキャパシタ等の素子を形成し、各素子を接続する導体パターン部分を設け、計13枚の基板用グリーンシートを積層した。そして、前記導体ペーストを使用して1枚のセラミックグリーンシートにスクリーン印刷法で膜厚25μmとなるように表面導体を印刷し、この基板の印刷裏面と、前記作製された積層体表面とを接するように積層して、セラミックグリーンシート積層体とした。
次いで、前記印刷後のセラミックグリーンシート積層体の印刷面に対し垂直方向の外側の両面(Z面、最外層両面)に、寸法精度を確保するための拘束焼成を行うため、アルミナを主成分とする拘束用グリーンシートを積層し拘束層を形成した。
続いて、このめっき膜上にアルミニウム製のワイヤをボンディングし、プルテスト装置PTR−1000(RHESCA社製、製品名)により、0.1mm/秒の速度でワイヤを上方へ引っ張りワイヤボンディング性の評価(ボンディング試験)を各々20回繰り返し行った。ワイヤボンディング性の評価は、破壊モードの観察により行い、多層セラミックス基板での剥離が見られずワイヤの途中が切断された正常な破壊モードを○、めっき膜と表面導体との界面で剥離した破壊モードを×−1、表面導体とセラミックス基板の界面で剥離した破壊モードを×−2とした。結果を表2に示す。前記ボンディング試験でのプル強度測定結果を図2及び図3に示す。
ガラス粉末の含有率が低い比較例3は、拘束層除去性及びめっき付け性は良好であったものの、ワイヤボンディング性については、表面導体とセラミックス基板との界面剥離が多く認められた。
ガラス粉末の含有率が高い比較例4は、拘束層除去性及びめっき付け性のいずれの評価においても良好な結果が得られず、また、ワイヤボンディング性については、めっき膜と表面導体との界面剥離が多く認められた。
これに対し、本発明の構成要素を満たす導体ペーストを用いた実施例1〜14では、拘束層除去性、めっき付け性及びワイヤボンディング性のいずれの評価においても良好な結果が得られ、また、比較例に比べてプル強度の上昇が認められた。
Claims (5)
- ペースト組成物中の含有率が60〜95質量%のAg粉末、Ag粉末の質量に対し0.5〜5質量%のホウケイ酸系ガラス粉末、残部が白金族金属添加剤及び有機ビヒクルである、低温焼成セラミックグリーンシート積層体上に印刷され拘束焼成により表面導体を形成するための導体ペーストであって、
前記白金族金属添加剤は、少なくともRu及びRhの2種の金属を含有し、該白金族金属添加剤のRu及びRhの各含有量は、前記Ag粉末の質量に対し、金属分換算で0.05〜5質量%のRu及び0.001〜0.1質量%のRhであることを特徴とする導体ペースト。 - 前記ガラス粉末は、軟化点が710〜890℃である請求項1に記載の導体ペースト。
- 前記Ag粉末が、他のペースト組成物成分との混練前において平均二次粒子径の異なる2種のAg粉末からなる請求項1又は2に記載の導体ペースト。
- 前記Ag粉末の質量に対し、20質量%以上が平均二次粒子径20〜60μmのAg粉末であり、残部が平均二次粒子径3〜10μmのAg粉末である請求項3に記載の導体ペースト。
- 請求項1〜4のいずれか1項に記載の導体ペーストが表面導体として印刷された低温焼成セラミックグリーンシート積層体を拘束焼成してなるセラミック基板。
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Application Number | Priority Date | Filing Date | Title |
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JP2012220926A JP5364833B1 (ja) | 2012-10-03 | 2012-10-03 | 導体ペースト及びそれを用いたセラミック基板 |
CN201380052100.2A CN104704932B (zh) | 2012-10-03 | 2013-10-02 | 导电膏及使用该导电膏的陶瓷基板 |
PCT/JP2013/076778 WO2014054671A1 (ja) | 2012-10-03 | 2013-10-02 | 導体ペースト及びそれを用いたセラミック基板 |
US14/433,153 US9585250B2 (en) | 2012-10-03 | 2013-10-02 | Conductive paste and ceramic substrate manufactured using the same |
KR1020157009054A KR101716992B1 (ko) | 2012-10-03 | 2013-10-02 | 도체 페이스트 및 그것을 사용한 세라믹 기판 |
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JP2012220926A JP5364833B1 (ja) | 2012-10-03 | 2012-10-03 | 導体ペースト及びそれを用いたセラミック基板 |
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JPH01232797A (ja) * | 1988-03-11 | 1989-09-18 | Narumi China Corp | セラミック多層回路基板 |
JPH04329207A (ja) * | 1991-04-30 | 1992-11-18 | Tdk Corp | 導体組成物および配線基板 |
JP2002141625A (ja) * | 2000-10-30 | 2002-05-17 | Kyocera Corp | 回路基板 |
JP2002290037A (ja) * | 2001-03-22 | 2002-10-04 | Kyocera Corp | 回路基板の製造方法 |
JP2005268132A (ja) * | 2004-03-19 | 2005-09-29 | Noritake Co Ltd | 導体ペースト |
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JP4524876B2 (ja) | 2000-07-12 | 2010-08-18 | 日立金属株式会社 | 導電性ペーストおよび多層セラミック基板 |
JP2004047856A (ja) | 2002-07-15 | 2004-02-12 | Sumitomo Metal Electronics Devices Inc | 導体ペースト及び印刷方法並びにセラミック多層回路基板の製造方法 |
JP2007194580A (ja) * | 2005-12-21 | 2007-08-02 | E I Du Pont De Nemours & Co | 太陽電池電極用ペースト |
JP2008112786A (ja) | 2006-10-30 | 2008-05-15 | Tdk Corp | 多層セラミックス基板及びその製造方法 |
JP2009289587A (ja) * | 2008-05-29 | 2009-12-10 | Kyoto Elex Kk | 導電性ペースト組成物 |
JP2011142307A (ja) | 2009-12-08 | 2011-07-21 | Panasonic Corp | 電子部品とその製造方法 |
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JPH01232797A (ja) * | 1988-03-11 | 1989-09-18 | Narumi China Corp | セラミック多層回路基板 |
JPH04329207A (ja) * | 1991-04-30 | 1992-11-18 | Tdk Corp | 導体組成物および配線基板 |
JP2002141625A (ja) * | 2000-10-30 | 2002-05-17 | Kyocera Corp | 回路基板 |
JP2002290037A (ja) * | 2001-03-22 | 2002-10-04 | Kyocera Corp | 回路基板の製造方法 |
JP2005268132A (ja) * | 2004-03-19 | 2005-09-29 | Noritake Co Ltd | 導体ペースト |
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CN104704932B (zh) | 2017-10-10 |
US9585250B2 (en) | 2017-02-28 |
KR101716992B1 (ko) | 2017-03-15 |
JP2014075403A (ja) | 2014-04-24 |
US20150282309A1 (en) | 2015-10-01 |
KR20150054935A (ko) | 2015-05-20 |
CN104704932A (zh) | 2015-06-10 |
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