TW200731293A - Conductive glue and ceramics multi-layer circuit substrate using such conductive glue - Google Patents

Conductive glue and ceramics multi-layer circuit substrate using such conductive glue

Info

Publication number
TW200731293A
TW200731293A TW095110878A TW95110878A TW200731293A TW 200731293 A TW200731293 A TW 200731293A TW 095110878 A TW095110878 A TW 095110878A TW 95110878 A TW95110878 A TW 95110878A TW 200731293 A TW200731293 A TW 200731293A
Authority
TW
Taiwan
Prior art keywords
conductive glue
circuit substrate
layer circuit
conductive
ceramics
Prior art date
Application number
TW095110878A
Other languages
English (en)
Chinese (zh)
Other versions
TWI322995B (enrdf_load_stackoverflow
Inventor
Masatoshi Suehiro
Hiroshi Ochi
Nobuo Ochiai
Kimihito Nishikawa
Hiromasa Miyoshi
Original Assignee
Kyoto Elex Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyoto Elex Co Ltd filed Critical Kyoto Elex Co Ltd
Publication of TW200731293A publication Critical patent/TW200731293A/zh
Application granted granted Critical
Publication of TWI322995B publication Critical patent/TWI322995B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Conductive Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW095110878A 2006-02-02 2006-03-29 Conductive glue and ceramics multi-layer circuit substrate using such conductive glue TW200731293A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006025826A JP4819516B2 (ja) 2006-02-02 2006-02-02 導電性ペースト及びその導電性ペーストを用いたセラミック多層回路基板

Publications (2)

Publication Number Publication Date
TW200731293A true TW200731293A (en) 2007-08-16
TWI322995B TWI322995B (enrdf_load_stackoverflow) 2010-04-01

Family

ID=38486870

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110878A TW200731293A (en) 2006-02-02 2006-03-29 Conductive glue and ceramics multi-layer circuit substrate using such conductive glue

Country Status (3)

Country Link
JP (1) JP4819516B2 (enrdf_load_stackoverflow)
KR (1) KR101118361B1 (enrdf_load_stackoverflow)
TW (1) TW200731293A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI508103B (zh) * 2008-01-17 2015-11-11 Nichia Corp A method of manufacturing a conductive material, a conductive material obtained by the method, an electronic device including the conductive material, a light-emitting device, a light-emitting device manufacturing method

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100866577B1 (ko) * 2007-09-28 2008-11-03 삼성전기주식회사 인쇄회로기판의 층간 도통방법
JP5313526B2 (ja) * 2008-03-17 2013-10-09 京都エレックス株式会社 低温焼成多層基板用導電性ペースト
KR100946589B1 (ko) * 2008-04-03 2010-03-09 엘지이노텍 주식회사 반도체 소자 제조용 접착 페이스트 조성물
JP5814204B2 (ja) * 2012-09-10 2015-11-17 京都エレックス株式会社 Ｌｅｄ用セラミックパッケージ用ペースト
JP5849036B2 (ja) * 2012-09-27 2016-01-27 富士フイルム株式会社 導電ペースト、プリント配線基板
CN118342158B (zh) * 2024-03-14 2025-04-11 广州汉源微电子封装材料有限公司 一种大面积封装互连用银焊膏及其制备方法与应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0613756A (ja) * 1992-06-25 1994-01-21 Matsushita Electric Ind Co Ltd 導体ペースト組成物
JP2001307549A (ja) 2000-04-21 2001-11-02 Furuya Kinzoku:Kk 銀ペースト及びその製造方法
JP3757211B2 (ja) * 2003-03-14 2006-03-22 富士通株式会社 配線基板及びその製造方法
JP2005293851A (ja) * 2004-03-10 2005-10-20 Toyobo Co Ltd 導電性ペースト
JP2005267900A (ja) * 2004-03-16 2005-09-29 Sumitomo Osaka Cement Co Ltd 導電性ペースト及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI508103B (zh) * 2008-01-17 2015-11-11 Nichia Corp A method of manufacturing a conductive material, a conductive material obtained by the method, an electronic device including the conductive material, a light-emitting device, a light-emitting device manufacturing method

Also Published As

Publication number Publication date
JP2007207604A (ja) 2007-08-16
KR20070079548A (ko) 2007-08-07
TWI322995B (enrdf_load_stackoverflow) 2010-04-01
JP4819516B2 (ja) 2011-11-24
KR101118361B1 (ko) 2012-03-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees