KR101109902B1 - 포토마스크의 제조 방법, 패턴 전사 방법, 포토마스크 기판용 처리 장치, 및 박막 패터닝 방법 - Google Patents
포토마스크의 제조 방법, 패턴 전사 방법, 포토마스크 기판용 처리 장치, 및 박막 패터닝 방법 Download PDFInfo
- Publication number
- KR101109902B1 KR101109902B1 KR1020100000415A KR20100000415A KR101109902B1 KR 101109902 B1 KR101109902 B1 KR 101109902B1 KR 1020100000415 A KR1020100000415 A KR 1020100000415A KR 20100000415 A KR20100000415 A KR 20100000415A KR 101109902 B1 KR101109902 B1 KR 101109902B1
- Authority
- KR
- South Korea
- Prior art keywords
- photomask
- resist
- pattern
- film
- resist film
- Prior art date
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/76—Patterning of masks by imaging
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/80—Etching
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009000565 | 2009-01-06 | ||
JPJP-P-2009-000565 | 2009-01-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100081937A KR20100081937A (ko) | 2010-07-15 |
KR101109902B1 true KR101109902B1 (ko) | 2012-01-31 |
Family
ID=42642242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020100000415A KR101109902B1 (ko) | 2009-01-06 | 2010-01-05 | 포토마스크의 제조 방법, 패턴 전사 방법, 포토마스크 기판용 처리 장치, 및 박막 패터닝 방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5305300B2 (ja) |
KR (1) | KR101109902B1 (ja) |
TW (1) | TWI438562B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5154626B2 (ja) | 2010-09-30 | 2013-02-27 | Hoya株式会社 | マスクブランク、転写用マスク、転写用マスクの製造方法、および半導体デバイスの製造方法 |
JP5738574B2 (ja) * | 2010-11-15 | 2015-06-24 | 野村マイクロ・サイエンス株式会社 | オゾン水による金属表面の改質方法 |
TWI588599B (zh) * | 2011-04-06 | 2017-06-21 | Hoya股份有限公司 | 空白光罩之表面處理方法、以及空白光罩之製造方法、以及光罩之製造方法 |
JP6089667B2 (ja) * | 2012-12-13 | 2017-03-08 | 大日本印刷株式会社 | レジスト付きフォトマスクブランクスの製造方法、および、フォトマスクの製造方法 |
JP6455979B2 (ja) * | 2014-03-18 | 2019-01-23 | Hoya株式会社 | レジスト層付ブランク、その製造方法、マスクブランクおよびインプリント用モールドブランク、ならびに転写用マスク、インプリント用モールドおよびそれらの製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002246290A (ja) * | 2001-02-16 | 2002-08-30 | Toshiba Corp | パターン形成方法 |
KR20060003150A (ko) * | 2004-07-05 | 2006-01-10 | 주식회사 에스앤에스텍 | 블랭크 마스크와 포토마스크 및 그 제조방법 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04221959A (ja) * | 1990-12-25 | 1992-08-12 | Fujitsu Ltd | レジストパターンの形成方法 |
JPH04318852A (ja) * | 1991-04-18 | 1992-11-10 | Fujitsu Ltd | レジスト・パターン形成方法 |
JP2768139B2 (ja) * | 1992-06-08 | 1998-06-25 | 松下電器産業株式会社 | 半導体装置の製造方法 |
JPH06267838A (ja) * | 1993-03-11 | 1994-09-22 | Hitachi Ltd | レジストパターンの形成方法 |
JPH09251210A (ja) * | 1996-03-15 | 1997-09-22 | Toshiba Corp | レジストパターンの形成方法 |
JP2004163698A (ja) * | 2002-11-13 | 2004-06-10 | Ricoh Co Ltd | 電子線描画方法、電子線描画方法を用いて作成した原盤をもとに製作したスタンパ用金型、およびスタンパ用金型で製作した情報記録媒体 |
JP4318209B2 (ja) * | 2004-02-09 | 2009-08-19 | Hoya株式会社 | フォトマスクブランクの製造方法及びフォトマスクの製造方法 |
JP4936878B2 (ja) * | 2006-12-25 | 2012-05-23 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JP5063138B2 (ja) * | 2007-02-23 | 2012-10-31 | 株式会社Sokudo | 基板現像方法および現像装置 |
JP2010073899A (ja) * | 2008-09-18 | 2010-04-02 | Nuflare Technology Inc | 基板処理方法および基板処理装置 |
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2009
- 2009-12-23 TW TW098144584A patent/TWI438562B/zh active
-
2010
- 2010-01-05 KR KR1020100000415A patent/KR101109902B1/ko active IP Right Grant
- 2010-01-05 JP JP2010000363A patent/JP5305300B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002246290A (ja) * | 2001-02-16 | 2002-08-30 | Toshiba Corp | パターン形成方法 |
KR20060003150A (ko) * | 2004-07-05 | 2006-01-10 | 주식회사 에스앤에스텍 | 블랭크 마스크와 포토마스크 및 그 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
JP5305300B2 (ja) | 2013-10-02 |
JP2010181872A (ja) | 2010-08-19 |
TWI438562B (zh) | 2014-05-21 |
KR20100081937A (ko) | 2010-07-15 |
TW201030454A (en) | 2010-08-16 |
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