KR101085242B1 - 실란 커플링제, 이를 포함하는 동박 및 그 표면처리방법 - Google Patents
실란 커플링제, 이를 포함하는 동박 및 그 표면처리방법 Download PDFInfo
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- KR101085242B1 KR101085242B1 KR1020100023885A KR20100023885A KR101085242B1 KR 101085242 B1 KR101085242 B1 KR 101085242B1 KR 1020100023885 A KR1020100023885 A KR 1020100023885A KR 20100023885 A KR20100023885 A KR 20100023885A KR 101085242 B1 KR101085242 B1 KR 101085242B1
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- Prior art keywords
- copper foil
- silane coupling
- coupling agent
- independently
- insulation
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 81
- 239000011889 copper foil Substances 0.000 title claims abstract description 72
- 239000006087 Silane Coupling Agent Substances 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims description 18
- -1 NH 2 Chemical class 0.000 claims abstract description 12
- 239000000126 substance Substances 0.000 claims abstract description 10
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 9
- 150000001923 cyclic compounds Chemical class 0.000 claims abstract description 6
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 6
- 150000002367 halogens Chemical class 0.000 claims abstract description 6
- 230000004888 barrier function Effects 0.000 claims description 16
- 238000004381 surface treatment Methods 0.000 claims description 15
- 239000007864 aqueous solution Substances 0.000 claims description 10
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 5
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 4
- 238000004532 chromating Methods 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 22
- 125000000524 functional group Chemical group 0.000 abstract description 8
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- FZCCGGVHDFSTJV-UHFFFAOYSA-N dimethoxysilyl(dimethoxy)silane Chemical compound CO[SiH](OC)[SiH](OC)OC FZCCGGVHDFSTJV-UHFFFAOYSA-N 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 2
- WBRWWHNHNBVQRF-UHFFFAOYSA-N NCCC[Si]([Si](OC)(OC)CCCN)(OC)OC Chemical compound NCCC[Si]([Si](OC)(OC)CCCN)(OC)OC WBRWWHNHNBVQRF-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- QAPGFRAJOQDHBK-UHFFFAOYSA-N NCCC[Si]([Si](OC)(OC)CCCN)(OC)OC.NCCC[Si]([Si](OC)(OC)CCCN)(OC)OC Chemical compound NCCC[Si]([Si](OC)(OC)CCCN)(OC)OC.NCCC[Si]([Si](OC)(OC)CCCN)(OC)OC QAPGFRAJOQDHBK-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- JPMBLOQPQSYOMC-UHFFFAOYSA-N trimethoxy(3-methoxypropyl)silane Chemical compound COCCC[Si](OC)(OC)OC JPMBLOQPQSYOMC-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
- C23C2222/20—Use of solutions containing silanes
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
[화학식]
상기 화학식에서, X 및 Y는 각각 독립적으로 NH2, SH, 할로겐, 글리시독시, 비닐 또는 N을 포함하는 고리형 화합물(cyclic compound) 또는 알콕시이고, R1 및 R2는 서로 독립적으로 CnH2n+1이고(여기서, n은 1 내지 5의 정수임), m1 및 m2는 서로 독립적으로 1 내지 20의 정수이다.
본 발명에 따르면, 동박과 절연제간의 화학적 결합력을 증가시킴으로 동일한 양의 실란 커플링제를 쓸 경우 동박과 절연제간의 밀착력을 극대화할 수 있고, 하나의 분자에 절연제와 결합할 수 있는 작용기가 2 개이므로 일액형으로 작업이 가능하여 작업 편의성이 우수한 장점이 있다.
Description
도 1은 본 발명의 일실시예에 따라 표면처리된 동박의 단면도이다.
접착강도(kgf/cm) | |
실시예 1 | 1.25 |
실시예 2 | 1.15 |
실시예 3 | 1.19 |
비교예 1 | 0.85 |
비교예 2 | 0.97 |
비교예 3 | 0.91 |
15: 실란 커플링제층
Claims (4)
- 노듈(nodule)이 형성된 동박, 상기 노듈이 형성된 동박 상에 위치하는 베리어층 및 상기 베리어층이 형성된 동박 상에 위치하는 실란 커플링제층을 포함하여 이루어지는 동박에 있어서,
상기 실란 커플링제층은 제 1항에 따르는 실란 커플링제가 적용된 것을 특징으로 하는 동박. - (S1) 동박을 거침도금처리하는 단계;
(S2) 상기 거침도금처리된 동박에 베리어 표면처리하는 단계;
(S3) 상기 베리어 표면처리된 동박에 크로메이팅(chromating) 방청처리하는 단계; 및
(S4) 상기 크로메이팅 방청처리한 동박에 실란 커플링제를 도포하는 단계;를 포함하여 진행되며,
상기 실란 커플링제는 하기 화학식 2로 표시되는 것을 특징으로 하는 동박의 표면처리방법:
[화학식 2]
상기 화학식 2에서,
X 및 Y는 각각 독립적으로 NH2, SH, 할로겐, 글리시독시, 비닐 또는 N을 포함하는 고리형 화합물(cyclic compound) 또는 알콕시이고,
R1 및 R2는 서로 독립적으로 CnH2n+1이고(여기서, n은 1 내지 5의 정수임),
m1 및 m2는 서로 독립적으로 1 내지 20의 정수이다. - 제 3항에 있어서,
상기 (S4)의 실란 커플링제의 도포 단계는, 0.05 내지 5 중량%의 농도의 수용액인 실란 커플링제를 이용하여 진행되는 것을 특징으로 하는 동박의 표면처리방법.
Priority Applications (1)
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KR1020100023885A KR101085242B1 (ko) | 2010-03-17 | 2010-03-17 | 실란 커플링제, 이를 포함하는 동박 및 그 표면처리방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100023885A KR101085242B1 (ko) | 2010-03-17 | 2010-03-17 | 실란 커플링제, 이를 포함하는 동박 및 그 표면처리방법 |
Publications (2)
Publication Number | Publication Date |
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KR20110104787A KR20110104787A (ko) | 2011-09-23 |
KR101085242B1 true KR101085242B1 (ko) | 2011-11-22 |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005038871A2 (en) | 2003-10-10 | 2005-04-28 | Advanced Technology Materials, Inc. | Monosilane or disilane derivatives and method for low temperature deposition of silicon-containing films using the same |
JP2009107981A (ja) | 2007-10-31 | 2009-05-21 | Osaka City Univ | アルコキシジシラン |
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2010
- 2010-03-17 KR KR1020100023885A patent/KR101085242B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005038871A2 (en) | 2003-10-10 | 2005-04-28 | Advanced Technology Materials, Inc. | Monosilane or disilane derivatives and method for low temperature deposition of silicon-containing films using the same |
JP2009107981A (ja) | 2007-10-31 | 2009-05-21 | Osaka City Univ | アルコキシジシラン |
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