KR101035222B1 - 점착제층 형성 투명 도전성 필름과 그 제조 방법, 투명 도전성 적층체 및 터치 패널 - Google Patents

점착제층 형성 투명 도전성 필름과 그 제조 방법, 투명 도전성 적층체 및 터치 패널 Download PDF

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KR101035222B1
KR101035222B1 KR1020090113669A KR20090113669A KR101035222B1 KR 101035222 B1 KR101035222 B1 KR 101035222B1 KR 1020090113669 A KR1020090113669 A KR 1020090113669A KR 20090113669 A KR20090113669 A KR 20090113669A KR 101035222 B1 KR101035222 B1 KR 101035222B1
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KR
South Korea
Prior art keywords
adhesive layer
transparent conductive
conductive film
base material
film
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KR1020090113669A
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English (en)
Korean (ko)
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KR20100066361A (ko
Inventor
아츠시 야스이
마사유키 사타케
Original Assignee
닛토덴코 가부시키가이샤
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Publication of KR20100066361A publication Critical patent/KR20100066361A/ko
Application granted granted Critical
Publication of KR101035222B1 publication Critical patent/KR101035222B1/ko

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/164—Drying
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/04—Treatment by energy or chemical effects using liquids, gas or steam
    • B32B2310/0445—Treatment by energy or chemical effects using liquids, gas or steam using gas or flames
    • B32B2310/0454—Hot air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1476—Release layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020090113669A 2008-12-09 2009-11-24 점착제층 형성 투명 도전성 필름과 그 제조 방법, 투명 도전성 적층체 및 터치 패널 KR101035222B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-313441 2008-12-09
JP2008313441A JP4805999B2 (ja) 2008-12-09 2008-12-09 粘着剤層付き透明導電性フィルムとその製造方法、透明導電性積層体およびタッチパネル

Publications (2)

Publication Number Publication Date
KR20100066361A KR20100066361A (ko) 2010-06-17
KR101035222B1 true KR101035222B1 (ko) 2011-05-18

Family

ID=42231399

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090113669A KR101035222B1 (ko) 2008-12-09 2009-11-24 점착제층 형성 투명 도전성 필름과 그 제조 방법, 투명 도전성 적층체 및 터치 패널

Country Status (5)

Country Link
US (1) US20100143634A1 (ja)
JP (1) JP4805999B2 (ja)
KR (1) KR101035222B1 (ja)
CN (1) CN101752025B (ja)
TW (1) TWI384050B (ja)

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* Cited by examiner, † Cited by third party
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JP2011248629A (ja) * 2010-05-27 2011-12-08 Meihan Shinku Kogyo Kk 透明導電性基材
JP5848565B2 (ja) * 2010-09-29 2016-01-27 日東電工株式会社 粘着剤層付き樹脂フィルム、積層フィルムおよびタッチパネル
JP5645581B2 (ja) * 2010-10-05 2014-12-24 富士フイルム株式会社 タッチパネル
KR101385844B1 (ko) 2010-10-20 2014-04-21 주식회사 엘지화학 터치 패널용 점착제 조성물
KR101435240B1 (ko) * 2010-10-27 2014-08-29 주식회사 엘지화학 터치 패널
JP5101719B2 (ja) 2010-11-05 2012-12-19 日東電工株式会社 透明導電性フィルム、その製造方法及びそれを備えたタッチパネル
CN102097157A (zh) * 2010-11-23 2011-06-15 苏州禾盛新型材料股份有限公司 背胶式透明导电膜
JP5529720B2 (ja) * 2010-12-15 2014-06-25 日東電工株式会社 粘着剤層付き透明導電性フィルム、その製造方法及びタッチパネル
EP2703963B1 (en) * 2011-04-29 2020-02-12 Nissha Printing Co., Ltd. Spacer-less input device
JP5844996B2 (ja) 2011-05-11 2016-01-20 日東電工株式会社 透明導電性積層体及びタッチパネル
TWI475085B (zh) * 2011-07-19 2015-03-01 Lg Chemical Ltd 觸碰面板
JP5922356B2 (ja) * 2011-09-02 2016-05-24 日東電工株式会社 粘着剤層付き透明導電性フィルム、その製造方法及びタッチパネル
JP5925447B2 (ja) * 2011-09-02 2016-05-25 日東電工株式会社 粘着剤層付き透明導電性フィルム、その製造方法及びタッチパネル
JP5893881B2 (ja) * 2011-09-26 2016-03-23 日東電工株式会社 光学フィルム用粘着剤層の製造方法、光学フィルム用粘着剤層、粘着型光学フィルムおよび画像表示装置
JP5394561B2 (ja) * 2011-12-19 2014-01-22 日東電工株式会社 透明導電フィルム用キャリアフィルム及び積層体
CN104067352B (zh) * 2012-01-31 2015-07-15 东丽薄膜先端加工股份有限公司 透明导电性膜、触摸面板及显示装置
JP6220495B2 (ja) * 2012-03-01 2017-10-25 三菱ケミカル株式会社 画像表示装置用透明両面粘着シート及びこれを用いた画像表示装置
DE102012203623A1 (de) * 2012-03-07 2013-09-12 Tesa Se Verbundsystem zur Verkapselung elektronischer Anordnungen
CN102623080A (zh) * 2012-04-16 2012-08-01 上海交通大学 基于溶液法/印刷涂布工艺的透明导电薄膜及其制备方法
JP5942725B2 (ja) * 2012-09-18 2016-06-29 デクセリアルズ株式会社 導電性シート
RU2654050C2 (ru) * 2012-12-18 2018-05-16 Лэнксесс Бутил Пте. Лтд. Прозрачный вулканизируемый пероксидом бутилкаучук
CN105659333A (zh) 2013-08-16 2016-06-08 Lg化学株式会社 导电膜及其制备方法
US20170210063A1 (en) * 2014-08-04 2017-07-27 3M Innovative Properties Company Finishing system for 3d printed components
JP6577708B2 (ja) * 2014-12-05 2019-09-18 日東電工株式会社 透明導電性フィルムおよびそれを用いたタッチセンサ
KR102393911B1 (ko) * 2015-05-27 2022-05-03 데쿠세리아루즈 가부시키가이샤 적층 박막, 및 적층 박막의 제조 방법
JP2016075914A (ja) * 2015-10-26 2016-05-12 三菱樹脂株式会社 画像表示装置用透明両面粘着シート及びこれを用いた画像表示装置

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JPH06309990A (ja) * 1993-04-20 1994-11-04 Nitto Denko Corp ペン入力用タツチパネル
JP2005306996A (ja) 2004-04-21 2005-11-04 Nitto Denko Corp フラットパネルディスプレイ用マザーガラス保護フィルムおよびその用途

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JP4169268B2 (ja) * 2002-09-13 2008-10-22 日東電工株式会社 被膜シートの製造方法、光学機能層、光学素子および画像表示装置
TW200745923A (en) * 2005-10-20 2007-12-16 Nitto Denko Corp Transparent conductive laminate body and touch panel equipped with above
JP4673344B2 (ja) * 2007-06-07 2011-04-20 日東電工株式会社 光学フィルム用粘着シートの製造方法

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JPH06309990A (ja) * 1993-04-20 1994-11-04 Nitto Denko Corp ペン入力用タツチパネル
JP2005306996A (ja) 2004-04-21 2005-11-04 Nitto Denko Corp フラットパネルディスプレイ用マザーガラス保護フィルムおよびその用途

Also Published As

Publication number Publication date
JP4805999B2 (ja) 2011-11-02
TW201028456A (en) 2010-08-01
CN101752025A (zh) 2010-06-23
TWI384050B (zh) 2013-02-01
JP2010140670A (ja) 2010-06-24
KR20100066361A (ko) 2010-06-17
US20100143634A1 (en) 2010-06-10
CN101752025B (zh) 2011-12-21

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