KR101019878B1 - 프로브 장치, 프로브 방법 및 기억 매체 - Google Patents

프로브 장치, 프로브 방법 및 기억 매체 Download PDF

Info

Publication number
KR101019878B1
KR101019878B1 KR1020080047168A KR20080047168A KR101019878B1 KR 101019878 B1 KR101019878 B1 KR 101019878B1 KR 1020080047168 A KR1020080047168 A KR 1020080047168A KR 20080047168 A KR20080047168 A KR 20080047168A KR 101019878 B1 KR101019878 B1 KR 101019878B1
Authority
KR
South Korea
Prior art keywords
probe
probe card
inspection
test head
ionizer
Prior art date
Application number
KR1020080047168A
Other languages
English (en)
Korean (ko)
Other versions
KR20090031196A (ko
Inventor
이사오 고우노
가즈키 하나와
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20090031196A publication Critical patent/KR20090031196A/ko
Application granted granted Critical
Publication of KR101019878B1 publication Critical patent/KR101019878B1/ko

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020080047168A 2007-09-21 2008-05-21 프로브 장치, 프로브 방법 및 기억 매체 KR101019878B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007245915A JP2009076776A (ja) 2007-09-21 2007-09-21 プローブ装置及びプローブ方法
JPJP-P-2007-00245915 2007-09-21

Publications (2)

Publication Number Publication Date
KR20090031196A KR20090031196A (ko) 2009-03-25
KR101019878B1 true KR101019878B1 (ko) 2011-03-04

Family

ID=40493641

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080047168A KR101019878B1 (ko) 2007-09-21 2008-05-21 프로브 장치, 프로브 방법 및 기억 매체

Country Status (4)

Country Link
JP (1) JP2009076776A (zh)
KR (1) KR101019878B1 (zh)
CN (1) CN101393251B (zh)
TW (1) TWI427295B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101968518B (zh) * 2009-07-27 2012-08-08 京元电子股份有限公司 具同心圆探针座的半导体测试设备
JP6289962B2 (ja) * 2013-07-11 2018-03-07 東京エレクトロン株式会社 プローブ装置
CN107976576A (zh) * 2016-10-24 2018-05-01 精工爱普生株式会社 电子元器件传送装置以及电子元器件检查装置
CN108885238A (zh) * 2017-01-19 2018-11-23 深圳市汇顶科技股份有限公司 一种用于矩阵排列芯片的测试装置
WO2018154941A1 (ja) * 2017-02-22 2018-08-30 新東工業株式会社 テストシステム
KR101897638B1 (ko) * 2017-08-21 2018-09-13 (주)씨온테크 반도체 소자의 전기적 특성 자동 측정용 고정밀 테스트 장치
TWI655444B (zh) * 2017-12-20 2019-04-01 亞亞科技股份有限公司 IC inspection machine with temporary fixing effect
US10698025B2 (en) * 2018-07-20 2020-06-30 Formfactor Beaverton, Inc. Probe systems and methods that utilize a flow-regulating structure for improved collection of an optical image of a device under test
WO2022269783A1 (ja) * 2021-06-23 2022-12-29 三菱電機株式会社 検査装置
CN113725131B (zh) * 2021-11-02 2022-02-08 西安奕斯伟材料科技有限公司 晶圆预处理装置及晶圆缺陷检测方法
CN114966147B (zh) * 2022-05-27 2023-12-22 江苏艾科半导体有限公司 一种芯片测试探针台保护罩

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6251280U (zh) * 1985-09-19 1987-03-30
JP2006133119A (ja) 2004-11-08 2006-05-25 Internatl Business Mach Corp <Ibm> Tftの検査装置および検査方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996029607A1 (fr) * 1995-03-18 1996-09-26 Tokyo Electron Limited Procede et appareil de controle d'un substrat
JPH0982766A (ja) * 1995-09-18 1997-03-28 Sony Corp プロービング測定装置
JP3842468B2 (ja) * 1998-12-08 2006-11-08 株式会社日本マイクロニクス プローブの清掃方法及び装置
JP2002340974A (ja) * 2001-05-17 2002-11-27 Matsushita Electric Ind Co Ltd 半導体素子の電気特性測定装置、及び半導体素子の電気特性測定方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6251280U (zh) * 1985-09-19 1987-03-30
JP2006133119A (ja) 2004-11-08 2006-05-25 Internatl Business Mach Corp <Ibm> Tftの検査装置および検査方法

Also Published As

Publication number Publication date
CN101393251B (zh) 2011-10-26
TW200914835A (en) 2009-04-01
JP2009076776A (ja) 2009-04-09
CN101393251A (zh) 2009-03-25
TWI427295B (zh) 2014-02-21
KR20090031196A (ko) 2009-03-25

Similar Documents

Publication Publication Date Title
KR101019878B1 (ko) 프로브 장치, 프로브 방법 및 기억 매체
KR100283856B1 (ko) 프로우브장치 및 프로우브카드
US5461327A (en) Probe apparatus
JP5873741B2 (ja) 半導体検査装置および半導体検査方法
KR100349386B1 (ko) 반도체 집적 회로의 검사 방법, 검사 장치 및 검사용 컨택터와, 반도체 소자의 검사 장치
US11709199B2 (en) Evaluation apparatus for semiconductor device
TWI533006B (zh) 檢查裝置及檢查方法
JP2008131047A (ja) 標本支持台と標本支持台の使用の下で検査物質を検査する方法
JP2007256277A (ja) 印刷回路板を走査検査する装置
JP6365953B1 (ja) プローバ
US11467099B2 (en) Inspection apparatus
TW202117881A (zh) 檢查裝置
JPH0737945A (ja) プローブ装置
JP4124622B2 (ja) プローバのチャック機構
JP4329087B2 (ja) 半導体デバイスの静電破壊試験方法と装置
US11977099B2 (en) Method for manufacturing semiconductor device
JP3169900B2 (ja) プローバ
KR100835467B1 (ko) 프로브 카드의 공기 세정 장치
JPH0758168A (ja) プローブ装置
KR100709796B1 (ko) 피처리체 탑재대
KR100850174B1 (ko) 반도체 소자 검사용 프로브장치 및 검사방법
JP4966564B2 (ja) 半導体素子の検査システム及び検査方法
JPH05180899A (ja) 半導体デバイスの静電破壊試験装置
JP2004335613A (ja) 接触子案内部材、プローブカード及び半導体装置試験装置、並びに半導体装置の試験方法
JPS63114228A (ja) プローブ装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E90F Notification of reason for final refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20140204

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20150130

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20160127

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20170202

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20180219

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20190218

Year of fee payment: 9

FPAY Annual fee payment

Payment date: 20200218

Year of fee payment: 10