KR101015116B1 - 하전(荷電) 입자 빔 시스템 - Google Patents
하전(荷電) 입자 빔 시스템 Download PDFInfo
- Publication number
- KR101015116B1 KR101015116B1 KR1020057004615A KR20057004615A KR101015116B1 KR 101015116 B1 KR101015116 B1 KR 101015116B1 KR 1020057004615 A KR1020057004615 A KR 1020057004615A KR 20057004615 A KR20057004615 A KR 20057004615A KR 101015116 B1 KR101015116 B1 KR 101015116B1
- Authority
- KR
- South Korea
- Prior art keywords
- gas
- detector
- charged particle
- pressure
- delete delete
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002245 particle Substances 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 claims abstract description 23
- 230000003321 amplification Effects 0.000 claims description 34
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 34
- 230000003287 optical effect Effects 0.000 claims description 7
- 150000002500 ions Chemical class 0.000 abstract description 115
- 238000007654 immersion Methods 0.000 abstract description 23
- 230000005591 charge neutralization Effects 0.000 abstract description 16
- 230000009977 dual effect Effects 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 11
- 238000000206 photolithography Methods 0.000 abstract description 10
- 230000008439 repair process Effects 0.000 abstract description 7
- 239000007789 gas Substances 0.000 description 117
- 239000011163 secondary particle Substances 0.000 description 29
- 238000010884 ion-beam technique Methods 0.000 description 24
- 238000010894 electron beam technology Methods 0.000 description 21
- 230000005684 electric field Effects 0.000 description 19
- 239000000758 substrate Substances 0.000 description 17
- 238000001514 detection method Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 15
- 238000003384 imaging method Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 12
- 239000000523 sample Substances 0.000 description 12
- 238000005530 etching Methods 0.000 description 10
- 230000005855 radiation Effects 0.000 description 10
- 230000007547 defect Effects 0.000 description 8
- 238000000151 deposition Methods 0.000 description 8
- 230000008021 deposition Effects 0.000 description 8
- 230000008901 benefit Effects 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 7
- 238000005040 ion trap Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 238000006386 neutralization reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000003472 neutralizing effect Effects 0.000 description 3
- 230000010363 phase shift Effects 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000005686 electrostatic field Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910001338 liquidmetal Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BLIQUJLAJXRXSG-UHFFFAOYSA-N 1-benzyl-3-(trifluoromethyl)pyrrolidin-1-ium-3-carboxylate Chemical compound C1C(C(=O)O)(C(F)(F)F)CCN1CC1=CC=CC=C1 BLIQUJLAJXRXSG-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- FQNHWXHRAUXLFU-UHFFFAOYSA-N carbon monoxide;tungsten Chemical group [W].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-] FQNHWXHRAUXLFU-UHFFFAOYSA-N 0.000 description 1
- 238000010523 cascade reaction Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000007737 ion beam deposition Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005405 multipole Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000004091 panning Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000004621 scanning probe microscopy Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002594 sorbent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- NXHILIPIEUBEPD-UHFFFAOYSA-H tungsten hexafluoride Chemical compound F[W](F)(F)(F)(F)F NXHILIPIEUBEPD-UHFFFAOYSA-H 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/004—Charge control of objects or beams
- H01J2237/0041—Neutralising arrangements
- H01J2237/0044—Neutralising arrangements of objects being observed or treated
- H01J2237/0045—Neutralising arrangements of objects being observed or treated using secondary electrons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/2448—Secondary particle detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/2602—Details
- H01J2237/2605—Details operating at elevated pressures, e.g. atmosphere
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Physical Vapour Deposition (AREA)
- Measurement Of Radiation (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41169902P | 2002-09-18 | 2002-09-18 | |
| US60/411,699 | 2002-09-18 | ||
| US33069102A | 2002-12-27 | 2002-12-27 | |
| US10/330,691 | 2002-12-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20050050658A KR20050050658A (ko) | 2005-05-31 |
| KR101015116B1 true KR101015116B1 (ko) | 2011-02-16 |
Family
ID=32033317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020057004615A Expired - Lifetime KR101015116B1 (ko) | 2002-09-18 | 2003-09-18 | 하전(荷電) 입자 빔 시스템 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6972412B2 (enExample) |
| EP (3) | EP1540693A4 (enExample) |
| JP (2) | JP4520303B2 (enExample) |
| KR (1) | KR101015116B1 (enExample) |
| AU (2) | AU2003276900A1 (enExample) |
| WO (2) | WO2004027808A2 (enExample) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8110814B2 (en) | 2003-10-16 | 2012-02-07 | Alis Corporation | Ion sources, systems and methods |
| US7157718B2 (en) * | 2004-04-30 | 2007-01-02 | The Regents Of The University Of Michigan | Microfabricated radiation detector assemblies methods of making and using same and interface circuit for use therewith |
| JP4519567B2 (ja) * | 2004-08-11 | 2010-08-04 | 株式会社日立ハイテクノロジーズ | 走査型電子顕微鏡およびこれを用いた試料観察方法 |
| ATE532203T1 (de) * | 2004-08-27 | 2011-11-15 | Fei Co | Lokalisierte plasmabehandlung |
| JP4636897B2 (ja) * | 2005-02-18 | 2011-02-23 | 株式会社日立ハイテクサイエンスシステムズ | 走査電子顕微鏡 |
| WO2007067296A2 (en) * | 2005-12-02 | 2007-06-14 | Alis Corporation | Ion sources, systems and methods |
| JP4911567B2 (ja) * | 2005-12-16 | 2012-04-04 | 株式会社トプコン | 荷電粒子ビーム装置 |
| JP4597077B2 (ja) * | 2006-03-14 | 2010-12-15 | 株式会社日立ハイテクノロジーズ | 走査電子顕微鏡 |
| WO2007117397A2 (en) | 2006-03-31 | 2007-10-18 | Fei Company | Improved detector for charged particle beam instrument |
| US7872236B2 (en) * | 2007-01-30 | 2011-01-18 | Hermes Microvision, Inc. | Charged particle detection devices |
| WO2008098084A1 (en) | 2007-02-06 | 2008-08-14 | Fei Company | High pressure charged particle beam system |
| JP5276860B2 (ja) * | 2008-03-13 | 2013-08-28 | 株式会社日立ハイテクノロジーズ | 走査電子顕微鏡 |
| EP2105944A1 (en) | 2008-03-28 | 2009-09-30 | FEI Company | Environmental cell for a particle-optical apparatus |
| US7791020B2 (en) * | 2008-03-31 | 2010-09-07 | Fei Company | Multistage gas cascade amplifier |
| KR100961202B1 (ko) | 2008-04-29 | 2010-06-09 | 주식회사 하이닉스반도체 | 원자진동을 이용한 불균일 이온주입장치 및 방법 |
| US8981294B2 (en) | 2008-07-03 | 2015-03-17 | B-Nano Ltd. | Scanning electron microscope, an interface and a method for observing an object within a non-vacuum environment |
| EP2175473B1 (en) * | 2008-10-08 | 2011-03-09 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Charged particle detection apparatus and detection method |
| US7947953B2 (en) * | 2008-10-08 | 2011-05-24 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Charged particle detection apparatus and detection method |
| JP4913854B2 (ja) * | 2008-10-08 | 2012-04-11 | アイシーティー インテグレーテッド サーキット テスティング ゲゼルシャフト フィーア ハルプライタープリーフテヒニック エム ベー ハー | 荷電粒子検出装置及び検出方法 |
| US7960697B2 (en) * | 2008-10-23 | 2011-06-14 | Hermes-Microvision, Inc. | Electron beam apparatus |
| US8299432B2 (en) * | 2008-11-04 | 2012-10-30 | Fei Company | Scanning transmission electron microscope using gas amplification |
| US7919760B2 (en) * | 2008-12-09 | 2011-04-05 | Hermes-Microvision, Inc. | Operation stage for wafer edge inspection and review |
| US8094924B2 (en) * | 2008-12-15 | 2012-01-10 | Hermes-Microvision, Inc. | E-beam defect review system |
| US9679741B2 (en) | 2010-11-09 | 2017-06-13 | Fei Company | Environmental cell for charged particle beam system |
| US8604427B2 (en) * | 2012-02-02 | 2013-12-10 | Applied Materials Israel, Ltd. | Three-dimensional mapping using scanning electron microscope images |
| CN104508791B (zh) * | 2012-07-30 | 2017-03-01 | Fei 公司 | 环境扫描电子显微镜气体喷射系统 |
| EP2959287A4 (en) * | 2013-02-20 | 2016-10-19 | Nano Ltd B | scanning Electron Microscope |
| US9123506B2 (en) | 2013-06-10 | 2015-09-01 | Fei Company | Electron beam-induced etching |
| US9418819B2 (en) | 2013-09-06 | 2016-08-16 | Kla-Tencor Corporation | Asymmetrical detector design and methodology |
| US9715724B2 (en) | 2014-07-29 | 2017-07-25 | Applied Materials Israel Ltd. | Registration of CAD data with SEM images |
| US9633816B2 (en) | 2015-05-18 | 2017-04-25 | Fei Company | Electron beam microscope with improved imaging gas and method of use |
| KR101693539B1 (ko) * | 2015-11-12 | 2017-01-06 | 한국표준과학연구원 | 고분해능 광-전자 융합현미경 |
| EP3249676B1 (en) | 2016-05-27 | 2018-10-03 | FEI Company | Dual-beam charged-particle microscope with in situ deposition functionality |
| KR20200013567A (ko) * | 2018-11-19 | 2020-02-07 | 부경호 | 극자외선(euv) 노광에 사용되는 마스크 및 극자외선 노광방법 |
| US11152189B2 (en) | 2020-03-18 | 2021-10-19 | Fei Company | Method and system for plasma assisted low vacuum charged-particle microscopy |
| DE102020123567B4 (de) * | 2020-09-09 | 2025-02-13 | Carl Zeiss Multisem Gmbh | Vielzahl-Teilchenstrahl-System mit Kontrast-Korrektur-Linsen-System |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04192246A (ja) * | 1990-11-26 | 1992-07-10 | Nikon Corp | 環境制御型走査電子顕微鏡 |
| WO1999039367A1 (en) | 1998-01-29 | 1999-08-05 | Fei Company | Gaseous backscattered electron detector for an environmental scanning electron microscope |
| WO2002005309A1 (de) | 2000-07-07 | 2002-01-17 | Leo Elektronenmikroskopie Gmbh | Detektor für variierende druckbereiche und elektronenmikroskop mit einem entsprechenden detektor |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4249077A (en) * | 1978-08-04 | 1981-02-03 | Crawford Charles K | Ion charge neutralization for electron beam devices |
| US4639301B2 (en) | 1985-04-24 | 1999-05-04 | Micrion Corp | Focused ion beam processing |
| EP0275306B1 (en) * | 1986-08-01 | 1990-10-24 | Electro-Scan Corporation | Multipurpose gaseous detector device for electron microscopes |
| US4785182A (en) | 1987-05-21 | 1988-11-15 | Electroscan Corporation | Secondary electron detector for use in a gaseous atmosphere |
| JPH05174768A (ja) | 1991-02-26 | 1993-07-13 | Nikon Corp | 環境制御型走査電子顕微鏡 |
| JP3148353B2 (ja) * | 1991-05-30 | 2001-03-19 | ケーエルエー・インストルメンツ・コーポレーション | 電子ビーム検査方法とそのシステム |
| JPH0547331A (ja) * | 1991-08-20 | 1993-02-26 | Nikon Corp | 走査電子顕微鏡 |
| JP2919170B2 (ja) * | 1992-03-19 | 1999-07-12 | 株式会社日立製作所 | 走査電子顕微鏡 |
| US5184525A (en) * | 1992-04-15 | 1993-02-09 | The Perkin-Elmer Corporation | Mechanism for positioning a carrier |
| JPH0594941U (ja) * | 1992-05-27 | 1993-12-24 | 日新電機株式会社 | E×b回転照射装置 |
| JP3730263B2 (ja) * | 1992-05-27 | 2005-12-21 | ケーエルエー・インストルメンツ・コーポレーション | 荷電粒子ビームを用いた自動基板検査の装置及び方法 |
| US5396067A (en) * | 1992-06-11 | 1995-03-07 | Nikon Corporation | Scan type electron microscope |
| JPH0660841A (ja) * | 1992-06-11 | 1994-03-04 | Nikon Corp | 走査型電子顕微鏡 |
| JPH06168695A (ja) * | 1992-11-30 | 1994-06-14 | Nikon Corp | 荷電粒子顕微鏡 |
| US6172363B1 (en) * | 1996-03-05 | 2001-01-09 | Hitachi, Ltd. | Method and apparatus for inspecting integrated circuit pattern |
| JP3559678B2 (ja) * | 1997-04-09 | 2004-09-02 | 株式会社日立製作所 | 電位測定方法及びその装置並びに導通検査方法及びその装置 |
| WO1999005506A1 (fr) * | 1997-07-22 | 1999-02-04 | Hitachi, Ltd. | Procede et dispositif de preparation d'echantillons |
| AU748781B2 (en) * | 1997-12-08 | 2002-06-13 | Fei Company | Environmental SEM with a magnetic field for improved secondary electron detection |
| EP0958590B1 (en) | 1997-12-08 | 2003-06-11 | Fei Company | Environmental sem with multipole fields for improved secondary electron detection |
| US6525317B1 (en) | 1998-12-30 | 2003-02-25 | Micron Technology Inc. | Reduction of charging effect and carbon deposition caused by electron beam devices |
| JP2001155675A (ja) * | 1999-11-25 | 2001-06-08 | Hitachi Ltd | 走査電子顕微鏡等の低真空二次電子検出装置 |
| JP5005866B2 (ja) * | 1999-11-29 | 2012-08-22 | カール・ツァイス・エヌティーエス・ゲーエムベーハー | 可変の圧力を有する走査電子顕微鏡用の検出器および該検出器を有する走査電子顕微鏡 |
| JP2002289129A (ja) * | 2001-03-26 | 2002-10-04 | Jeol Ltd | 低真空走査電子顕微鏡 |
-
2003
- 2003-09-18 KR KR1020057004615A patent/KR101015116B1/ko not_active Expired - Lifetime
- 2003-09-18 WO PCT/US2003/029446 patent/WO2004027808A2/en not_active Ceased
- 2003-09-18 WO PCT/US2003/029447 patent/WO2004027809A2/en not_active Ceased
- 2003-09-18 EP EP03797915A patent/EP1540693A4/en not_active Withdrawn
- 2003-09-18 JP JP2004538208A patent/JP4520303B2/ja not_active Expired - Lifetime
- 2003-09-18 AU AU2003276900A patent/AU2003276900A1/en not_active Abandoned
- 2003-09-18 US US10/664,796 patent/US6972412B2/en not_active Expired - Lifetime
- 2003-09-18 AU AU2003275028A patent/AU2003275028A1/en not_active Abandoned
- 2003-09-18 EP EP11172096.7A patent/EP2372743B1/en not_active Expired - Lifetime
- 2003-09-18 JP JP2004538207A patent/JP4616938B2/ja not_active Expired - Lifetime
- 2003-09-18 EP EP03759297.9A patent/EP1540692B1/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04192246A (ja) * | 1990-11-26 | 1992-07-10 | Nikon Corp | 環境制御型走査電子顕微鏡 |
| WO1999039367A1 (en) | 1998-01-29 | 1999-08-05 | Fei Company | Gaseous backscattered electron detector for an environmental scanning electron microscope |
| WO2002005309A1 (de) | 2000-07-07 | 2002-01-17 | Leo Elektronenmikroskopie Gmbh | Detektor für variierende druckbereiche und elektronenmikroskop mit einem entsprechenden detektor |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2003275028A8 (en) | 2004-04-08 |
| KR20050050658A (ko) | 2005-05-31 |
| JP2005539360A (ja) | 2005-12-22 |
| EP1540693A2 (en) | 2005-06-15 |
| EP1540693A4 (en) | 2010-06-09 |
| US6972412B2 (en) | 2005-12-06 |
| EP1540692A2 (en) | 2005-06-15 |
| WO2004027809A2 (en) | 2004-04-01 |
| US20040124356A1 (en) | 2004-07-01 |
| WO2004027808A2 (en) | 2004-04-01 |
| JP4520303B2 (ja) | 2010-08-04 |
| AU2003276900A8 (en) | 2004-04-08 |
| AU2003275028A1 (en) | 2004-04-08 |
| AU2003276900A1 (en) | 2004-04-08 |
| EP1540692B1 (en) | 2013-11-06 |
| WO2004027808A3 (en) | 2004-07-08 |
| WO2004027809A3 (en) | 2004-07-29 |
| EP2372743A3 (en) | 2014-05-14 |
| EP2372743A2 (en) | 2011-10-05 |
| EP2372743B1 (en) | 2016-03-23 |
| EP1540692A4 (en) | 2009-04-22 |
| JP4616938B2 (ja) | 2011-01-19 |
| JP2005539359A (ja) | 2005-12-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101015116B1 (ko) | 하전(荷電) 입자 빔 시스템 | |
| JP5586118B2 (ja) | 荷電粒子ビームシステムの操作方法 | |
| JP5498955B2 (ja) | 試料を分析及び/又は加工するための装置及び方法 | |
| US7598499B2 (en) | Charged-particle exposure apparatus | |
| US7589328B2 (en) | Gas field ION source for multiple applications | |
| EP1501115B1 (en) | Dual beam system | |
| US10840054B2 (en) | Charged-particle source and method for cleaning a charged-particle source using back-sputtering | |
| US20110163068A1 (en) | Multibeam System | |
| JP2009544120A (ja) | マルチソース型のプラズマ集束イオン・ビーム・システム | |
| EP3518268B1 (en) | Charged-particle source and method for cleaning a charged-particle source using back-sputtering | |
| JP2005174591A (ja) | 荷電粒子線装置および荷電粒子線像生成方法 | |
| US11830705B2 (en) | Plasma flood gun for charged particle apparatus | |
| US8987692B2 (en) | High brightness electron gun, system using the same, and method of operating thereof | |
| JP2007035642A (ja) | 電界エミッタの放出面を清掃する電界エミッタ配置及び方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20050317 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20080829 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20100222 Patent event code: PE09021S01D |
|
| AMND | Amendment | ||
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20100909 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20100222 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
| AMND | Amendment | ||
| J201 | Request for trial against refusal decision | ||
| PJ0201 | Trial against decision of rejection |
Patent event date: 20101008 Comment text: Request for Trial against Decision on Refusal Patent event code: PJ02012R01D Patent event date: 20100909 Comment text: Decision to Refuse Application Patent event code: PJ02011S01I Appeal kind category: Appeal against decision to decline refusal Decision date: 20101112 Appeal identifier: 2010101007854 Request date: 20101008 |
|
| PB0901 | Examination by re-examination before a trial |
Comment text: Amendment to Specification, etc. Patent event date: 20101008 Patent event code: PB09011R02I Comment text: Request for Trial against Decision on Refusal Patent event date: 20101008 Patent event code: PB09011R01I Comment text: Amendment to Specification, etc. Patent event date: 20100524 Patent event code: PB09011R02I |
|
| B701 | Decision to grant | ||
| PB0701 | Decision of registration after re-examination before a trial |
Patent event date: 20101112 Comment text: Decision to Grant Registration Patent event code: PB07012S01D Patent event date: 20101109 Comment text: Transfer of Trial File for Re-examination before a Trial Patent event code: PB07011S01I |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20110209 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20110210 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| FPAY | Annual fee payment |
Payment date: 20140127 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20140127 Start annual number: 4 End annual number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20150127 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20150127 Start annual number: 5 End annual number: 5 |
|
| FPAY | Annual fee payment |
Payment date: 20160125 Year of fee payment: 6 |
|
| PR1001 | Payment of annual fee |
Payment date: 20160125 Start annual number: 6 End annual number: 6 |
|
| FPAY | Annual fee payment |
Payment date: 20180118 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
Payment date: 20180118 Start annual number: 8 End annual number: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20190116 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
Payment date: 20190116 Start annual number: 9 End annual number: 9 |
|
| FPAY | Annual fee payment |
Payment date: 20200115 Year of fee payment: 10 |
|
| PR1001 | Payment of annual fee |
Payment date: 20200115 Start annual number: 10 End annual number: 10 |
|
| PR1001 | Payment of annual fee |
Payment date: 20210115 Start annual number: 11 End annual number: 11 |
|
| PR1001 | Payment of annual fee |
Payment date: 20230209 Start annual number: 13 End annual number: 13 |
|
| PC1801 | Expiration of term |
Termination date: 20240318 Termination category: Expiration of duration |