KR101004830B1 - 정밀 구조 인터페이스를 갖는 전기 주조 접착 적층식 공구가공면 - Google Patents

정밀 구조 인터페이스를 갖는 전기 주조 접착 적층식 공구가공면 Download PDF

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Publication number
KR101004830B1
KR101004830B1 KR1020057011930A KR20057011930A KR101004830B1 KR 101004830 B1 KR101004830 B1 KR 101004830B1 KR 1020057011930 A KR1020057011930 A KR 1020057011930A KR 20057011930 A KR20057011930 A KR 20057011930A KR 101004830 B1 KR101004830 B1 KR 101004830B1
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South Korea
Prior art keywords
delete delete
mold
insert
stamper
adhesive
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Expired - Fee Related
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KR1020057011930A
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English (en)
Korean (ko)
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KR20050088327A (ko
Inventor
로버트 더블유. 페터슨
브레인 더블유. 루에크
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20050088327A publication Critical patent/KR20050088327A/ko
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Publication of KR101004830B1 publication Critical patent/KR101004830B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C45/2632—Stampers; Mountings thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D17/00—Producing carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records; Producing record discs from master stencils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C45/2632—Stampers; Mountings thereof
    • B29C2045/2634—Stampers; Mountings thereof mounting layers between stamper and mould or on the rear surface of the stamper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/11—Magnetic recording head

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
KR1020057011930A 2002-12-26 2003-11-12 정밀 구조 인터페이스를 갖는 전기 주조 접착 적층식 공구가공면 Expired - Fee Related KR101004830B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/329,837 US6939123B2 (en) 2002-12-26 2002-12-26 Electroformed adhesive laminated tooling surface with precision structured interfaces
US10/329,837 2002-12-26

Publications (2)

Publication Number Publication Date
KR20050088327A KR20050088327A (ko) 2005-09-05
KR101004830B1 true KR101004830B1 (ko) 2010-12-28

Family

ID=32654367

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057011930A Expired - Fee Related KR101004830B1 (ko) 2002-12-26 2003-11-12 정밀 구조 인터페이스를 갖는 전기 주조 접착 적층식 공구가공면

Country Status (9)

Country Link
US (1) US6939123B2 (enExample)
EP (1) EP1578582B1 (enExample)
JP (1) JP4607599B2 (enExample)
KR (1) KR101004830B1 (enExample)
AT (1) ATE537955T1 (enExample)
AU (1) AU2003287711A1 (enExample)
BR (1) BR0317670A (enExample)
MX (1) MXPA05006667A (enExample)
WO (1) WO2004060632A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100442874B1 (ko) * 2002-03-25 2004-08-02 삼성전자주식회사 하드 디스크 드라이브의 액츄에이터
DE10328046A1 (de) * 2003-06-23 2005-01-13 Arvinmeritor Gmbh Verfahren zum Herstellen eines Kunststoffverbundbauteils, insbesondere eines Karosserieanbauteils
US7121155B2 (en) * 2004-12-29 2006-10-17 3M Innovative Properties Company Pressure indicating structure
KR100807186B1 (ko) * 2005-11-29 2008-02-28 전자부품연구원 도광판 사출성형용 일체형 스템퍼 금형 제조 방법
JP2007168205A (ja) * 2005-12-21 2007-07-05 Toshin Seiko:Kk 金型及びブロックの製造方法
US8403659B2 (en) * 2006-08-02 2013-03-26 Robert E. Szokolay Mold tooling with integrated thermal management fluid channels and method
ES2579228T3 (es) * 2008-07-25 2016-08-08 Sika Technology Ag Capas de espuma o adhesivo interconectadas
PL2248615T3 (pl) * 2009-05-05 2014-04-30 Meissner Formentechnologie Gmbh Utrzymujące stałą temperaturę narzędzie i jego zastosowanie
KR20120115617A (ko) 2011-04-11 2012-10-19 삼성디스플레이 주식회사 스템퍼 및 이의 제조 방법
CN107987483B (zh) * 2017-12-26 2020-11-03 天津康普斯特科技发展有限公司 一种快速制造注塑模具的方法
CN110000528B (zh) * 2019-04-22 2020-04-28 浙江靓鸿新材料有限公司 一种反光膜的光固化微棱镜的制作模具的制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10315273A (ja) 1997-05-15 1998-12-02 Sony Corp ディスク用基板の製造装置及びそれに用いるスタンパ

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285901A (en) * 1978-07-06 1981-08-25 Akira Yotsutsuji Method of making an insulated metal mold
JPS58185049A (ja) 1982-04-22 1983-10-28 Hitachi Ltd スタンパとその製造方法
JPS60149422A (ja) 1984-01-18 1985-08-06 Matsushita Electric Ind Co Ltd デイジタル信号記録再生デイスクの製造方法
JPS62167639A (ja) * 1985-09-13 1987-07-24 Fujitsu Ltd 光デイスク転写型の製造方法
JPH0268744A (ja) 1988-09-05 1990-03-08 Sumitomo Bakelite Co Ltd スタンパの裏打ち方法
JPH0322230A (ja) * 1989-06-20 1991-01-30 Nikka Eng Kk スタンパおよびその製造方法
EP0412891B1 (en) * 1989-08-07 1996-07-17 Nissan Motor Co., Ltd. Metal-powder filled epoxy resin mold and method of producing the same
JPH04131211A (ja) 1990-09-21 1992-05-01 Toshiba Mach Co Ltd プラスチックレンズの製造方法および製造用型
JP3006199B2 (ja) * 1991-09-03 2000-02-07 株式会社日立製作所 光ディスクの製造方法
JPH05200755A (ja) * 1992-01-24 1993-08-10 Olympus Optical Co Ltd 電鋳型の製作方法
US5702735A (en) 1994-06-10 1997-12-30 Johnson & Johnson Vision Products, Inc. Molding arrangement to achieve short mold cycle time
JPH09300359A (ja) 1996-05-08 1997-11-25 Kojima Press Co Ltd 急加熱用金型及びその製造方法
US6354827B1 (en) * 1998-11-12 2002-03-12 Imation Corp. Stamper assembly for manufacturing optical data storage disks
JP3104699B1 (ja) * 1999-06-01 2000-10-30 株式会社ニコン 細溝付き成形基板の製造方法
DE19933530C5 (de) 1999-07-16 2014-04-17 Bayerische Motoren Werke Aktiengesellschaft Spritzgießwerkzeug zur Herstellung von Kunststoff-Formteilen
DE50001604D1 (de) * 2000-01-27 2003-05-08 Awm Mold Tech Ag Muri Spritzgusswerkzeug für die Herstellung von scheibenförmigen Informationsträgern

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10315273A (ja) 1997-05-15 1998-12-02 Sony Corp ディスク用基板の製造装置及びそれに用いるスタンパ

Also Published As

Publication number Publication date
BR0317670A (pt) 2005-11-29
EP1578582B1 (en) 2011-12-21
KR20050088327A (ko) 2005-09-05
ATE537955T1 (de) 2012-01-15
AU2003287711A1 (en) 2004-07-29
MXPA05006667A (es) 2005-09-30
WO2004060632A1 (en) 2004-07-22
EP1578582A1 (en) 2005-09-28
JP4607599B2 (ja) 2011-01-05
JP2006512231A (ja) 2006-04-13
US6939123B2 (en) 2005-09-06
US20040126455A1 (en) 2004-07-01

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