JP4607599B2 - 精密な構造化界面を備えた電鋳接着剤ラミネート工具表面 - Google Patents

精密な構造化界面を備えた電鋳接着剤ラミネート工具表面 Download PDF

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Publication number
JP4607599B2
JP4607599B2 JP2004564972A JP2004564972A JP4607599B2 JP 4607599 B2 JP4607599 B2 JP 4607599B2 JP 2004564972 A JP2004564972 A JP 2004564972A JP 2004564972 A JP2004564972 A JP 2004564972A JP 4607599 B2 JP4607599 B2 JP 4607599B2
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JP
Japan
Prior art keywords
mold
protrusions
backing
adhesive
stamper
Prior art date
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Expired - Fee Related
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JP2004564972A
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English (en)
Japanese (ja)
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JP2006512231A5 (enExample
JP2006512231A (ja
Inventor
ダブリュ． ピーターソン，ロバート
ダブリュ． ルエック，ブライアン
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
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Publication of JP2006512231A5 publication Critical patent/JP2006512231A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C45/2632—Stampers; Mountings thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D17/00—Producing carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records; Producing record discs from master stencils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C45/2632—Stampers; Mountings thereof
    • B29C2045/2634—Stampers; Mountings thereof mounting layers between stamper and mould or on the rear surface of the stamper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/11—Magnetic recording head

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
JP2004564972A 2002-12-26 2003-11-12 精密な構造化界面を備えた電鋳接着剤ラミネート工具表面 Expired - Fee Related JP4607599B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/329,837 US6939123B2 (en) 2002-12-26 2002-12-26 Electroformed adhesive laminated tooling surface with precision structured interfaces
PCT/US2003/036098 WO2004060632A1 (en) 2002-12-26 2003-11-12 Electroformed adhesive laminated tooling surface with precision structured interfaces

Publications (3)

Publication Number Publication Date
JP2006512231A JP2006512231A (ja) 2006-04-13
JP2006512231A5 JP2006512231A5 (enExample) 2006-12-28
JP4607599B2 true JP4607599B2 (ja) 2011-01-05

Family

ID=32654367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004564972A Expired - Fee Related JP4607599B2 (ja) 2002-12-26 2003-11-12 精密な構造化界面を備えた電鋳接着剤ラミネート工具表面

Country Status (9)

Country Link
US (1) US6939123B2 (enExample)
EP (1) EP1578582B1 (enExample)
JP (1) JP4607599B2 (enExample)
KR (1) KR101004830B1 (enExample)
AT (1) ATE537955T1 (enExample)
AU (1) AU2003287711A1 (enExample)
BR (1) BR0317670A (enExample)
MX (1) MXPA05006667A (enExample)
WO (1) WO2004060632A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100442874B1 (ko) * 2002-03-25 2004-08-02 삼성전자주식회사 하드 디스크 드라이브의 액츄에이터
DE10328046A1 (de) * 2003-06-23 2005-01-13 Arvinmeritor Gmbh Verfahren zum Herstellen eines Kunststoffverbundbauteils, insbesondere eines Karosserieanbauteils
US7121155B2 (en) * 2004-12-29 2006-10-17 3M Innovative Properties Company Pressure indicating structure
KR100807186B1 (ko) * 2005-11-29 2008-02-28 전자부품연구원 도광판 사출성형용 일체형 스템퍼 금형 제조 방법
JP2007168205A (ja) * 2005-12-21 2007-07-05 Toshin Seiko:Kk 金型及びブロックの製造方法
US8403659B2 (en) * 2006-08-02 2013-03-26 Robert E. Szokolay Mold tooling with integrated thermal management fluid channels and method
ES2579228T3 (es) * 2008-07-25 2016-08-08 Sika Technology Ag Capas de espuma o adhesivo interconectadas
PL2248615T3 (pl) * 2009-05-05 2014-04-30 Meissner Formentechnologie Gmbh Utrzymujące stałą temperaturę narzędzie i jego zastosowanie
KR20120115617A (ko) 2011-04-11 2012-10-19 삼성디스플레이 주식회사 스템퍼 및 이의 제조 방법
CN107987483B (zh) * 2017-12-26 2020-11-03 天津康普斯特科技发展有限公司 一种快速制造注塑模具的方法
CN110000528B (zh) * 2019-04-22 2020-04-28 浙江靓鸿新材料有限公司 一种反光膜的光固化微棱镜的制作模具的制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285901A (en) * 1978-07-06 1981-08-25 Akira Yotsutsuji Method of making an insulated metal mold
JPS58185049A (ja) 1982-04-22 1983-10-28 Hitachi Ltd スタンパとその製造方法
JPS60149422A (ja) 1984-01-18 1985-08-06 Matsushita Electric Ind Co Ltd デイジタル信号記録再生デイスクの製造方法
JPS62167639A (ja) * 1985-09-13 1987-07-24 Fujitsu Ltd 光デイスク転写型の製造方法
JPH0268744A (ja) 1988-09-05 1990-03-08 Sumitomo Bakelite Co Ltd スタンパの裏打ち方法
JPH0322230A (ja) * 1989-06-20 1991-01-30 Nikka Eng Kk スタンパおよびその製造方法
EP0412891B1 (en) * 1989-08-07 1996-07-17 Nissan Motor Co., Ltd. Metal-powder filled epoxy resin mold and method of producing the same
JPH04131211A (ja) 1990-09-21 1992-05-01 Toshiba Mach Co Ltd プラスチックレンズの製造方法および製造用型
JP3006199B2 (ja) * 1991-09-03 2000-02-07 株式会社日立製作所 光ディスクの製造方法
JPH05200755A (ja) * 1992-01-24 1993-08-10 Olympus Optical Co Ltd 電鋳型の製作方法
US5702735A (en) 1994-06-10 1997-12-30 Johnson & Johnson Vision Products, Inc. Molding arrangement to achieve short mold cycle time
JPH09300359A (ja) 1996-05-08 1997-11-25 Kojima Press Co Ltd 急加熱用金型及びその製造方法
JPH10315273A (ja) 1997-05-15 1998-12-02 Sony Corp ディスク用基板の製造装置及びそれに用いるスタンパ
US6354827B1 (en) * 1998-11-12 2002-03-12 Imation Corp. Stamper assembly for manufacturing optical data storage disks
JP3104699B1 (ja) * 1999-06-01 2000-10-30 株式会社ニコン 細溝付き成形基板の製造方法
DE19933530C5 (de) 1999-07-16 2014-04-17 Bayerische Motoren Werke Aktiengesellschaft Spritzgießwerkzeug zur Herstellung von Kunststoff-Formteilen
DE50001604D1 (de) * 2000-01-27 2003-05-08 Awm Mold Tech Ag Muri Spritzgusswerkzeug für die Herstellung von scheibenförmigen Informationsträgern

Also Published As

Publication number Publication date
BR0317670A (pt) 2005-11-29
EP1578582B1 (en) 2011-12-21
KR20050088327A (ko) 2005-09-05
ATE537955T1 (de) 2012-01-15
AU2003287711A1 (en) 2004-07-29
MXPA05006667A (es) 2005-09-30
WO2004060632A1 (en) 2004-07-22
EP1578582A1 (en) 2005-09-28
KR101004830B1 (ko) 2010-12-28
JP2006512231A (ja) 2006-04-13
US6939123B2 (en) 2005-09-06
US20040126455A1 (en) 2004-07-01

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