KR100985141B1 - 도전성 페이스트 조성물 및 프린트 배선판 - Google Patents
도전성 페이스트 조성물 및 프린트 배선판 Download PDFInfo
- Publication number
- KR100985141B1 KR100985141B1 KR1020077025032A KR20077025032A KR100985141B1 KR 100985141 B1 KR100985141 B1 KR 100985141B1 KR 1020077025032 A KR1020077025032 A KR 1020077025032A KR 20077025032 A KR20077025032 A KR 20077025032A KR 100985141 B1 KR100985141 B1 KR 100985141B1
- Authority
- KR
- South Korea
- Prior art keywords
- conductive paste
- paste composition
- resin
- printed wiring
- electrically conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005104034A JP4841160B2 (ja) | 2005-03-31 | 2005-03-31 | 導電性ペースト組成物およびプリント配線板 |
| JP2005103872A JP4841157B2 (ja) | 2005-03-31 | 2005-03-31 | 導電性ペースト組成物およびプリント配線板 |
| JPJP-P-2005-00103872 | 2005-03-31 | ||
| JPJP-P-2005-00103996 | 2005-03-31 | ||
| JP2005103996A JP4841159B2 (ja) | 2005-03-31 | 2005-03-31 | 導電性ペースト組成物およびプリント配線板 |
| JPJP-P-2005-00104034 | 2005-03-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20070116674A KR20070116674A (ko) | 2007-12-10 |
| KR100985141B1 true KR100985141B1 (ko) | 2010-10-05 |
Family
ID=37073406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077025032A Expired - Fee Related KR100985141B1 (ko) | 2005-03-31 | 2006-03-30 | 도전성 페이스트 조성물 및 프린트 배선판 |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100985141B1 (enExample) |
| TW (1) | TW200703372A (enExample) |
| WO (1) | WO2006106850A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6705046B1 (ja) * | 2019-12-12 | 2020-06-03 | 株式会社ノリタケカンパニーリミテド | 低温成形用導電性組成物および導電膜付き基板 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001264954A (ja) | 2000-03-22 | 2001-09-28 | Konica Corp | 熱現像感光材料の処理方法及び処理装置 |
| JP2003077337A (ja) | 2001-09-04 | 2003-03-14 | Mitsui Chemicals Inc | 導電性ペースト組成物及びプリント配線板 |
| JP2005166502A (ja) | 2003-11-11 | 2005-06-23 | Toppan Forms Co Ltd | 導電性ペースト、導電機能部材、印刷回路部材 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3726627B2 (ja) * | 2000-03-15 | 2005-12-14 | 株式会社村田製作所 | 感光性導体ペーストならびに電子部品、電子装置 |
-
2006
- 2006-03-30 KR KR1020077025032A patent/KR100985141B1/ko not_active Expired - Fee Related
- 2006-03-30 WO PCT/JP2006/306710 patent/WO2006106850A1/ja not_active Ceased
- 2006-03-31 TW TW095111580A patent/TW200703372A/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001264954A (ja) | 2000-03-22 | 2001-09-28 | Konica Corp | 熱現像感光材料の処理方法及び処理装置 |
| JP2003077337A (ja) | 2001-09-04 | 2003-03-14 | Mitsui Chemicals Inc | 導電性ペースト組成物及びプリント配線板 |
| JP2005166502A (ja) | 2003-11-11 | 2005-06-23 | Toppan Forms Co Ltd | 導電性ペースト、導電機能部材、印刷回路部材 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070116674A (ko) | 2007-12-10 |
| TWI375965B (enExample) | 2012-11-01 |
| WO2006106850A1 (ja) | 2006-10-12 |
| TW200703372A (en) | 2007-01-16 |
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| Publication | Publication Date | Title |
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| JP2012164696A (ja) | バンプ形成用導電性ペースト |
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