TW200703372A - Conductive paste composition and printed wiring board - Google Patents

Conductive paste composition and printed wiring board

Info

Publication number
TW200703372A
TW200703372A TW095111580A TW95111580A TW200703372A TW 200703372 A TW200703372 A TW 200703372A TW 095111580 A TW095111580 A TW 095111580A TW 95111580 A TW95111580 A TW 95111580A TW 200703372 A TW200703372 A TW 200703372A
Authority
TW
Taiwan
Prior art keywords
conductive paste
paste composition
wiring board
printed wiring
disclosed
Prior art date
Application number
TW095111580A
Other languages
English (en)
Chinese (zh)
Other versions
TWI375965B (enExample
Inventor
Tsutomu Uchimi
Masayuki Nagashima
Hiroyuki Shirogane
Masayuki Mori
Naomi Usuki
Original Assignee
Dainippon Printing Co Ltd
Inctec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005104034A external-priority patent/JP4841160B2/ja
Priority claimed from JP2005103872A external-priority patent/JP4841157B2/ja
Priority claimed from JP2005103996A external-priority patent/JP4841159B2/ja
Application filed by Dainippon Printing Co Ltd, Inctec Inc filed Critical Dainippon Printing Co Ltd
Publication of TW200703372A publication Critical patent/TW200703372A/zh
Application granted granted Critical
Publication of TWI375965B publication Critical patent/TWI375965B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW095111580A 2005-03-31 2006-03-31 Conductive paste composition and printed wiring board TW200703372A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005104034A JP4841160B2 (ja) 2005-03-31 2005-03-31 導電性ペースト組成物およびプリント配線板
JP2005103872A JP4841157B2 (ja) 2005-03-31 2005-03-31 導電性ペースト組成物およびプリント配線板
JP2005103996A JP4841159B2 (ja) 2005-03-31 2005-03-31 導電性ペースト組成物およびプリント配線板

Publications (2)

Publication Number Publication Date
TW200703372A true TW200703372A (en) 2007-01-16
TWI375965B TWI375965B (enExample) 2012-11-01

Family

ID=37073406

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095111580A TW200703372A (en) 2005-03-31 2006-03-31 Conductive paste composition and printed wiring board

Country Status (3)

Country Link
KR (1) KR100985141B1 (enExample)
TW (1) TW200703372A (enExample)
WO (1) WO2006106850A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6705046B1 (ja) * 2019-12-12 2020-06-03 株式会社ノリタケカンパニーリミテド 低温成形用導電性組成物および導電膜付き基板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3726627B2 (ja) * 2000-03-15 2005-12-14 株式会社村田製作所 感光性導体ペーストならびに電子部品、電子装置
JP2001264954A (ja) 2000-03-22 2001-09-28 Konica Corp 熱現像感光材料の処理方法及び処理装置
JP4365053B2 (ja) 2001-09-04 2009-11-18 大日本印刷株式会社 導電性ペースト組成物及びプリント配線板
JP4493995B2 (ja) 2003-11-11 2010-06-30 トッパン・フォームズ株式会社 導電性ペースト、導電機能部材、印刷回路部材

Also Published As

Publication number Publication date
KR20070116674A (ko) 2007-12-10
TWI375965B (enExample) 2012-11-01
WO2006106850A1 (ja) 2006-10-12
KR100985141B1 (ko) 2010-10-05

Similar Documents

Publication Publication Date Title
GB2453083A (en) Printed circuit boards
WO2010144792A9 (en) Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith
PH12015500087B1 (en) Halo-hydrocarbon polymer coating
TW200745260A (en) Thermosetting resin composition and uses thereof
WO2008108970A3 (en) Chips having rear contacts connected by through vias to front contacts
MY155964A (en) Photosensitive resin composition, cured product thereof, and printed wiring board
WO2010034597A3 (de) Ankergruppe für monolagen organischer verbindungen auf metall und damit hergestelltes bauelement auf basis organischer elektronik
MY160024A (en) Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these
MY176799A (en) Photosensitive resin element
MY169238A (en) Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board
WO2009038166A1 (ja) エポキシ樹脂組成物
IN2014CN01630A (enExample)
TW200641034A (en) Composition
TW200733824A (en) Wiring circuit board
WO2008111309A1 (ja) 認識マークおよび回路基板の製造方法
KR102082863B1 (ko) 유리패널 입체패턴용 실크스크린 잉크 조성물 및 이를 이용한 입체패턴을 갖는 가전제품 전면패널의 제조방법
WO2009074303A8 (en) Solid powder formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards
WO2009037833A1 (ja) 立体プリント配線板およびその製造方法ならびに電子部品モジュール
TW200718317A (en) Method of forming solder mask and circuit board with solder mask
TW200703372A (en) Conductive paste composition and printed wiring board
TW200710165A (en) Reactive monomer and resin composition including them
RU2013112934A (ru) Печатная плата, содержащая, по меньшей мере, один керамический компонент
TW200701259A (en) Conductive paste composition and printed wiring board
TW200746935A (en) Heat-radiating insulating resin composition and printed wiring board using the same
TW200738840A (en) Polyimide resin composition and metal polyimide laminate

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees