KR100962906B1 - 낮은-ｋ 상호접속 구조물을 위한 컴플라이언트패시베이트된 엣지 씰 - Google Patents

낮은-ｋ 상호접속 구조물을 위한 컴플라이언트패시베이트된 엣지 씰 Download PDF

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KR100962906B1
KR100962906B1 KR1020067013489A KR20067013489A KR100962906B1 KR 100962906 B1 KR100962906 B1 KR 100962906B1 KR 1020067013489 A KR1020067013489 A KR 1020067013489A KR 20067013489 A KR20067013489 A KR 20067013489A KR 100962906 B1 KR100962906 B1 KR 100962906B1
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dielectric material
delete delete
chip
integrated circuit
layer
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KR20070000424A (ko
KR20060136394A (ko
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데니얼 에델스테인
리 엠. 니콜슨
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인터내셔널 비지네스 머신즈 코포레이션
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3178—Coating or filling in grooves made in the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3185—Partial encapsulation or coating the coating covering also the sidewalls of the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1433—Application-specific integrated circuit [ASIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Dicing (AREA)
KR1020067013489A 2004-01-06 2005-01-06 낮은-ｋ 상호접속 구조물을 위한 컴플라이언트패시베이트된 엣지 씰 Expired - Fee Related KR100962906B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/707,713 2004-01-06
US10/707,713 US7098544B2 (en) 2004-01-06 2004-01-06 Edge seal for integrated circuit chips

Publications (3)

Publication Number Publication Date
KR20070000424A KR20070000424A (ko) 2007-01-02
KR20060136394A KR20060136394A (ko) 2007-01-02
KR100962906B1 true KR100962906B1 (ko) 2010-06-09

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KR1020067013489A Expired - Fee Related KR100962906B1 (ko) 2004-01-06 2005-01-06 낮은-ｋ 상호접속 구조물을 위한 컴플라이언트패시베이트된 엣지 씰

Country Status (7)

Country Link
US (2) US7098544B2 (enExample)
EP (1) EP1721334A4 (enExample)
JP (1) JP5147242B2 (enExample)
KR (1) KR100962906B1 (enExample)
CN (1) CN100552928C (enExample)
TW (1) TWI339901B (enExample)
WO (1) WO2005067598A2 (enExample)

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US20060281224A1 (en) 2006-12-14
CN100552928C (zh) 2009-10-21
EP1721334A2 (en) 2006-11-15
KR20070000424A (ko) 2007-01-02
JP5147242B2 (ja) 2013-02-20
TW200534494A (en) 2005-10-16
CN1926681A (zh) 2007-03-07
WO2005067598A3 (en) 2006-11-23
US7273770B2 (en) 2007-09-25
US20050145994A1 (en) 2005-07-07
US7098544B2 (en) 2006-08-29
TWI339901B (en) 2011-04-01
JP2007518276A (ja) 2007-07-05
EP1721334A4 (en) 2010-04-07
WO2005067598A2 (en) 2005-07-28

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