KR100918227B1 - 분류 땜납조 - Google Patents
분류 땜납조 Download PDFInfo
- Publication number
- KR100918227B1 KR100918227B1 KR1020077025379A KR20077025379A KR100918227B1 KR 100918227 B1 KR100918227 B1 KR 100918227B1 KR 1020077025379 A KR1020077025379 A KR 1020077025379A KR 20077025379 A KR20077025379 A KR 20077025379A KR 100918227 B1 KR100918227 B1 KR 100918227B1
- Authority
- KR
- South Korea
- Prior art keywords
- oxide
- solder
- fractionation
- molten solder
- nozzle
- Prior art date
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 23
- 229910000679 solder Inorganic materials 0.000 claims abstract description 154
- 238000005194 fractionation Methods 0.000 claims abstract description 62
- 239000007788 liquid Substances 0.000 claims description 19
- 239000007787 solid Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 9
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000005192 partition Methods 0.000 description 24
- 208000028659 discharge Diseases 0.000 description 12
- 238000003860 storage Methods 0.000 description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000000872 buffer Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 229910000978 Pb alloy Inorganic materials 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (4)
- 본체 내에 분류 노즐과 분류 펌프가 설치된 분류 땜납조에 있어서, 상기 분류 땜납조의 본체 단부에 산화물 고임부가 형성되어 있고, 또 분류 노즐의 측면에는 펌프측을 막은 통이 장착되어 있고, 게다가 산화물 고임부에는 다공판이 용융 땜납의 액면 아래에 잠기도록 하여 설치되어 있고, 그 다공판의 일단은 분류 노즐 또는 본체에 회전운동이 자유롭게 장착되어 있음과 함께, 다공판의 타단에는 용융 땜납의 액면 위로 돌출된 레버가 장착되어 있으며,상기 다공판은 용융 땜납의 액면으로부터 10 ∼ 200 ㎜ 에 설치되어 있는 것을 특징으로 하는 분류 땜납조.
- 제 1 항에 있어서, 상기 통은 산화물 고임부측을 낮게 하여 경사져 있는 것을 특징으로 하는 분류 땜납조.
- 삭제
- 제 1 항에 있어서, 상기 다공판의 구멍직경이 2 ∼ 10 ㎜ 인 것을 특징으로 하는 분류 땜납조.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2005-00109534 | 2005-04-06 | ||
JP2005109534 | 2005-04-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070118682A KR20070118682A (ko) | 2007-12-17 |
KR100918227B1 true KR100918227B1 (ko) | 2009-09-21 |
Family
ID=37114948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020077025379A KR100918227B1 (ko) | 2005-04-06 | 2006-03-13 | 분류 땜납조 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090212094A1 (ko) |
EP (1) | EP1876874A4 (ko) |
JP (1) | JP4605222B2 (ko) |
KR (1) | KR100918227B1 (ko) |
CN (1) | CN100584154C (ko) |
BR (1) | BRPI0610697A2 (ko) |
WO (1) | WO2006112216A1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2413677B1 (en) * | 2009-03-24 | 2013-07-31 | Senju Metal Industry Co., Ltd. | Localized jet soldering device and partial jet soldering method |
JP5279606B2 (ja) * | 2009-05-14 | 2013-09-04 | 株式会社デンソー | はんだ付け装置 |
US20190366460A1 (en) * | 2018-06-01 | 2019-12-05 | Progress Y&Y Corp. | Soldering apparatus and solder nozzle module thereof |
JP6590232B1 (ja) * | 2019-04-22 | 2019-10-16 | 千住金属工業株式会社 | はんだ付け装置及びはんだ付け方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0426189A (ja) * | 1990-05-21 | 1992-01-29 | Mitsubishi Electric Corp | プリント配線板の洗浄方法 |
JPH0741570Y2 (ja) * | 1992-05-08 | 1995-09-27 | 千住金属工業株式会社 | 噴流はんだ槽 |
KR200153131Y1 (ko) * | 1996-11-04 | 1999-08-02 | 진건영 | 납땜장치의 노즐 |
JP2003332724A (ja) | 2002-05-13 | 2003-11-21 | Nihon Dennetsu Keiki Co Ltd | はんだ波形成装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3187849B2 (ja) * | 1991-01-28 | 2001-07-16 | ソニー株式会社 | 噴流はんだ槽 |
US5411197A (en) * | 1993-10-19 | 1995-05-02 | Senju Metal Industry Co., Ltd. | Soldering pot |
JP4647150B2 (ja) * | 2001-08-07 | 2011-03-09 | 千住金属工業株式会社 | 酸化物の分離装置 |
-
2006
- 2006-03-13 EP EP06715612A patent/EP1876874A4/en not_active Withdrawn
- 2006-03-13 BR BRPI0610697-8A patent/BRPI0610697A2/pt not_active IP Right Cessation
- 2006-03-13 US US11/887,953 patent/US20090212094A1/en not_active Abandoned
- 2006-03-13 CN CN200680016730A patent/CN100584154C/zh active Active
- 2006-03-13 JP JP2007521140A patent/JP4605222B2/ja active Active
- 2006-03-13 KR KR1020077025379A patent/KR100918227B1/ko active IP Right Grant
- 2006-03-13 WO PCT/JP2006/304889 patent/WO2006112216A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0426189A (ja) * | 1990-05-21 | 1992-01-29 | Mitsubishi Electric Corp | プリント配線板の洗浄方法 |
JPH0741570Y2 (ja) * | 1992-05-08 | 1995-09-27 | 千住金属工業株式会社 | 噴流はんだ槽 |
KR200153131Y1 (ko) * | 1996-11-04 | 1999-08-02 | 진건영 | 납땜장치의 노즐 |
JP2003332724A (ja) | 2002-05-13 | 2003-11-21 | Nihon Dennetsu Keiki Co Ltd | はんだ波形成装置 |
Also Published As
Publication number | Publication date |
---|---|
US20090212094A1 (en) | 2009-08-27 |
JP4605222B2 (ja) | 2011-01-05 |
KR20070118682A (ko) | 2007-12-17 |
BRPI0610697A2 (pt) | 2010-07-20 |
JPWO2006112216A1 (ja) | 2008-12-04 |
EP1876874A4 (en) | 2011-01-19 |
CN100584154C (zh) | 2010-01-20 |
WO2006112216A1 (ja) | 2006-10-26 |
EP1876874A1 (en) | 2008-01-09 |
CN101176393A (zh) | 2008-05-07 |
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