JP4605222B2 - 噴流はんだ槽 - Google Patents
噴流はんだ槽 Download PDFInfo
- Publication number
- JP4605222B2 JP4605222B2 JP2007521140A JP2007521140A JP4605222B2 JP 4605222 B2 JP4605222 B2 JP 4605222B2 JP 2007521140 A JP2007521140 A JP 2007521140A JP 2007521140 A JP2007521140 A JP 2007521140A JP 4605222 B2 JP4605222 B2 JP 4605222B2
- Authority
- JP
- Japan
- Prior art keywords
- jet
- oxide
- solder
- molten solder
- perforated plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 156
- 239000007788 liquid Substances 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 8
- 238000005192 partition Methods 0.000 description 24
- 230000003647 oxidation Effects 0.000 description 16
- 238000007254 oxidation reaction Methods 0.000 description 16
- 238000005476 soldering Methods 0.000 description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 244000273256 Phragmites communis Species 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000004071 soot Substances 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
2 本体
3 一次噴流ノズル
4 二次噴流ノズル
5 溶融はんだ
18、19、20 樋
21 樋の出口
22 多孔板
26 レバー
Claims (4)
- 本体内に噴流ノズルと噴流ポンプが設置された噴流はんだ槽において、噴流ポンプ設置箇所と反対側となるところの本体端部に酸化物溜りが設けられており、また噴流ノズルの側面にはポンプ側を堰き止めた樋が取り付けられていて、しかも酸化物溜りには多孔板が溶融はんだの液面下に没するようにして設置されており、該多孔板の一端は噴流ノズルまたは本体に回動自在に取り付けられているとともに、多孔板の他端には溶融はんだの液面上に突出したレバーが取り付けられていることを特徴とする噴流はんだ槽。
- 前記樋は、酸化物溜り側を低くした傾斜が付されていることを特徴とする請求項1記載の噴流はんだ槽。
- 前記多孔板は、溶融はんだの液面から10〜200mmに設置されていることを特徴とする請求項1記載の噴流はんだ槽。
- 前記多孔板の穴径は、2〜10mmであることを特徴とする請求項1記載の噴流はんだ槽。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005109534 | 2005-04-06 | ||
JP2005109534 | 2005-04-06 | ||
PCT/JP2006/304889 WO2006112216A1 (ja) | 2005-04-06 | 2006-03-13 | 噴流はんだ槽 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2006112216A1 JPWO2006112216A1 (ja) | 2008-12-04 |
JP4605222B2 true JP4605222B2 (ja) | 2011-01-05 |
Family
ID=37114948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007521140A Active JP4605222B2 (ja) | 2005-04-06 | 2006-03-13 | 噴流はんだ槽 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090212094A1 (ja) |
EP (1) | EP1876874A4 (ja) |
JP (1) | JP4605222B2 (ja) |
KR (1) | KR100918227B1 (ja) |
CN (1) | CN100584154C (ja) |
BR (1) | BRPI0610697A2 (ja) |
WO (1) | WO2006112216A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4941616B2 (ja) * | 2009-03-24 | 2012-05-30 | 千住金属工業株式会社 | 部分噴流はんだ付け装置及び部分噴流はんだ付け方法 |
JP5279606B2 (ja) * | 2009-05-14 | 2013-09-04 | 株式会社デンソー | はんだ付け装置 |
US20190366460A1 (en) * | 2018-06-01 | 2019-12-05 | Progress Y&Y Corp. | Soldering apparatus and solder nozzle module thereof |
JP6590232B1 (ja) * | 2019-04-22 | 2019-10-16 | 千住金属工業株式会社 | はんだ付け装置及びはんだ付け方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0426189A (ja) * | 1990-05-21 | 1992-01-29 | Mitsubishi Electric Corp | プリント配線板の洗浄方法 |
JPH0623663U (ja) * | 1992-05-08 | 1994-03-29 | 千住金属工業株式会社 | 噴流はんだ槽 |
JP2003332724A (ja) * | 2002-05-13 | 2003-11-21 | Nihon Dennetsu Keiki Co Ltd | はんだ波形成装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3187849B2 (ja) * | 1991-01-28 | 2001-07-16 | ソニー株式会社 | 噴流はんだ槽 |
US5411197A (en) * | 1993-10-19 | 1995-05-02 | Senju Metal Industry Co., Ltd. | Soldering pot |
KR200153131Y1 (ko) * | 1996-11-04 | 1999-08-02 | 진건영 | 납땜장치의 노즐 |
JP4647150B2 (ja) * | 2001-08-07 | 2011-03-09 | 千住金属工業株式会社 | 酸化物の分離装置 |
-
2006
- 2006-03-13 EP EP06715612A patent/EP1876874A4/en not_active Withdrawn
- 2006-03-13 JP JP2007521140A patent/JP4605222B2/ja active Active
- 2006-03-13 KR KR1020077025379A patent/KR100918227B1/ko active IP Right Grant
- 2006-03-13 BR BRPI0610697-8A patent/BRPI0610697A2/pt not_active IP Right Cessation
- 2006-03-13 CN CN200680016730A patent/CN100584154C/zh active Active
- 2006-03-13 WO PCT/JP2006/304889 patent/WO2006112216A1/ja active Application Filing
- 2006-03-13 US US11/887,953 patent/US20090212094A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0426189A (ja) * | 1990-05-21 | 1992-01-29 | Mitsubishi Electric Corp | プリント配線板の洗浄方法 |
JPH0623663U (ja) * | 1992-05-08 | 1994-03-29 | 千住金属工業株式会社 | 噴流はんだ槽 |
JP2003332724A (ja) * | 2002-05-13 | 2003-11-21 | Nihon Dennetsu Keiki Co Ltd | はんだ波形成装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101176393A (zh) | 2008-05-07 |
WO2006112216A1 (ja) | 2006-10-26 |
BRPI0610697A2 (pt) | 2010-07-20 |
EP1876874A1 (en) | 2008-01-09 |
KR100918227B1 (ko) | 2009-09-21 |
KR20070118682A (ko) | 2007-12-17 |
EP1876874A4 (en) | 2011-01-19 |
JPWO2006112216A1 (ja) | 2008-12-04 |
CN100584154C (zh) | 2010-01-20 |
US20090212094A1 (en) | 2009-08-27 |
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