KR100903717B1 - 제어 장치 - Google Patents

제어 장치 Download PDF

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Publication number
KR100903717B1
KR100903717B1 KR1020077023924A KR20077023924A KR100903717B1 KR 100903717 B1 KR100903717 B1 KR 100903717B1 KR 1020077023924 A KR1020077023924 A KR 1020077023924A KR 20077023924 A KR20077023924 A KR 20077023924A KR 100903717 B1 KR100903717 B1 KR 100903717B1
Authority
KR
South Korea
Prior art keywords
substrate
board
hook
substrate support
guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020077023924A
Other languages
English (en)
Korean (ko)
Other versions
KR20070112867A (ko
Inventor
다카시 마에다
Original Assignee
가부시키가이샤 야스카와덴키
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 야스카와덴키 filed Critical 가부시키가이샤 야스카와덴키
Publication of KR20070112867A publication Critical patent/KR20070112867A/ko
Application granted granted Critical
Publication of KR100903717B1 publication Critical patent/KR100903717B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1417Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142Spacers not being card guides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Connection Of Plates (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)
KR1020077023924A 2005-04-19 2006-04-10 제어 장치 Expired - Fee Related KR100903717B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00120513 2005-04-19
JP2005120513 2005-04-19

Publications (2)

Publication Number Publication Date
KR20070112867A KR20070112867A (ko) 2007-11-27
KR100903717B1 true KR100903717B1 (ko) 2009-06-19

Family

ID=37214653

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077023924A Expired - Fee Related KR100903717B1 (ko) 2005-04-19 2006-04-10 제어 장치

Country Status (8)

Country Link
US (1) US7813144B2 (https=)
JP (1) JP4631908B2 (https=)
KR (1) KR100903717B1 (https=)
CN (1) CN101164393A (https=)
DE (1) DE112006000997T5 (https=)
GB (1) GB2440852B (https=)
TW (1) TW200640344A (https=)
WO (1) WO2006115028A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE544326T1 (de) * 2007-12-03 2012-02-15 Osram Ag Gehäuse für elektrische komponenten
JP5014470B2 (ja) * 2010-06-28 2012-08-29 三菱電機株式会社 樹脂封止形電子制御装置、及びその製造方法
CN102340961A (zh) * 2010-07-20 2012-02-01 鸿富锦精密工业(深圳)有限公司 电路板组合
JP2016151727A (ja) * 2015-02-19 2016-08-22 富士ゼロックス株式会社 電子部品の取付構造、着脱ユニット及び画像形成装置
JP2019513488A (ja) * 2016-04-18 2019-05-30 カーディアック ペースメイカーズ, インコーポレイテッド コア回路支持構造体を備えた埋込型医療装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236085U (https=) * 1988-09-01 1990-03-08

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6011676Y2 (ja) 1980-12-24 1985-04-17 日本電産コパル株式会社 プリント基板用ファスナ−
JPS57108386A (en) * 1980-12-26 1982-07-06 Masatoshi Takeuchi Surface lattice for building
JPH0621666A (ja) 1991-04-18 1994-01-28 Fujitsu Ltd 電子機器用の密閉筺体構造
US5825631A (en) * 1997-04-16 1998-10-20 Starkey Laboratories Method for connecting two substrates in a thick film hybrid circuit
US7432702B2 (en) * 2005-12-22 2008-10-07 Honeywell International Inc. Circuit board damping assembly

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236085U (https=) * 1988-09-01 1990-03-08

Also Published As

Publication number Publication date
TWI305484B (https=) 2009-01-11
GB0720243D0 (en) 2007-11-28
JP4631908B2 (ja) 2011-02-16
US20090059547A1 (en) 2009-03-05
CN101164393A (zh) 2008-04-16
US7813144B2 (en) 2010-10-12
DE112006000997T5 (de) 2008-02-21
WO2006115028A1 (ja) 2006-11-02
TW200640344A (en) 2006-11-16
KR20070112867A (ko) 2007-11-27
JPWO2006115028A1 (ja) 2008-12-18
GB2440852B (en) 2010-09-15
GB2440852A (en) 2008-02-13

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