TW200640344A - Control device - Google Patents

Control device

Info

Publication number
TW200640344A
TW200640344A TW095113980A TW95113980A TW200640344A TW 200640344 A TW200640344 A TW 200640344A TW 095113980 A TW095113980 A TW 095113980A TW 95113980 A TW95113980 A TW 95113980A TW 200640344 A TW200640344 A TW 200640344A
Authority
TW
Taiwan
Prior art keywords
substrate
support body
side end
substrate support
control device
Prior art date
Application number
TW095113980A
Other languages
English (en)
Other versions
TWI305484B (zh
Inventor
Takashi Maeda
Original Assignee
Yaskawa Denki Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Denki Seisakusho Kk filed Critical Yaskawa Denki Seisakusho Kk
Publication of TW200640344A publication Critical patent/TW200640344A/zh
Application granted granted Critical
Publication of TWI305484B publication Critical patent/TWI305484B/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1417Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142Spacers not being card guides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Connection Of Plates (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)
TW095113980A 2005-04-19 2006-04-19 Control device TW200640344A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005120513 2005-04-19

Publications (2)

Publication Number Publication Date
TW200640344A true TW200640344A (en) 2006-11-16
TWI305484B TWI305484B (zh) 2009-01-11

Family

ID=37214653

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113980A TW200640344A (en) 2005-04-19 2006-04-19 Control device

Country Status (8)

Country Link
US (1) US7813144B2 (zh)
JP (1) JP4631908B2 (zh)
KR (1) KR100903717B1 (zh)
CN (1) CN101164393A (zh)
DE (1) DE112006000997T5 (zh)
GB (1) GB2440852B (zh)
TW (1) TW200640344A (zh)
WO (1) WO2006115028A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009072148A1 (en) * 2007-12-03 2009-06-11 Osram Gesellschaft mit beschränkter Haftung A housing for electrical components
JP5014470B2 (ja) * 2010-06-28 2012-08-29 三菱電機株式会社 樹脂封止形電子制御装置、及びその製造方法
CN102340961A (zh) * 2010-07-20 2012-02-01 鸿富锦精密工业(深圳)有限公司 电路板组合
JP2016151727A (ja) * 2015-02-19 2016-08-22 富士ゼロックス株式会社 電子部品の取付構造、着脱ユニット及び画像形成装置
CN109069843B (zh) * 2016-04-18 2022-12-13 心脏起搏器股份公司 具有芯部电路系统支撑结构的可植入医疗装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6011676Y2 (ja) 1980-12-24 1985-04-17 日本電産コパル株式会社 プリント基板用ファスナ−
JPS57108386A (en) * 1980-12-26 1982-07-06 Masatoshi Takeuchi Surface lattice for building
JPH0236085U (zh) 1988-09-01 1990-03-08
JPH0621666A (ja) 1991-04-18 1994-01-28 Fujitsu Ltd 電子機器用の密閉筺体構造
US5825631A (en) * 1997-04-16 1998-10-20 Starkey Laboratories Method for connecting two substrates in a thick film hybrid circuit
US7432702B2 (en) * 2005-12-22 2008-10-07 Honeywell International Inc. Circuit board damping assembly

Also Published As

Publication number Publication date
DE112006000997T5 (de) 2008-02-21
JPWO2006115028A1 (ja) 2008-12-18
GB2440852A (en) 2008-02-13
US20090059547A1 (en) 2009-03-05
GB0720243D0 (en) 2007-11-28
WO2006115028A1 (ja) 2006-11-02
TWI305484B (zh) 2009-01-11
US7813144B2 (en) 2010-10-12
KR20070112867A (ko) 2007-11-27
GB2440852B (en) 2010-09-15
JP4631908B2 (ja) 2011-02-16
KR100903717B1 (ko) 2009-06-19
CN101164393A (zh) 2008-04-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees