KR100890677B1 - 반도체 집적 회로 - Google Patents

반도체 집적 회로 Download PDF

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Publication number
KR100890677B1
KR100890677B1 KR1020000019472A KR20000019472A KR100890677B1 KR 100890677 B1 KR100890677 B1 KR 100890677B1 KR 1020000019472 A KR1020000019472 A KR 1020000019472A KR 20000019472 A KR20000019472 A KR 20000019472A KR 100890677 B1 KR100890677 B1 KR 100890677B1
Authority
KR
South Korea
Prior art keywords
frequency band
pin
band amplifier
ground
input
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020000019472A
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English (en)
Korean (ko)
Other versions
KR20010014729A (ko
Inventor
다끼까와구미꼬
다나까사또시
하시모또다까시
오까베요시유끼
Original Assignee
가부시끼가이샤 르네사스 테크놀로지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 가부시끼가이샤 르네사스 테크놀로지 filed Critical 가부시끼가이샤 르네사스 테크놀로지
Publication of KR20010014729A publication Critical patent/KR20010014729A/ko
Application granted granted Critical
Publication of KR100890677B1 publication Critical patent/KR100890677B1/ko
Assigned to 르네사스 일렉트로닉스 가부시키가이샤 reassignment 르네사스 일렉트로닉스 가부시키가이샤 권리의 전부이전등록 Assignors: 가부시끼가이샤 르네사스 테크놀로지
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/181—Low-frequency amplifiers, e.g. audio preamplifiers
    • H03F3/183—Low-frequency amplifiers, e.g. audio preamplifiers with semiconductor devices only
    • H03F3/187—Low-frequency amplifiers, e.g. audio preamplifiers with semiconductor devices only in integrated circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/206—Wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/226—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Power Engineering (AREA)
  • Amplifiers (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Transceivers (AREA)
KR1020000019472A 1999-04-15 2000-04-14 반도체 집적 회로 Expired - Fee Related KR100890677B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1999-107545 1999-04-15
JP11107545A JP2000299438A (ja) 1999-04-15 1999-04-15 半導体集積回路

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020070085376A Division KR100842994B1 (ko) 1999-04-15 2007-08-24 반도체 집적 회로

Publications (2)

Publication Number Publication Date
KR20010014729A KR20010014729A (ko) 2001-02-26
KR100890677B1 true KR100890677B1 (ko) 2009-03-26

Family

ID=14461912

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020000019472A Expired - Fee Related KR100890677B1 (ko) 1999-04-15 2000-04-14 반도체 집적 회로
KR1020070085376A Expired - Fee Related KR100842994B1 (ko) 1999-04-15 2007-08-24 반도체 집적 회로

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020070085376A Expired - Fee Related KR100842994B1 (ko) 1999-04-15 2007-08-24 반도체 집적 회로

Country Status (5)

Country Link
US (5) US6407449B1 (cg-RX-API-DMAC7.html)
EP (1) EP1045442A3 (cg-RX-API-DMAC7.html)
JP (1) JP2000299438A (cg-RX-API-DMAC7.html)
KR (2) KR100890677B1 (cg-RX-API-DMAC7.html)
TW (1) TW472382B (cg-RX-API-DMAC7.html)

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JP4018312B2 (ja) 2000-02-21 2007-12-05 株式会社ルネサステクノロジ 無線通信装置
JP4319339B2 (ja) * 2000-08-30 2009-08-26 株式会社ルネサステクノロジ 半導体装置
US6931233B1 (en) * 2000-08-31 2005-08-16 Sirf Technology, Inc. GPS RF front end IC with programmable frequency synthesizer for use in wireless phones
KR100993277B1 (ko) * 2002-04-30 2010-11-10 르네사스 일렉트로닉스 가부시키가이샤 반도체장치 및 전자 장치
TWI225332B (en) * 2003-05-20 2004-12-11 Mediatek Inc Multi-band low noise amplifier
JP4010504B2 (ja) * 2003-06-04 2007-11-21 日立金属株式会社 マルチバンド用送受信機およびそれを用いた無線通信機
DE10336292A1 (de) * 2003-08-01 2005-02-17 Atmel Germany Gmbh Sende- und Empfangsvorrichtung mit wenigstens zwei Paaren aus je einem Sende-Leistungsverstärker und einem rauscharmen Eingangsverstärker
JP4112484B2 (ja) 2003-12-17 2008-07-02 株式会社東芝 無線機器及び半導体装置
JP4418250B2 (ja) * 2004-02-05 2010-02-17 株式会社ルネサステクノロジ 高周波回路モジュール
JP2007535662A (ja) * 2004-04-02 2007-12-06 カミンズ，チモシー 統合電子センサ
US8357958B2 (en) * 2004-04-02 2013-01-22 Silicon Laboratories Inc. Integrated CMOS porous sensor
JP2005340741A (ja) * 2004-05-31 2005-12-08 Renesas Technology Corp 半導体装置
JP2006073821A (ja) * 2004-09-02 2006-03-16 Sharp Corp 半導体集積回路装置
US7580687B2 (en) * 2005-01-19 2009-08-25 Micro Mobio Corporation System-in-package wireless communication device comprising prepackaged power amplifier
JP4647361B2 (ja) * 2005-03-29 2011-03-09 ルネサスエレクトロニクス株式会社 半導体集積回路
US7768792B2 (en) * 2005-09-12 2010-08-03 Lg Innotek Co., Ltd. Front end module
JP4580882B2 (ja) * 2006-03-10 2010-11-17 株式会社東芝 半導体集積回路
JP4261576B2 (ja) * 2006-12-11 2009-04-30 アルプス電気株式会社 高周波回路及びテレビジョンチューナ
DE102007007357B4 (de) * 2007-02-14 2018-06-21 Infineon Technologies Ag Integrierte Schaltungsanordnung
US8324019B2 (en) * 2008-05-23 2012-12-04 Lsi Corporation Solution for package crosstalk minimization
EP2443741B1 (en) 2009-06-19 2015-02-25 Koninklijke Philips N.V. Improving input impedance of low noise preamplifiers used for mri
US20110111792A1 (en) * 2009-11-12 2011-05-12 Sony Corporation System and method for effectively implementing a composite antenna for a wireless transceiver device
US8254862B2 (en) * 2009-12-29 2012-08-28 Silicon Laboratories Inc. Configurable radio front end
DE102010055707B4 (de) * 2009-12-29 2015-11-12 Silicon Laboratories Inc. Konfigurierbarer Rundfunkgeräteingang, Konfigurieren einer Tunerschaltung und System mit Konfigurierbarem Rundfunkgeräteingang
US8818309B2 (en) 2011-03-28 2014-08-26 Silicon Laboratories Inc. Providing multiple inductors for a radio tuner
US8669131B1 (en) 2011-09-30 2014-03-11 Silicon Laboratories Inc. Methods and materials for forming gas sensor structures
US9164052B1 (en) 2011-09-30 2015-10-20 Silicon Laboratories Inc. Integrated gas sensor
US8852513B1 (en) 2011-09-30 2014-10-07 Silicon Laboratories Inc. Systems and methods for packaging integrated circuit gas sensor systems
US8691609B1 (en) 2011-09-30 2014-04-08 Silicon Laboratories Inc. Gas sensor materials and methods for preparation thereof
JP5734217B2 (ja) * 2012-02-03 2015-06-17 ルネサスエレクトロニクス株式会社 半導体装置
US9543895B2 (en) * 2012-09-13 2017-01-10 Alfred Grayzel Circuit configuration using a frequency converter to achieve tunable circuit components such as filters and amplifiers
KR20150072846A (ko) * 2013-12-20 2015-06-30 삼성전기주식회사 반도체 패키지 모듈
US9671818B2 (en) 2014-03-12 2017-06-06 Kabushiki Kaisha Toshiba Memory device
TWI559449B (zh) * 2015-10-19 2016-11-21 穩懋半導體股份有限公司 化合物半導體積體電路之電路佈局方法
US20200007084A1 (en) * 2018-06-29 2020-01-02 Ali Corporation Low noise block converter integrated circuit
USD1134698S1 (en) * 2024-06-03 2026-07-14 Qingdao Ecopure Filter Co., Ltd. Water purifier

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US5355524A (en) * 1992-01-21 1994-10-11 Motorola, Inc. Integrated radio receiver/transmitter structure
JPH06350479A (ja) * 1993-05-05 1994-12-22 Gec Marconi Ltd 集積化されたトランシーバ回路パッケージ部品
EP0823790A2 (en) * 1996-08-07 1998-02-11 Nokia Mobile Phones Ltd. Dual band mobile station employing cross-connected transmitter and receiver circuits

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DE3150453A1 (de) * 1981-12-19 1983-06-30 Bayer Ag, 5090 Leverkusen "leichtfliessende, schlagzaehe polyamide"
KR970003915B1 (ko) * 1987-06-24 1997-03-22 미다 가쓰시게 반도체 기억장치 및 그것을 사용한 반도체 메모리 모듈
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US5406226A (en) * 1993-07-07 1995-04-11 Wireless Access, Inc. Stable, narrow bandwidth, high frequency amplifier with low power consumption
KR970703648A (ko) * 1994-06-13 1997-07-03 가나이 쓰토무 신호수신회로와 디지털 신호처리 시스템(signal receiving circuit and digital signal processing system)
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US5995814A (en) * 1997-06-13 1999-11-30 Lucent Technologies Inc. Single-stage dual-band low-noise amplifier for use in a wireless communication system receiver
US6075995A (en) * 1998-01-30 2000-06-13 Conexant Systems, Inc. Amplifier module with two power amplifiers for dual band cellular phones
US6522895B1 (en) * 1998-12-31 2003-02-18 Ericsson Inc. Integrated transmitter and receiver components for a dual-band transceiver
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Publication number Priority date Publication date Assignee Title
US5355524A (en) * 1992-01-21 1994-10-11 Motorola, Inc. Integrated radio receiver/transmitter structure
JPH06350479A (ja) * 1993-05-05 1994-12-22 Gec Marconi Ltd 集積化されたトランシーバ回路パッケージ部品
EP0823790A2 (en) * 1996-08-07 1998-02-11 Nokia Mobile Phones Ltd. Dual band mobile station employing cross-connected transmitter and receiver circuits
JPH10107678A (ja) * 1996-08-07 1998-04-24 Nokia Mobile Phones Ltd 交差接続された送信回路及び受信回路を使用するデュアルバンド移動電話機

Also Published As

Publication number Publication date
EP1045442A3 (en) 2003-07-23
US6768192B2 (en) 2004-07-27
US20050101282A1 (en) 2005-05-12
JP2000299438A (ja) 2000-10-24
US7369817B2 (en) 2008-05-06
KR20070089903A (ko) 2007-09-04
US6639310B2 (en) 2003-10-28
US20040178497A1 (en) 2004-09-16
KR100842994B1 (ko) 2008-07-01
US20020079569A1 (en) 2002-06-27
KR20010014729A (ko) 2001-02-26
US6847108B2 (en) 2005-01-25
TW472382B (en) 2002-01-11
US6407449B1 (en) 2002-06-18
EP1045442A2 (en) 2000-10-18
US20040021208A1 (en) 2004-02-05

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