KR100865183B1 - 반도체 소자, 잉크 제트 헤드용 기판 및 이의 제조 방법 - Google Patents

반도체 소자, 잉크 제트 헤드용 기판 및 이의 제조 방법 Download PDF

Info

Publication number
KR100865183B1
KR100865183B1 KR1020060009253A KR20060009253A KR100865183B1 KR 100865183 B1 KR100865183 B1 KR 100865183B1 KR 1020060009253 A KR1020060009253 A KR 1020060009253A KR 20060009253 A KR20060009253 A KR 20060009253A KR 100865183 B1 KR100865183 B1 KR 100865183B1
Authority
KR
South Korea
Prior art keywords
semiconductor device
electrode
silicon substrate
forming
ink jet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020060009253A
Other languages
English (en)
Korean (ko)
Other versions
KR20060088068A (ko
Inventor
사또시 이베
데루오 오자끼
이찌로 사이또
사까이 요꼬야마
겐지 오노
가즈아끼 시바따
도시야스 사까이
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20060088068A publication Critical patent/KR20060088068A/ko
Application granted granted Critical
Publication of KR100865183B1 publication Critical patent/KR100865183B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B43—WRITING OR DRAWING IMPLEMENTS; BUREAU ACCESSORIES
    • B43L—ARTICLES FOR WRITING OR DRAWING UPON; WRITING OR DRAWING AIDS; ACCESSORIES FOR WRITING OR DRAWING
    • B43L7/00—Straightedges
    • B43L7/005—Straightedges combined with other drawing aids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26B—HAND-HELD CUTTING TOOLS NOT OTHERWISE PROVIDED FOR
    • B26B29/00—Guards or sheaths or guides for hand cutting tools; Arrangements for guiding hand cutting tools
    • B26B29/06—Arrangements for guiding hand cutting tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B43—WRITING OR DRAWING IMPLEMENTS; BUREAU ACCESSORIES
    • B43L—ARTICLES FOR WRITING OR DRAWING UPON; WRITING OR DRAWING AIDS; ACCESSORIES FOR WRITING OR DRAWING
    • B43L13/00—Drawing instruments, or writing or drawing appliances or accessories not otherwise provided for
    • B43L13/20—Curve rulers or templets
    • B43L13/201—Stencils for drawing figures, objects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/723—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/791—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads
    • H10W90/792—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads between multiple chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
KR1020060009253A 2005-01-31 2006-01-31 반도체 소자, 잉크 제트 헤드용 기판 및 이의 제조 방법 Expired - Fee Related KR100865183B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00023716 2005-01-31
JP2005023716A JP4630680B2 (ja) 2005-01-31 2005-01-31 半導体素子の製造方法およびインクジェット記録ヘッドの製造方法

Publications (2)

Publication Number Publication Date
KR20060088068A KR20060088068A (ko) 2006-08-03
KR100865183B1 true KR100865183B1 (ko) 2008-10-23

Family

ID=36756046

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060009253A Expired - Fee Related KR100865183B1 (ko) 2005-01-31 2006-01-31 반도체 소자, 잉크 제트 헤드용 기판 및 이의 제조 방법

Country Status (3)

Country Link
US (1) US7591071B2 (https=)
JP (1) JP4630680B2 (https=)
KR (1) KR100865183B1 (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4182035B2 (ja) * 2004-08-16 2008-11-19 キヤノン株式会社 インクジェットヘッド用基板、該基板の製造方法および前記基板を用いるインクジェットヘッド
JP4137027B2 (ja) * 2004-08-16 2008-08-20 キヤノン株式会社 インクジェットヘッド用基板、該基板の製造方法および前記基板を用いるインクジェットヘッド
US8142678B2 (en) * 2005-08-23 2012-03-27 Canon Kabushiki Kaisha Perovskite type oxide material, piezoelectric element, liquid discharge head and liquid discharge apparatus using the same, and method of producing perovskite type oxide material
US8438729B2 (en) * 2006-03-09 2013-05-14 Canon Kabushiki Kaisha Method of producing liquid discharge head
US8267503B2 (en) * 2006-10-16 2012-09-18 Canon Kabushiki Kaisha Ink jet recording head and manufacturing method therefor
JP5008448B2 (ja) 2007-04-20 2012-08-22 キヤノン株式会社 インクジェット記録ヘッド用の基板の製造方法
JP5355223B2 (ja) * 2008-06-17 2013-11-27 キヤノン株式会社 液体吐出ヘッド
JP2010000632A (ja) * 2008-06-18 2010-01-07 Canon Inc インクジェットヘッド用基板および該基板を具えるインクジェットヘッド
US8152279B2 (en) * 2008-06-18 2012-04-10 Canon Kabushiki Kaisha Liquid ejection head having substrate with nickel-containing layer
US8291576B2 (en) * 2008-06-18 2012-10-23 Canon Kabushiki Kaisha Method of manufacturing liquid ejection head
JP5312202B2 (ja) * 2008-06-20 2013-10-09 キヤノン株式会社 液体吐出ヘッド及びその製造方法
DE102011101035B4 (de) * 2011-05-10 2014-07-10 Infineon Technologies Ag Ein Verfahren zum Herstelllen eines Anschlussgebiets an einer Seitenwand eines Halbleiterkörpers
JP6066612B2 (ja) * 2012-08-06 2017-01-25 キヤノン株式会社 液体吐出ヘッド及びその製造方法
JP6175798B2 (ja) * 2013-02-25 2017-08-09 ブラザー工業株式会社 液体吐出装置及びフレキシブル配線基板の接続方法
US9308728B2 (en) 2013-05-31 2016-04-12 Stmicroelectronics, Inc. Method of making inkjet print heads having inkjet chambers and orifices formed in a wafer and related devices
JP6296720B2 (ja) 2013-07-29 2018-03-20 キヤノン株式会社 液体吐出ヘッド、液体吐出ヘッド用基板及び記録装置
JP6218517B2 (ja) * 2013-09-09 2017-10-25 キヤノン株式会社 液体吐出ヘッドの製造方法
JP2015080918A (ja) 2013-10-23 2015-04-27 キヤノン株式会社 液体吐出ヘッドおよび該液体吐出ヘッドの製造方法
JP6516613B2 (ja) * 2015-07-24 2019-05-22 キヤノン株式会社 液体吐出ヘッド用基板および液体吐出ヘッド用基板の製造方法
JP2018122554A (ja) * 2017-02-03 2018-08-09 エスアイアイ・プリンテック株式会社 部材、液体噴射ヘッドチップ、液体噴射ヘッド、液体噴射装置および切断方法
US10290512B2 (en) 2017-05-17 2019-05-14 Nanya Technology Corporation Semiconductor structure having bump on tilting upper corner surface
JP7163134B2 (ja) 2018-10-18 2022-10-31 キヤノン株式会社 液体吐出ヘッド、液体吐出ヘッドの製造方法および液体吐出装置
JP7305383B2 (ja) * 2019-03-15 2023-07-10 キヤノン株式会社 液体吐出ヘッドおよびその製造方法
JP7520622B2 (ja) 2020-07-31 2024-07-23 キヤノン株式会社 液体吐出ヘッドおよびその製造方法
JP7621856B2 (ja) * 2021-03-26 2025-01-27 キヤノン株式会社 液体吐出ヘッド、素子基板及びその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283271A (ja) * 1992-03-31 1993-10-29 Sumitomo Metal Ind Ltd チップ型半導体磁器部品及びその製造方法
US6443563B1 (en) 1998-10-27 2002-09-03 Canon Kabushiki Kaisha Electro-thermal conversion device board, ink-jet recording head provided with the electro-thermal conversion device board, ink-jet recording apparatus using the same, and production method of ink-jet recording head
US6513911B1 (en) 1999-06-04 2003-02-04 Canon Kabushiki Kaisha Micro-electromechanical device, liquid discharge head, and method of manufacture therefor

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63242653A (ja) * 1987-03-31 1988-10-07 Sony Corp サ−マルヘツド
JPH01175248A (ja) * 1987-12-28 1989-07-11 Sharp Corp 半導体チップ
US5081474A (en) * 1988-07-04 1992-01-14 Canon Kabushiki Kaisha Recording head having multi-layer matrix wiring
JP2751242B2 (ja) * 1988-09-28 1998-05-18 日本電気株式会社 半導体装置の製造方法
EP0490668B1 (en) * 1990-12-12 1996-10-16 Canon Kabushiki Kaisha Ink jet recording
JPH05175354A (ja) * 1991-12-20 1993-07-13 Sony Corp 半導体素子構造
JP2809115B2 (ja) * 1993-10-13 1998-10-08 ヤマハ株式会社 半導体装置とその製造方法
JP3169842B2 (ja) * 1996-10-07 2001-05-28 セイコーインスツルメンツ株式会社 サーマルヘッドおよびその製造方法
JP2000043271A (ja) * 1997-11-14 2000-02-15 Canon Inc インクジェット記録ヘッド、その製造方法及び該インクジェット記録ヘッドを具備する記録装置
US6497477B1 (en) * 1998-11-04 2002-12-24 Matsushita Electric Industrial Co., Ltd. Ink-jet head mounted with a driver IC, method for manufacturing thereof and ink-jet printer having the same
JP3415789B2 (ja) 1999-06-10 2003-06-09 松下電器産業株式会社 インクジェットヘッド及びインクジェットプリンタ
US6402302B1 (en) * 1999-06-04 2002-06-11 Canon Kabushiki Kaisha Liquid discharge head, manufacturing method thereof, and microelectromechanical device
JP2001138521A (ja) * 1999-11-11 2001-05-22 Canon Inc インクジェット記録ヘッドおよび該記録ヘッドを用いたインクジェット記録装置
JP3970016B2 (ja) * 2000-12-28 2007-09-05 キヤノン株式会社 インクジェット記録ヘッド及びインクジェット記録装置
JP3804011B2 (ja) * 2001-01-26 2006-08-02 富士写真フイルム株式会社 半導体デバイスの製造方法
JP4554831B2 (ja) * 2001-02-13 2010-09-29 ローム株式会社 個片基板の製造方法および個片基板並びに集合基板
US7340181B1 (en) * 2002-05-13 2008-03-04 National Semiconductor Corporation Electrical die contact structure and fabrication method
KR100452850B1 (ko) * 2002-10-17 2004-10-14 삼성전자주식회사 잉크젯 프린터의 프린트 헤드 및 그 제조방법
JP2004221372A (ja) * 2003-01-16 2004-08-05 Seiko Epson Corp 半導体装置、半導体モジュール、電子機器、半導体装置の製造方法および半導体モジュールの製造方法
JP4137027B2 (ja) * 2004-08-16 2008-08-20 キヤノン株式会社 インクジェットヘッド用基板、該基板の製造方法および前記基板を用いるインクジェットヘッド
US8438729B2 (en) * 2006-03-09 2013-05-14 Canon Kabushiki Kaisha Method of producing liquid discharge head

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283271A (ja) * 1992-03-31 1993-10-29 Sumitomo Metal Ind Ltd チップ型半導体磁器部品及びその製造方法
US6443563B1 (en) 1998-10-27 2002-09-03 Canon Kabushiki Kaisha Electro-thermal conversion device board, ink-jet recording head provided with the electro-thermal conversion device board, ink-jet recording apparatus using the same, and production method of ink-jet recording head
US6513911B1 (en) 1999-06-04 2003-02-04 Canon Kabushiki Kaisha Micro-electromechanical device, liquid discharge head, and method of manufacture therefor

Also Published As

Publication number Publication date
JP2006210815A (ja) 2006-08-10
US20060170734A1 (en) 2006-08-03
KR20060088068A (ko) 2006-08-03
JP4630680B2 (ja) 2011-02-09
US7591071B2 (en) 2009-09-22

Similar Documents

Publication Publication Date Title
KR100865183B1 (ko) 반도체 소자, 잉크 제트 헤드용 기판 및 이의 제조 방법
US6853089B2 (en) Semiconductor device and method of manufacturing the same
US6332669B1 (en) Ink jet head including vibration plate and electrode substrate
EP1923219B1 (en) Inkjet head
US8322829B2 (en) Liquid discharge head substrate and manufacturing method thereof, and liquid discharge head using liquid discharge head substrate and manufacturing method thereof
US4622574A (en) Semiconductor chip with recessed bond pads
US9315016B2 (en) Inkjet head and method of manufacturing inkjet head
JP2016165847A (ja) 液体噴射ヘッド、及び液体噴射ヘッドの製造方法
CN111823716B (zh) 液体喷出头及其制造方法
JP5475116B2 (ja) インクジェット印刷ヘッドアセンブリおよび印刷ヘッド集積回路
US8075107B2 (en) Liquid ejection head
US6485126B1 (en) Ink jet head and method of producing the same
JP2007036060A (ja) 半導体装置及びその製造方法
JP5065453B2 (ja) 液体吐出ヘッド用基板及びその製造方法及び、液体吐出ヘッド用基板を用いた液体吐出ヘッド及びその製造方法
US20100155862A1 (en) Package for electronic component, manufacturing method thereof and sensing apparatus
JP5173624B2 (ja) 記録ヘッド及び記録ヘッドの製造方法
JP2021088158A (ja) 記録素子基板及び液体吐出ヘッドならびにそれらの製造方法
JP2008207543A (ja) インクジェット記録へッドおよびその製造方法
JP5224782B2 (ja) 液体吐出ヘッドの製造方法
US8152278B2 (en) Liquid jet head chip and manufacturing method therefor
JP7309449B2 (ja) 半導体素子、半導体素子の製造方法、及び液体吐出ヘッド
JP5341688B2 (ja) 液体吐出ヘッド及びその製造方法
JP2004237528A (ja) インクジェット記録ヘッドおよびインクジェット記録ヘッドの製造方法
US20210060938A1 (en) Substrate with electrical connection section, substrate for liquid ejection head and methods of manufacturing the same
JP2023062376A (ja) 液体吐出ヘッド及びその製造方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20120924

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20130926

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20140924

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20150923

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20160926

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20171018

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20171018

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000