KR100864435B1 - 기판검사용 접촉자, 기판검사용 치구 및 기판검사장치 - Google Patents

기판검사용 접촉자, 기판검사용 치구 및 기판검사장치 Download PDF

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Publication number
KR100864435B1
KR100864435B1 KR1020070039822A KR20070039822A KR100864435B1 KR 100864435 B1 KR100864435 B1 KR 100864435B1 KR 1020070039822 A KR1020070039822 A KR 1020070039822A KR 20070039822 A KR20070039822 A KR 20070039822A KR 100864435 B1 KR100864435 B1 KR 100864435B1
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KR
South Korea
Prior art keywords
hole
substrate inspection
fin body
guide base
coil spring
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020070039822A
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English (en)
Korean (ko)
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KR20070109831A (ko
Inventor
고스케 히로베
마코토 후지노
미노루 가토
Original Assignee
니혼덴산리드가부시키가이샤
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Publication of KR20070109831A publication Critical patent/KR20070109831A/ko
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Publication of KR100864435B1 publication Critical patent/KR100864435B1/ko
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
KR1020070039822A 2006-05-12 2007-04-24 기판검사용 접촉자, 기판검사용 치구 및 기판검사장치 Expired - Fee Related KR100864435B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00134202 2006-05-12
JP2006134202A JP2007304008A (ja) 2006-05-12 2006-05-12 基板検査用接触子、基板検査用治具及び基板検査装置

Publications (2)

Publication Number Publication Date
KR20070109831A KR20070109831A (ko) 2007-11-15
KR100864435B1 true KR100864435B1 (ko) 2008-10-20

Family

ID=38685701

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070039822A Expired - Fee Related KR100864435B1 (ko) 2006-05-12 2007-04-24 기판검사용 접촉자, 기판검사용 치구 및 기판검사장치

Country Status (5)

Country Link
US (1) US20070264878A1 (enExample)
JP (1) JP2007304008A (enExample)
KR (1) KR100864435B1 (enExample)
CN (1) CN101071140A (enExample)
TW (1) TW200801527A (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010025665A (ja) * 2008-07-17 2010-02-04 Nidec-Read Corp 基板検査治具及び接触子
DE102009004555A1 (de) * 2009-01-14 2010-09-30 Atg Luther & Maelzer Gmbh Verfahren zum Prüfen von Leiterplatten
JP2010276510A (ja) * 2009-05-29 2010-12-09 Nidec-Read Corp 検査用治具
JP2011089891A (ja) * 2009-10-22 2011-05-06 Micronics Japan Co Ltd 電気的接続装置及びこれを用いる試験装置
JP5629545B2 (ja) * 2009-12-18 2014-11-19 株式会社日本マイクロニクス プローブカード及び検査装置
JP2013100994A (ja) * 2011-11-07 2013-05-23 Nidec-Read Corp 基板検査治具、治具ベースユニット及び基板検査装置
JP5966688B2 (ja) * 2012-07-04 2016-08-10 日本電産リード株式会社 配線構造及び基板検査装置
JP2014235119A (ja) * 2013-06-04 2014-12-15 日本電産リード株式会社 基板検査装置、基板検査方法および基板検査用治具
US9274166B2 (en) 2013-08-26 2016-03-01 Fujitsu Limited Pin verification device and method
CN104714059A (zh) * 2015-03-19 2015-06-17 东莞鸿爱斯通信科技有限公司 测试接头
CN105388412A (zh) * 2015-10-23 2016-03-09 京东方科技集团股份有限公司 用于pcba的测试装置
JP6872943B2 (ja) * 2017-03-24 2021-05-19 株式会社日本マイクロニクス 電気的接続装置
CN112582851B (zh) * 2019-09-29 2025-03-21 中核检修有限公司 记录仪校验辅助装置
US11162980B2 (en) * 2019-12-24 2021-11-02 Teradyne, Inc. Coaxial via arrangement in probe card for automated test equipment
TWI814198B (zh) * 2022-01-04 2023-09-01 美商全球連接器科技有限公司 電性測試裝置

Citations (4)

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Publication number Priority date Publication date Assignee Title
KR0135657B1 (ko) * 1994-01-06 1998-05-15 윌리암 티. 엘리스 인쇄회로기판의 상호접속부 검사장치 및 인쇄회로기판 검사방법(printed circuit board test fixture and method)
KR100405037B1 (en) 2003-07-21 2003-11-10 From 30 Co Ltd Probe card for inspecting semiconductor device
KR20060051914A (ko) * 2004-09-30 2006-05-19 가부시키가이샤 요코오 검사 유닛
KR200421209Y1 (ko) * 2006-04-14 2006-07-10 캐롤라인 예 회로 기판의 검사를 위한 시험용 탐침 장치

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
EP0242542A1 (de) * 1986-03-26 1987-10-28 Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung Prüfadapter
JP2532331B2 (ja) * 1992-11-09 1996-09-11 日本発条株式会社 導電性接触子
US5506510A (en) * 1994-05-18 1996-04-09 Genrad, Inc. Adaptive alignment probe fixture for circuit board tester
JP3326095B2 (ja) * 1996-12-27 2002-09-17 日本発条株式会社 導電性接触子
JP3634074B2 (ja) * 1996-06-28 2005-03-30 日本発条株式会社 導電性接触子
JPH10214649A (ja) * 1997-01-30 1998-08-11 Yokowo Co Ltd スプリングコネクタおよび該スプリングコネクタを用いた装置
US6563332B2 (en) * 1997-08-21 2003-05-13 Ibiden Co., Ltd. Checker head
US6429672B2 (en) * 1998-06-30 2002-08-06 International Business Machines Corporation Contamination-tolerant electrical test probe
JP3538036B2 (ja) * 1998-09-10 2004-06-14 イビデン株式会社 チェッカーヘッドおよびその製造方法
DE19907727A1 (de) * 1999-02-23 2000-08-24 Test Plus Electronic Gmbh Testadapter zur Kontaktierung von bestückten Leiterplatinen
US6330744B1 (en) * 1999-07-12 2001-12-18 Pjc Technologies, Inc. Customized electrical test probe head using uniform probe assemblies
US6191595B1 (en) * 1999-07-30 2001-02-20 Credence Systems Corporation Adhesive attaching, thermal releasing flat pack probe assembly
JP2001041977A (ja) * 1999-08-02 2001-02-16 Takashi Nansai チューブレスプリント基板検査機用治具
JP3794608B2 (ja) * 1999-12-01 2006-07-05 矢崎総業株式会社 コネクタ導通検査具
US6570399B2 (en) * 2000-05-18 2003-05-27 Qa Technology Company, Inc. Test probe and separable mating connector assembly
KR20040087341A (ko) * 2002-03-05 2004-10-13 리카 일렉트로닉스 인터내셔널, 인크. 전자 패키지와 테스트 장비를 인터페이싱시키기 위한 장치
JP2004039729A (ja) * 2002-07-01 2004-02-05 Totsuka Densi Kk プリント配線基板の検査治具
US6773938B2 (en) * 2002-08-29 2004-08-10 Micron Technology, Inc. Probe card, e.g., for testing microelectronic components, and methods for making same
US7154286B1 (en) * 2005-06-30 2006-12-26 Interconnect Devices, Inc. Dual tapered spring probe

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0135657B1 (ko) * 1994-01-06 1998-05-15 윌리암 티. 엘리스 인쇄회로기판의 상호접속부 검사장치 및 인쇄회로기판 검사방법(printed circuit board test fixture and method)
KR100405037B1 (en) 2003-07-21 2003-11-10 From 30 Co Ltd Probe card for inspecting semiconductor device
KR20060051914A (ko) * 2004-09-30 2006-05-19 가부시키가이샤 요코오 검사 유닛
KR200421209Y1 (ko) * 2006-04-14 2006-07-10 캐롤라인 예 회로 기판의 검사를 위한 시험용 탐침 장치

Also Published As

Publication number Publication date
TW200801527A (en) 2008-01-01
US20070264878A1 (en) 2007-11-15
KR20070109831A (ko) 2007-11-15
TWI327222B (enExample) 2010-07-11
CN101071140A (zh) 2007-11-14
JP2007304008A (ja) 2007-11-22

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