KR100821115B1 - 메모리 링크 처리용 온 더 플라이 빔 경로 에러 정정 방법 - Google Patents

메모리 링크 처리용 온 더 플라이 빔 경로 에러 정정 방법 Download PDF

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Publication number
KR100821115B1
KR100821115B1 KR1020037010793A KR20037010793A KR100821115B1 KR 100821115 B1 KR100821115 B1 KR 100821115B1 KR 1020037010793 A KR1020037010793 A KR 1020037010793A KR 20037010793 A KR20037010793 A KR 20037010793A KR 100821115 B1 KR100821115 B1 KR 100821115B1
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South Korea
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axis
processing
laser beam
high speed
link
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KR1020037010793A
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English (en)
Korean (ko)
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KR20030091990A (ko
Inventor
언래스마크
부룰랜드켈리
스와링겐스테펜
로호와이
Original Assignee
엘렉트로 사이언티픽 인더스트리즈 인코포레이티드
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Publication of KR20030091990A publication Critical patent/KR20030091990A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
    • H01L23/5258—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Lasers (AREA)
KR1020037010793A 2001-02-16 2002-02-15 메모리 링크 처리용 온 더 플라이 빔 경로 에러 정정 방법 Expired - Fee Related KR100821115B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US26964601P 2001-02-16 2001-02-16
US60/269,646 2001-02-16
PCT/US2002/004561 WO2002067180A1 (en) 2001-02-16 2002-02-15 On-the-fly beam path error correction for memory link processing

Publications (2)

Publication Number Publication Date
KR20030091990A KR20030091990A (ko) 2003-12-03
KR100821115B1 true KR100821115B1 (ko) 2008-04-11

Family

ID=23028100

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037010793A Expired - Fee Related KR100821115B1 (ko) 2001-02-16 2002-02-15 메모리 링크 처리용 온 더 플라이 빔 경로 에러 정정 방법

Country Status (8)

Country Link
JP (3) JP4397163B2 (enrdf_load_stackoverflow)
KR (1) KR100821115B1 (enrdf_load_stackoverflow)
CN (2) CN101172319A (enrdf_load_stackoverflow)
CA (1) CA2438566A1 (enrdf_load_stackoverflow)
DE (1) DE10296339T5 (enrdf_load_stackoverflow)
GB (1) GB2390699B (enrdf_load_stackoverflow)
TW (1) TW535199B (enrdf_load_stackoverflow)
WO (1) WO2002067180A1 (enrdf_load_stackoverflow)

Families Citing this family (12)

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Publication number Priority date Publication date Assignee Title
US6706999B1 (en) * 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
US7363180B2 (en) * 2005-02-15 2008-04-22 Electro Scientific Industries, Inc. Method for correcting systematic errors in a laser processing system
US7297972B2 (en) * 2005-08-26 2007-11-20 Electro Scientific Industries, Inc. Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target
US8026158B2 (en) * 2007-06-01 2011-09-27 Electro Scientific Industries, Inc. Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
US8378259B2 (en) * 2008-06-17 2013-02-19 Electro Scientific Industries, Inc. Eliminating head-to-head offsets along common chuck travel direction in multi-head laser machining systems
TWI594828B (zh) 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
JP6055414B2 (ja) * 2010-10-22 2016-12-27 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビームディザリング及びスカイビングのためのレーザ加工システム並びに方法
JP6636417B2 (ja) * 2013-03-15 2020-01-29 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド Ａｏｄ移動減少用ａｏｄツール整定のためのレーザシステム及び方法
US9527159B2 (en) 2013-03-15 2016-12-27 Electro Scientific Industries, Inc. Laser emission-based control of beam positioner
CN111266741A (zh) * 2018-11-19 2020-06-12 深圳市圭华智能科技有限公司 激光加工系统及激光加工方法
JP7442351B2 (ja) * 2020-03-12 2024-03-04 株式会社ディスコ レーザー加工装置
WO2022038682A1 (ja) * 2020-08-18 2022-02-24 株式会社ニコン 光学装置および加工装置

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CN1006938B (zh) * 1985-04-01 1990-02-21 索尼公司 光信息再现设备
JPH089110B2 (ja) * 1988-03-03 1996-01-31 株式会社ニコン レーザ加工装置のレーザビーム制御方法
JP2942804B2 (ja) * 1988-03-03 1999-08-30 株式会社ニコン レーザ加工装置及びレーザ加工装置のレーザビーム制御方法
DE4000166A1 (de) * 1990-01-05 1991-07-11 Hell Rudolf Dr Ing Gmbh Verfahren und einrichtung zur korrektur von positionsfehlern eines abgelenkten lichtstrahls
US5673110A (en) * 1993-01-26 1997-09-30 Phase Metrics, Inc. Multiplexed laser interferometer for non-dispersed spectrum detection in a dynamic flying height tester
JPH08195461A (ja) * 1995-01-18 1996-07-30 Hitachi Constr Mach Co Ltd ダムバー加工方法及びダムバー加工装置
US5847960A (en) * 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
US5751585A (en) * 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
JPH08316396A (ja) * 1995-05-16 1996-11-29 Hitachi Constr Mach Co Ltd ダムバー切断方法及びダムバー切断装置
JPH0970679A (ja) * 1995-09-07 1997-03-18 Nikon Corp レーザ加工装置の制御方法
CN1180221A (zh) * 1996-09-30 1998-04-29 大宇电子株式会社 控制光盘播放机的跟踪平衡装置和方法
JP3769942B2 (ja) * 1997-09-02 2006-04-26 セイコーエプソン株式会社 レーザー加工方法及び装置、並びに非導電性透明基板の回路形成方法及び装置
JPH11267873A (ja) * 1998-03-23 1999-10-05 Seiko Epson Corp レーザ光の走査光学系及びレーザ加工装置
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미국특허 5,798,927호(1998.08.25)
미국특허 5,847,960호(1998.12.08)

Also Published As

Publication number Publication date
GB2390699B (en) 2004-10-13
JP2011098394A (ja) 2011-05-19
KR20030091990A (ko) 2003-12-03
CN1491398A (zh) 2004-04-21
JP4833909B2 (ja) 2011-12-07
CA2438566A1 (en) 2002-08-29
JP4397163B2 (ja) 2010-01-13
CN1317667C (zh) 2007-05-23
WO2002067180A1 (en) 2002-08-29
GB0318352D0 (en) 2003-09-10
DE10296339T5 (de) 2004-04-15
GB2390699A (en) 2004-01-14
TW535199B (en) 2003-06-01
JP5055443B2 (ja) 2012-10-24
JP2007203375A (ja) 2007-08-16
CN101172319A (zh) 2008-05-07
JP2004527376A (ja) 2004-09-09

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