KR100808513B1 - 혼 홀더 요동형 본딩장치 - Google Patents

혼 홀더 요동형 본딩장치 Download PDF

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Publication number
KR100808513B1
KR100808513B1 KR1020070006522A KR20070006522A KR100808513B1 KR 100808513 B1 KR100808513 B1 KR 100808513B1 KR 1020070006522 A KR1020070006522 A KR 1020070006522A KR 20070006522 A KR20070006522 A KR 20070006522A KR 100808513 B1 KR100808513 B1 KR 100808513B1
Authority
KR
South Korea
Prior art keywords
horn holder
horn
holder
arc
support point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020070006522A
Other languages
English (en)
Korean (ko)
Other versions
KR20070091525A (ko
Inventor
고헤이 세야마
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20070091525A publication Critical patent/KR20070091525A/ko
Application granted granted Critical
Publication of KR100808513B1 publication Critical patent/KR100808513B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/904—Wire bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
KR1020070006522A 2006-03-06 2007-01-22 혼 홀더 요동형 본딩장치 Expired - Fee Related KR100808513B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006058925A JP4616779B2 (ja) 2006-03-06 2006-03-06 ホーンホルダ揺動型ボンディング装置
JPJP-P-2006-00058925 2006-03-06

Publications (2)

Publication Number Publication Date
KR20070091525A KR20070091525A (ko) 2007-09-11
KR100808513B1 true KR100808513B1 (ko) 2008-02-29

Family

ID=38470644

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070006522A Expired - Fee Related KR100808513B1 (ko) 2006-03-06 2007-01-22 혼 홀더 요동형 본딩장치

Country Status (4)

Country Link
US (2) US7578421B2 (https=)
JP (1) JP4616779B2 (https=)
KR (1) KR100808513B1 (https=)
TW (1) TW200805527A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5085801B1 (ja) * 2012-04-10 2012-11-28 新興機械株式会社 超音波接合装置
EP4357067A4 (en) * 2022-08-31 2025-07-09 Wuxi Lead Intelligent Equipment Co Ltd TAB WELDING DEVICE

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030079700A (ko) * 2002-04-02 2003-10-10 가부시키가이샤 신가와 본딩장치
KR20030091703A (ko) * 2002-05-23 2003-12-03 가부시키가이샤 신가와 본딩장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3901475C2 (de) * 1989-01-19 1994-07-14 Danfoss As Fluidgesteuerte Servoanordnung
JP2588068B2 (ja) * 1991-02-27 1997-03-05 株式会社カイジョー ワイヤボンディング装置及びその方法
JPH09326424A (ja) * 1996-06-06 1997-12-16 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
JP3654261B2 (ja) * 2002-05-09 2005-06-02 松下電器産業株式会社 電子部品のボンディング装置およびボンディングツール
JP4010186B2 (ja) * 2002-05-30 2007-11-21 日本電気株式会社 ボンディング装置
JP4141394B2 (ja) * 2004-02-20 2008-08-27 株式会社新川 ボンディングアーム揺動型ボンディング装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030079700A (ko) * 2002-04-02 2003-10-10 가부시키가이샤 신가와 본딩장치
KR20030091703A (ko) * 2002-05-23 2003-12-03 가부시키가이샤 신가와 본딩장치

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
한국특허공개공보 1020030079700호
한국특허공개공보 1020030091703호

Also Published As

Publication number Publication date
TWI342056B (https=) 2011-05-11
US7578421B2 (en) 2009-08-25
JP4616779B2 (ja) 2011-01-19
US20090272498A1 (en) 2009-11-05
JP2007242657A (ja) 2007-09-20
US20070205252A1 (en) 2007-09-06
KR20070091525A (ko) 2007-09-11
TW200805527A (en) 2008-01-16

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