KR100796883B1 - 밀착성의 평가 방법 - Google Patents

밀착성의 평가 방법

Info

Publication number
KR100796883B1
KR100796883B1 KR1020067006019A KR20067006019A KR100796883B1 KR 100796883 B1 KR100796883 B1 KR 100796883B1 KR 1020067006019 A KR1020067006019 A KR 1020067006019A KR 20067006019 A KR20067006019 A KR 20067006019A KR 100796883 B1 KR100796883 B1 KR 100796883B1
Authority
KR
South Korea
Prior art keywords
resin
mold
oxide
low
adhesion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020067006019A
Other languages
English (en)
Korean (ko)
Other versions
KR20060056402A (ko
Inventor
타카키 쿠노
케이지 마에다
요시노리 노구치
사토시 키타오카
나오키 카와시마
세이이치 수다
마사토 요시야
노리오 야마구치
Original Assignee
토와 가부시기가이샤
자이단호진 화인 세라믹스 센터
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토와 가부시기가이샤, 자이단호진 화인 세라믹스 센터 filed Critical 토와 가부시기가이샤
Publication of KR20060056402A publication Critical patent/KR20060056402A/ko
Application granted granted Critical
Publication of KR100796883B1 publication Critical patent/KR100796883B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
KR1020067006019A 2004-03-26 2005-03-03 밀착성의 평가 방법 Expired - Fee Related KR100796883B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004090894A JP3996138B2 (ja) 2004-03-26 2004-03-26 低密着性材料及び樹脂成形型
JPJP-P-2004-00090894 2004-03-26

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020077017541A Division KR100840831B1 (ko) 2004-03-26 2005-03-03 수지 성형용 틀

Publications (2)

Publication Number Publication Date
KR20060056402A KR20060056402A (ko) 2006-05-24
KR100796883B1 true KR100796883B1 (ko) 2008-01-22

Family

ID=35056055

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020067006019A Expired - Fee Related KR100796883B1 (ko) 2004-03-26 2005-03-03 밀착성의 평가 방법
KR1020077017541A Expired - Fee Related KR100840831B1 (ko) 2004-03-26 2005-03-03 수지 성형용 틀

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020077017541A Expired - Fee Related KR100840831B1 (ko) 2004-03-26 2005-03-03 수지 성형용 틀

Country Status (7)

Country Link
US (4) US7614293B2 (enExample)
EP (1) EP1728611A4 (enExample)
JP (1) JP3996138B2 (enExample)
KR (2) KR100796883B1 (enExample)
CN (2) CN101264648B (enExample)
TW (1) TW200600307A (enExample)
WO (1) WO2005092587A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3996138B2 (ja) * 2004-03-26 2007-10-24 Ｔｏｗａ株式会社 低密着性材料及び樹脂成形型
JP2006131429A (ja) 2004-11-02 2006-05-25 Towa Corp 低密着性材料及び樹脂成形型
JP3974152B2 (ja) * 2006-01-26 2007-09-12 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料
JP4230492B2 (ja) 2006-04-11 2009-02-25 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料
FR2907638B1 (fr) * 2006-10-30 2009-01-23 Jacquet Panification Procede de fabrication de produits de boulangerie,tels que pain de mie et produits cuits ainsi obtenus
JP5554898B2 (ja) * 2008-03-24 2014-07-23 Ｔｏｗａ株式会社 低密着性材料及びその製造方法、成形型及びその製造方法、並びに、防汚性材料及びその製造方法
JP5561992B2 (ja) * 2009-10-09 2014-07-30 Ｔｏｗａ株式会社 低密着性材料、防汚性材料、成形型、及び、それらの製造方法
KR102149448B1 (ko) * 2014-02-21 2020-08-28 삼성전자주식회사 이미지를 처리하기 위한 전자 장치 및 방법
JP6462454B2 (ja) * 2015-03-30 2019-01-30 Ｔｏｗａ株式会社 成形型および低密着性材料
DE102015206995B4 (de) * 2015-04-17 2024-02-22 Robert Bosch Gmbh Verfahren zur Bestimmung der Haftfestigkeit von Schichten eines keramischen Sensorelements zur Erfassung mindestens einer Eigenschaft eines Messgases in einem Messgasraum
CN111948136B (zh) * 2020-08-25 2023-07-07 温州大学 一种树脂钻剥离强度检测方法及其制样设备
CN112351591B (zh) * 2020-11-17 2022-05-27 中国电子科技集团公司第四十六研究所 高抗剥强度的聚四氟乙烯基微波复合介质材料基板制备方法
CN113405986B (zh) * 2021-06-11 2023-09-08 深圳技术大学 精密玻璃模压界面粘结强度表征和控制方法

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JPH0338314A (ja) * 1989-07-05 1991-02-19 Souzou Kagaku:Kk 成形金型
JPH05215668A (ja) * 1990-12-19 1993-08-24 Sumitomo Bakelite Co Ltd 半導体封止用成形材料の離型性評価方法
JPH1164211A (ja) * 1997-08-22 1999-03-05 Central Res Inst Of Electric Power Ind 皮膜の密着性評価方法
KR20020008759A (ko) * 2000-07-21 2002-01-31 쇼지 고메이 고정밀 미세한 방현성 하드코트필름

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SU1073691A1 (ru) * 1982-08-25 1984-02-15 Предприятие П/Я В-8616 Способ определени адгезионной прочности
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US4703806A (en) * 1986-07-11 1987-11-03 Howmet Turbine Components Corporation Ceramic shell mold facecoat and core coating systems for investment casting of reactive metals
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JPH04211912A (ja) * 1990-01-10 1992-08-03 Taiyo Kosakusho:Kk 熱可塑性樹脂成形用金型
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JPH07187774A (ja) * 1993-12-24 1995-07-25 Shinagawa Refract Co Ltd 高強度ジルコニア質焼結体及びその製造方法並びに粉砕用部品材料及びセラミックスダイス
JPH07329099A (ja) 1994-06-03 1995-12-19 Sumitomo Bayer Urethane Kk ポリウレタン樹脂成形品を製造する方法
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JPH10277061A (ja) * 1997-04-04 1998-10-20 Injietsukusu:Kk 支台歯模型および歯冠修復物の製造方法
JP3472093B2 (ja) * 1997-08-15 2003-12-02 シャープ株式会社 カラー画像形成装置
JP4161423B2 (ja) * 1997-10-30 2008-10-08 住友電気工業株式会社 窒化アルミニウム焼結体及びそのメタライズ基板
US6619368B1 (en) * 1997-12-15 2003-09-16 Pcc Structurals, Inc. Method for imaging inclusions in investment castings
JP2001110801A (ja) * 1999-10-05 2001-04-20 Takeshi Yao パターン形成方法、並びに電子素子、光学素子及び回路基板
US6783719B2 (en) * 2001-01-19 2004-08-31 Korry Electronics, Co. Mold with metal oxide surface compatible with ionic release agents
TW552188B (en) * 2001-11-16 2003-09-11 Towa Corp Apparatus and method for evaluating degree of adhesion of adherents to mold surface, apparatus and method for surface treatment of mold surface and method and apparatus for cleaning mold used for molding resin
DE10208800A1 (de) * 2002-03-01 2003-09-18 Harald Fuchs Haftsensor zur berührungsfreien Messung der Haftungseigenschaften von Oberflächen
JP4065148B2 (ja) 2002-06-26 2008-03-19 Ｔｏｗａ株式会社 樹脂成形方法
JP2004146556A (ja) * 2002-10-24 2004-05-20 Towa Corp 樹脂封止方法、樹脂封止装置、及び樹脂シート
KR101168422B1 (ko) * 2002-11-20 2012-07-25 신에쓰 가가꾸 고교 가부시끼가이샤 내열성 피복 부재의 제조 방법
TWI262176B (en) * 2003-04-25 2006-09-21 Hon Hai Prec Ind Co Ltd Mold for molding optical glass products and method for making the mold
JP2005001239A (ja) * 2003-06-12 2005-01-06 Towa Corp 樹脂成形型用材料及び樹脂成形型
JP2005193610A (ja) * 2004-01-09 2005-07-21 Towa Corp 複合材料及び樹脂成形型
JP4518808B2 (ja) * 2004-02-09 2010-08-04 Ｔｏｗａ株式会社 導電性多孔質材料、その材料からなる樹脂成形型、及びその材料の製造方法
JP3996138B2 (ja) * 2004-03-26 2007-10-24 Ｔｏｗａ株式会社 低密着性材料及び樹脂成形型
JP2006131429A (ja) * 2004-11-02 2006-05-25 Towa Corp 低密着性材料及び樹脂成形型
JP4749707B2 (ja) * 2004-12-17 2011-08-17 Ｔｏｗａ株式会社 樹脂成形型及び樹脂成形方法
JP3974152B2 (ja) * 2006-01-26 2007-09-12 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料
JP4230492B2 (ja) * 2006-04-11 2009-02-25 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103078A (ja) * 1983-11-09 1985-06-07 日本タングステン株式会社 導電性ジルコニア基焼結材料及びその製造方法
JPH0338314A (ja) * 1989-07-05 1991-02-19 Souzou Kagaku:Kk 成形金型
JPH05215668A (ja) * 1990-12-19 1993-08-24 Sumitomo Bakelite Co Ltd 半導体封止用成形材料の離型性評価方法
JPH1164211A (ja) * 1997-08-22 1999-03-05 Central Res Inst Of Electric Power Ind 皮膜の密着性評価方法
KR20020008759A (ko) * 2000-07-21 2002-01-31 쇼지 고메이 고정밀 미세한 방현성 하드코트필름

Also Published As

Publication number Publication date
CN101264648A (zh) 2008-09-17
CN1842403A (zh) 2006-10-04
US7614293B2 (en) 2009-11-10
JP3996138B2 (ja) 2007-10-24
JP2005274478A (ja) 2005-10-06
TWI308517B (enExample) 2009-04-11
US20100012816A1 (en) 2010-01-21
CN100595047C (zh) 2010-03-24
CN101264648B (zh) 2012-09-19
TW200600307A (en) 2006-01-01
US20120076886A1 (en) 2012-03-29
WO2005092587A1 (ja) 2005-10-06
KR20060056402A (ko) 2006-05-24
EP1728611A1 (en) 2006-12-06
EP1728611A4 (en) 2013-09-18
US20080254286A1 (en) 2008-10-16
KR100840831B1 (ko) 2008-06-23
KR20070094017A (ko) 2007-09-19
US20110042857A1 (en) 2011-02-24

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