CN101264648B - 树脂成形模 - Google Patents

树脂成形模 Download PDF

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Publication number
CN101264648B
CN101264648B CN2008100922795A CN200810092279A CN101264648B CN 101264648 B CN101264648 B CN 101264648B CN 2008100922795 A CN2008100922795 A CN 2008100922795A CN 200810092279 A CN200810092279 A CN 200810092279A CN 101264648 B CN101264648 B CN 101264648B
Authority
CN
China
Prior art keywords
mold
resin
low
oxide
resin molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008100922795A
Other languages
English (en)
Chinese (zh)
Other versions
CN101264648A (zh
Inventor
久野孝希
前田启司
野口欣纪
北冈谕
川岛直树
须田圣一
吉矢真人
山口哲央
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Fine Ceramics Center
Towa Corp
Original Assignee
Japan Fine Ceramics Center
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Fine Ceramics Center, Towa Corp filed Critical Japan Fine Ceramics Center
Publication of CN101264648A publication Critical patent/CN101264648A/zh
Application granted granted Critical
Publication of CN101264648B publication Critical patent/CN101264648B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
CN2008100922795A 2004-03-26 2005-03-03 树脂成形模 Expired - Fee Related CN101264648B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-090894 2004-03-26
JP2004090894A JP3996138B2 (ja) 2004-03-26 2004-03-26 低密着性材料及び樹脂成形型

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN200580001025A Division CN100595047C (zh) 2004-03-26 2005-03-03 粘附性的评价方法

Publications (2)

Publication Number Publication Date
CN101264648A CN101264648A (zh) 2008-09-17
CN101264648B true CN101264648B (zh) 2012-09-19

Family

ID=35056055

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2008100922795A Expired - Fee Related CN101264648B (zh) 2004-03-26 2005-03-03 树脂成形模
CN200580001025A Expired - Fee Related CN100595047C (zh) 2004-03-26 2005-03-03 粘附性的评价方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN200580001025A Expired - Fee Related CN100595047C (zh) 2004-03-26 2005-03-03 粘附性的评价方法

Country Status (7)

Country Link
US (4) US7614293B2 (enExample)
EP (1) EP1728611A4 (enExample)
JP (1) JP3996138B2 (enExample)
KR (2) KR100796883B1 (enExample)
CN (2) CN101264648B (enExample)
TW (1) TW200600307A (enExample)
WO (1) WO2005092587A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3996138B2 (ja) * 2004-03-26 2007-10-24 Ｔｏｗａ株式会社 低密着性材料及び樹脂成形型
JP2006131429A (ja) 2004-11-02 2006-05-25 Towa Corp 低密着性材料及び樹脂成形型
JP3974152B2 (ja) * 2006-01-26 2007-09-12 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料
JP4230492B2 (ja) 2006-04-11 2009-02-25 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料
FR2907638B1 (fr) * 2006-10-30 2009-01-23 Jacquet Panification Procede de fabrication de produits de boulangerie,tels que pain de mie et produits cuits ainsi obtenus
JP5554898B2 (ja) * 2008-03-24 2014-07-23 Ｔｏｗａ株式会社 低密着性材料及びその製造方法、成形型及びその製造方法、並びに、防汚性材料及びその製造方法
JP5561992B2 (ja) * 2009-10-09 2014-07-30 Ｔｏｗａ株式会社 低密着性材料、防汚性材料、成形型、及び、それらの製造方法
KR102149448B1 (ko) * 2014-02-21 2020-08-28 삼성전자주식회사 이미지를 처리하기 위한 전자 장치 및 방법
JP6462454B2 (ja) * 2015-03-30 2019-01-30 Ｔｏｗａ株式会社 成形型および低密着性材料
DE102015206995B4 (de) * 2015-04-17 2024-02-22 Robert Bosch Gmbh Verfahren zur Bestimmung der Haftfestigkeit von Schichten eines keramischen Sensorelements zur Erfassung mindestens einer Eigenschaft eines Messgases in einem Messgasraum
CN111948136B (zh) * 2020-08-25 2023-07-07 温州大学 一种树脂钻剥离强度检测方法及其制样设备
CN112351591B (zh) * 2020-11-17 2022-05-27 中国电子科技集团公司第四十六研究所 高抗剥强度的聚四氟乙烯基微波复合介质材料基板制备方法
CN113405986B (zh) * 2021-06-11 2023-09-08 深圳技术大学 精密玻璃模压界面粘结强度表征和控制方法

Citations (1)

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Publication number Priority date Publication date Assignee Title
CN1131605A (zh) * 1994-11-17 1996-09-25 株式会社日立制作所 模塑方法与模塑设备

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JP4065148B2 (ja) 2002-06-26 2008-03-19 Ｔｏｗａ株式会社 樹脂成形方法
JP2004146556A (ja) * 2002-10-24 2004-05-20 Towa Corp 樹脂封止方法、樹脂封止装置、及び樹脂シート
KR101168422B1 (ko) * 2002-11-20 2012-07-25 신에쓰 가가꾸 고교 가부시끼가이샤 내열성 피복 부재의 제조 방법
TWI262176B (en) * 2003-04-25 2006-09-21 Hon Hai Prec Ind Co Ltd Mold for molding optical glass products and method for making the mold
JP2005001239A (ja) * 2003-06-12 2005-01-06 Towa Corp 樹脂成形型用材料及び樹脂成形型
JP2005193610A (ja) * 2004-01-09 2005-07-21 Towa Corp 複合材料及び樹脂成形型
JP4518808B2 (ja) * 2004-02-09 2010-08-04 Ｔｏｗａ株式会社 導電性多孔質材料、その材料からなる樹脂成形型、及びその材料の製造方法
JP3996138B2 (ja) * 2004-03-26 2007-10-24 Ｔｏｗａ株式会社 低密着性材料及び樹脂成形型
JP2006131429A (ja) * 2004-11-02 2006-05-25 Towa Corp 低密着性材料及び樹脂成形型
JP4749707B2 (ja) * 2004-12-17 2011-08-17 Ｔｏｗａ株式会社 樹脂成形型及び樹脂成形方法
JP3974152B2 (ja) * 2006-01-26 2007-09-12 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料
JP4230492B2 (ja) * 2006-04-11 2009-02-25 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1131605A (zh) * 1994-11-17 1996-09-25 株式会社日立制作所 模塑方法与模塑设备

Also Published As

Publication number Publication date
CN101264648A (zh) 2008-09-17
CN1842403A (zh) 2006-10-04
US7614293B2 (en) 2009-11-10
JP3996138B2 (ja) 2007-10-24
KR100796883B1 (ko) 2008-01-22
JP2005274478A (ja) 2005-10-06
TWI308517B (enExample) 2009-04-11
US20100012816A1 (en) 2010-01-21
CN100595047C (zh) 2010-03-24
TW200600307A (en) 2006-01-01
US20120076886A1 (en) 2012-03-29
WO2005092587A1 (ja) 2005-10-06
KR20060056402A (ko) 2006-05-24
EP1728611A1 (en) 2006-12-06
EP1728611A4 (en) 2013-09-18
US20080254286A1 (en) 2008-10-16
KR100840831B1 (ko) 2008-06-23
KR20070094017A (ko) 2007-09-19
US20110042857A1 (en) 2011-02-24

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SE01 Entry into force of request for substantive examination
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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120919

Termination date: 20180303