JP3996138B2 - 低密着性材料及び樹脂成形型 - Google Patents

低密着性材料及び樹脂成形型 Download PDF

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Publication number
JP3996138B2
JP3996138B2 JP2004090894A JP2004090894A JP3996138B2 JP 3996138 B2 JP3996138 B2 JP 3996138B2 JP 2004090894 A JP2004090894 A JP 2004090894A JP 2004090894 A JP2004090894 A JP 2004090894A JP 3996138 B2 JP3996138 B2 JP 3996138B2
Authority
JP
Japan
Prior art keywords
resin
mold
low adhesion
oxide
adhesion material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004090894A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005274478A (ja
Inventor
孝希 久野
啓司 前田
欣紀 野口
諭 北岡
直樹 川島
聖一 須田
真人 吉矢
哲央 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Fine Ceramics Center
Towa Corp
Original Assignee
Japan Fine Ceramics Center
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2004090894A priority Critical patent/JP3996138B2/ja
Application filed by Japan Fine Ceramics Center, Towa Corp filed Critical Japan Fine Ceramics Center
Priority to US10/571,683 priority patent/US7614293B2/en
Priority to KR1020077017541A priority patent/KR100840831B1/ko
Priority to CN200580001025A priority patent/CN100595047C/zh
Priority to CN2008100922795A priority patent/CN101264648B/zh
Priority to KR1020067006019A priority patent/KR100796883B1/ko
Priority to EP05719881.4A priority patent/EP1728611A4/en
Priority to PCT/JP2005/003577 priority patent/WO2005092587A1/ja
Priority to TW094107311A priority patent/TW200600307A/zh
Publication of JP2005274478A publication Critical patent/JP2005274478A/ja
Application granted granted Critical
Publication of JP3996138B2 publication Critical patent/JP3996138B2/ja
Priority to US12/568,585 priority patent/US20100012816A1/en
Priority to US12/914,371 priority patent/US20110042857A1/en
Priority to US13/307,768 priority patent/US20120076886A1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
JP2004090894A 2004-03-26 2004-03-26 低密着性材料及び樹脂成形型 Expired - Fee Related JP3996138B2 (ja)

Priority Applications (12)

Application Number Priority Date Filing Date Title
JP2004090894A JP3996138B2 (ja) 2004-03-26 2004-03-26 低密着性材料及び樹脂成形型
PCT/JP2005/003577 WO2005092587A1 (ja) 2004-03-26 2005-03-03 密着性の評価方法、低密着性材料、および樹脂成形型
CN200580001025A CN100595047C (zh) 2004-03-26 2005-03-03 粘附性的评价方法
CN2008100922795A CN101264648B (zh) 2004-03-26 2005-03-03 树脂成形模
KR1020067006019A KR100796883B1 (ko) 2004-03-26 2005-03-03 밀착성의 평가 방법
EP05719881.4A EP1728611A4 (en) 2004-03-26 2005-03-03 METHOD FOR EVALUATING LIABILITY, LOW-LIABLE MATERIAL AND RESIN MOLDING MATERIAL
US10/571,683 US7614293B2 (en) 2004-03-26 2005-03-03 Method of evaluating adhesion property, low-adhesion material, and mold for molding resin
KR1020077017541A KR100840831B1 (ko) 2004-03-26 2005-03-03 수지 성형용 틀
TW094107311A TW200600307A (en) 2004-03-26 2005-03-10 Method of evaluating adherence, material of low adherence and resin shaping die
US12/568,585 US20100012816A1 (en) 2004-03-26 2009-09-28 Method of evaluating adhesion property, low-adhesion material, and mold for molding resin
US12/914,371 US20110042857A1 (en) 2004-03-26 2010-10-28 Method of evaluating adhesion property, low-adhesion material, and mold for molding resin
US13/307,768 US20120076886A1 (en) 2004-03-26 2011-11-30 Method of evaluating adhesion property, low-adhesion material, and mold for molding resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004090894A JP3996138B2 (ja) 2004-03-26 2004-03-26 低密着性材料及び樹脂成形型

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007065227A Division JP4134238B2 (ja) 2007-03-14 2007-03-14 密着性の評価方法

Publications (2)

Publication Number Publication Date
JP2005274478A JP2005274478A (ja) 2005-10-06
JP3996138B2 true JP3996138B2 (ja) 2007-10-24

Family

ID=35056055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004090894A Expired - Fee Related JP3996138B2 (ja) 2004-03-26 2004-03-26 低密着性材料及び樹脂成形型

Country Status (7)

Country Link
US (4) US7614293B2 (enExample)
EP (1) EP1728611A4 (enExample)
JP (1) JP3996138B2 (enExample)
KR (2) KR100840831B1 (enExample)
CN (2) CN101264648B (enExample)
TW (1) TW200600307A (enExample)
WO (1) WO2005092587A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3996138B2 (ja) * 2004-03-26 2007-10-24 Ｔｏｗａ株式会社 低密着性材料及び樹脂成形型
JP2006131429A (ja) 2004-11-02 2006-05-25 Towa Corp 低密着性材料及び樹脂成形型
JP3974152B2 (ja) * 2006-01-26 2007-09-12 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料
JP4230492B2 (ja) * 2006-04-11 2009-02-25 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料
FR2907638B1 (fr) * 2006-10-30 2009-01-23 Jacquet Panification Procede de fabrication de produits de boulangerie,tels que pain de mie et produits cuits ainsi obtenus
JP5554898B2 (ja) * 2008-03-24 2014-07-23 Ｔｏｗａ株式会社 低密着性材料及びその製造方法、成形型及びその製造方法、並びに、防汚性材料及びその製造方法
JP5561992B2 (ja) * 2009-10-09 2014-07-30 Ｔｏｗａ株式会社 低密着性材料、防汚性材料、成形型、及び、それらの製造方法
KR102149448B1 (ko) * 2014-02-21 2020-08-28 삼성전자주식회사 이미지를 처리하기 위한 전자 장치 및 방법
JP6462454B2 (ja) * 2015-03-30 2019-01-30 Ｔｏｗａ株式会社 成形型および低密着性材料
DE102015206995B4 (de) * 2015-04-17 2024-02-22 Robert Bosch Gmbh Verfahren zur Bestimmung der Haftfestigkeit von Schichten eines keramischen Sensorelements zur Erfassung mindestens einer Eigenschaft eines Messgases in einem Messgasraum
CN111948136B (zh) * 2020-08-25 2023-07-07 温州大学 一种树脂钻剥离强度检测方法及其制样设备
CN112351591B (zh) * 2020-11-17 2022-05-27 中国电子科技集团公司第四十六研究所 高抗剥强度的聚四氟乙烯基微波复合介质材料基板制备方法
CN113405986B (zh) * 2021-06-11 2023-09-08 深圳技术大学 精密玻璃模压界面粘结强度表征和控制方法

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3447936A (en) * 1965-10-07 1969-06-03 Blaw Knox Co Mold coating composition,particularly for centrifugal molds
EP0078525A2 (en) * 1981-10-30 1983-05-11 Aktieselskabet Aalborg Portland-Cement-Fabrik A method of improving characteristic of a body
SU1073691A1 (ru) * 1982-08-25 1984-02-15 Предприятие П/Я В-8616 Способ определени адгезионной прочности
JPS60103078A (ja) 1983-11-09 1985-06-07 日本タングステン株式会社 導電性ジルコニア基焼結材料及びその製造方法
EP0204674B1 (en) * 1985-06-06 1991-12-27 Remet Corporation Casting of reactive metals into ceramic molds
US4703806A (en) * 1986-07-11 1987-11-03 Howmet Turbine Components Corporation Ceramic shell mold facecoat and core coating systems for investment casting of reactive metals
US5535811A (en) * 1987-01-28 1996-07-16 Remet Corporation Ceramic shell compositions for casting of reactive metals
DE68915146T2 (de) * 1988-07-15 1994-09-15 Toshiba Tungaloy Co Ltd Giessform zum giessen optischer teile sowie verfahren zur herstellung.
JPH0338314A (ja) * 1989-07-05 1991-02-19 Souzou Kagaku:Kk 成形金型
EP0437345A3 (en) * 1990-01-10 1992-08-19 Taiyo Manufacturing Works Co., Ltd. Mold used for fabricating thermoplastic resin articles
JPH04211912A (ja) * 1990-01-10 1992-08-03 Taiyo Kosakusho:Kk 熱可塑性樹脂成形用金型
JPH05215668A (ja) * 1990-12-19 1993-08-24 Sumitomo Bakelite Co Ltd 半導体封止用成形材料の離型性評価方法
JP3212124B2 (ja) * 1991-04-04 2001-09-25 川崎製鉄株式会社 高融点金属鋳造用のロストワックス鋳型フェースコート材料およびそれを用いた鋳型による鋳造品の製造方法
JPH07187774A (ja) * 1993-12-24 1995-07-25 Shinagawa Refract Co Ltd 高強度ジルコニア質焼結体及びその製造方法並びに粉砕用部品材料及びセラミックスダイス
JPH07329099A (ja) 1994-06-03 1995-12-19 Sumitomo Bayer Urethane Kk ポリウレタン樹脂成形品を製造する方法
TW302527B (enExample) * 1994-11-17 1997-04-11 Hitachi Ltd
CN1131605A (zh) * 1994-11-17 1996-09-25 株式会社日立制作所 模塑方法与模塑设备
US5741446A (en) * 1995-05-26 1998-04-21 Mitsubishi Engineering-Plastics Corp. Method of producing a molded article using a mold assembly with an insert block
JPH10277061A (ja) * 1997-04-04 1998-10-20 Injietsukusu:Kk 支台歯模型および歯冠修復物の製造方法
JP3472093B2 (ja) * 1997-08-15 2003-12-02 シャープ株式会社 カラー画像形成装置
JPH1164211A (ja) 1997-08-22 1999-03-05 Central Res Inst Of Electric Power Ind 皮膜の密着性評価方法
JP4161423B2 (ja) * 1997-10-30 2008-10-08 住友電気工業株式会社 窒化アルミニウム焼結体及びそのメタライズ基板
US6619368B1 (en) * 1997-12-15 2003-09-16 Pcc Structurals, Inc. Method for imaging inclusions in investment castings
JP2001110801A (ja) * 1999-10-05 2001-04-20 Takeshi Yao パターン形成方法、並びに電子素子、光学素子及び回路基板
JP3862941B2 (ja) 2000-07-21 2006-12-27 リンテック株式会社 高精細防眩性ハードコートフィルム
US6783719B2 (en) * 2001-01-19 2004-08-31 Korry Electronics, Co. Mold with metal oxide surface compatible with ionic release agents
TW552188B (en) * 2001-11-16 2003-09-11 Towa Corp Apparatus and method for evaluating degree of adhesion of adherents to mold surface, apparatus and method for surface treatment of mold surface and method and apparatus for cleaning mold used for molding resin
DE10208800A1 (de) * 2002-03-01 2003-09-18 Harald Fuchs Haftsensor zur berührungsfreien Messung der Haftungseigenschaften von Oberflächen
JP4065148B2 (ja) 2002-06-26 2008-03-19 Ｔｏｗａ株式会社 樹脂成形方法
JP2004146556A (ja) * 2002-10-24 2004-05-20 Towa Corp 樹脂封止方法、樹脂封止装置、及び樹脂シート
US7507481B2 (en) * 2002-11-20 2009-03-24 Shin-Etsu Chemical Co., Ltd. Heat resistant coated member, making method, and treatment using the same
TWI262176B (en) * 2003-04-25 2006-09-21 Hon Hai Prec Ind Co Ltd Mold for molding optical glass products and method for making the mold
JP2005001239A (ja) * 2003-06-12 2005-01-06 Towa Corp 樹脂成形型用材料及び樹脂成形型
JP2005193610A (ja) * 2004-01-09 2005-07-21 Towa Corp 複合材料及び樹脂成形型
JP4518808B2 (ja) * 2004-02-09 2010-08-04 Ｔｏｗａ株式会社 導電性多孔質材料、その材料からなる樹脂成形型、及びその材料の製造方法
JP3996138B2 (ja) * 2004-03-26 2007-10-24 Ｔｏｗａ株式会社 低密着性材料及び樹脂成形型
JP2006131429A (ja) * 2004-11-02 2006-05-25 Towa Corp 低密着性材料及び樹脂成形型
JP4749707B2 (ja) * 2004-12-17 2011-08-17 Ｔｏｗａ株式会社 樹脂成形型及び樹脂成形方法
JP3974152B2 (ja) * 2006-01-26 2007-09-12 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料
JP4230492B2 (ja) * 2006-04-11 2009-02-25 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料

Also Published As

Publication number Publication date
JP2005274478A (ja) 2005-10-06
KR20060056402A (ko) 2006-05-24
CN101264648A (zh) 2008-09-17
WO2005092587A1 (ja) 2005-10-06
KR20070094017A (ko) 2007-09-19
US7614293B2 (en) 2009-11-10
EP1728611A4 (en) 2013-09-18
CN100595047C (zh) 2010-03-24
US20120076886A1 (en) 2012-03-29
TWI308517B (enExample) 2009-04-11
CN101264648B (zh) 2012-09-19
US20080254286A1 (en) 2008-10-16
TW200600307A (en) 2006-01-01
CN1842403A (zh) 2006-10-04
EP1728611A1 (en) 2006-12-06
KR100840831B1 (ko) 2008-06-23
US20110042857A1 (en) 2011-02-24
US20100012816A1 (en) 2010-01-21
KR100796883B1 (ko) 2008-01-22

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