TW200600307A - Method of evaluating adherence, material of low adherence and resin shaping die - Google Patents

Method of evaluating adherence, material of low adherence and resin shaping die

Info

Publication number
TW200600307A
TW200600307A TW094107311A TW94107311A TW200600307A TW 200600307 A TW200600307 A TW 200600307A TW 094107311 A TW094107311 A TW 094107311A TW 94107311 A TW94107311 A TW 94107311A TW 200600307 A TW200600307 A TW 200600307A
Authority
TW
Taiwan
Prior art keywords
die
adherence
release property
resin
evaluating
Prior art date
Application number
TW094107311A
Other languages
English (en)
Chinese (zh)
Other versions
TWI308517B (enExample
Inventor
Takaki Kuno
Keiji Maeda
Yoshinori Noguchi
Satoshi Kitaoka
Naoki Kawashima
Seiichi Suda
Masato Yoshiya
Norio Yamaguchi
Original Assignee
Towa Corp
Japan Fine Ceramics Ct
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp, Japan Fine Ceramics Ct filed Critical Towa Corp
Publication of TW200600307A publication Critical patent/TW200600307A/zh
Application granted granted Critical
Publication of TWI308517B publication Critical patent/TWI308517B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
TW094107311A 2004-03-26 2005-03-10 Method of evaluating adherence, material of low adherence and resin shaping die TW200600307A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004090894A JP3996138B2 (ja) 2004-03-26 2004-03-26 低密着性材料及び樹脂成形型

Publications (2)

Publication Number Publication Date
TW200600307A true TW200600307A (en) 2006-01-01
TWI308517B TWI308517B (enExample) 2009-04-11

Family

ID=35056055

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094107311A TW200600307A (en) 2004-03-26 2005-03-10 Method of evaluating adherence, material of low adherence and resin shaping die

Country Status (7)

Country Link
US (4) US7614293B2 (enExample)
EP (1) EP1728611A4 (enExample)
JP (1) JP3996138B2 (enExample)
KR (2) KR100840831B1 (enExample)
CN (2) CN100595047C (enExample)
TW (1) TW200600307A (enExample)
WO (1) WO2005092587A1 (enExample)

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JP3996138B2 (ja) * 2004-03-26 2007-10-24 Ｔｏｗａ株式会社 低密着性材料及び樹脂成形型
JP2006131429A (ja) 2004-11-02 2006-05-25 Towa Corp 低密着性材料及び樹脂成形型
JP3974152B2 (ja) * 2006-01-26 2007-09-12 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料
JP4230492B2 (ja) 2006-04-11 2009-02-25 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料
FR2907638B1 (fr) * 2006-10-30 2009-01-23 Jacquet Panification Procede de fabrication de produits de boulangerie,tels que pain de mie et produits cuits ainsi obtenus
JP5554898B2 (ja) * 2008-03-24 2014-07-23 Ｔｏｗａ株式会社 低密着性材料及びその製造方法、成形型及びその製造方法、並びに、防汚性材料及びその製造方法
JP5561992B2 (ja) * 2009-10-09 2014-07-30 Ｔｏｗａ株式会社 低密着性材料、防汚性材料、成形型、及び、それらの製造方法
KR102149448B1 (ko) * 2014-02-21 2020-08-28 삼성전자주식회사 이미지를 처리하기 위한 전자 장치 및 방법
JP6462454B2 (ja) * 2015-03-30 2019-01-30 Ｔｏｗａ株式会社 成形型および低密着性材料
DE102015206995B4 (de) * 2015-04-17 2024-02-22 Robert Bosch Gmbh Verfahren zur Bestimmung der Haftfestigkeit von Schichten eines keramischen Sensorelements zur Erfassung mindestens einer Eigenschaft eines Messgases in einem Messgasraum
CN111948136B (zh) * 2020-08-25 2023-07-07 温州大学 一种树脂钻剥离强度检测方法及其制样设备
CN112351591B (zh) * 2020-11-17 2022-05-27 中国电子科技集团公司第四十六研究所 高抗剥强度的聚四氟乙烯基微波复合介质材料基板制备方法
CN113405986B (zh) * 2021-06-11 2023-09-08 深圳技术大学 精密玻璃模压界面粘结强度表征和控制方法

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JP3996138B2 (ja) * 2004-03-26 2007-10-24 Ｔｏｗａ株式会社 低密着性材料及び樹脂成形型
JP2006131429A (ja) * 2004-11-02 2006-05-25 Towa Corp 低密着性材料及び樹脂成形型
JP4749707B2 (ja) * 2004-12-17 2011-08-17 Ｔｏｗａ株式会社 樹脂成形型及び樹脂成形方法
JP3974152B2 (ja) * 2006-01-26 2007-09-12 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料
JP4230492B2 (ja) * 2006-04-11 2009-02-25 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料

Also Published As

Publication number Publication date
CN1842403A (zh) 2006-10-04
US20120076886A1 (en) 2012-03-29
US20080254286A1 (en) 2008-10-16
CN100595047C (zh) 2010-03-24
TWI308517B (enExample) 2009-04-11
US7614293B2 (en) 2009-11-10
KR100796883B1 (ko) 2008-01-22
KR20060056402A (ko) 2006-05-24
JP2005274478A (ja) 2005-10-06
EP1728611A1 (en) 2006-12-06
JP3996138B2 (ja) 2007-10-24
CN101264648B (zh) 2012-09-19
EP1728611A4 (en) 2013-09-18
KR100840831B1 (ko) 2008-06-23
CN101264648A (zh) 2008-09-17
KR20070094017A (ko) 2007-09-19
WO2005092587A1 (ja) 2005-10-06
US20110042857A1 (en) 2011-02-24
US20100012816A1 (en) 2010-01-21

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees