KR100840831B1 - 수지 성형용 틀 - Google Patents

수지 성형용 틀

Info

Publication number
KR100840831B1
KR100840831B1 KR1020077017541A KR20077017541A KR100840831B1 KR 100840831 B1 KR100840831 B1 KR 100840831B1 KR 1020077017541 A KR1020077017541 A KR 1020077017541A KR 20077017541 A KR20077017541 A KR 20077017541A KR 100840831 B1 KR100840831 B1 KR 100840831B1
Authority
KR
South Korea
Prior art keywords
resin
mold
oxide
low
adhesion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020077017541A
Other languages
English (en)
Korean (ko)
Other versions
KR20070094017A (ko
Inventor
타카키 쿠노
케이지 마에다
요시노리 노구치
사토시 키타오카
나오키 카와시마
세이이치 수다
마사토 요시야
노리오 야마구치
Original Assignee
토와 가부시기가이샤
자이단호진 화인 세라믹스 센터
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토와 가부시기가이샤, 자이단호진 화인 세라믹스 센터 filed Critical 토와 가부시기가이샤
Publication of KR20070094017A publication Critical patent/KR20070094017A/ko
Application granted granted Critical
Publication of KR100840831B1 publication Critical patent/KR100840831B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
KR1020077017541A 2004-03-26 2005-03-03 수지 성형용 틀 Expired - Fee Related KR100840831B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00090894 2004-03-26
JP2004090894A JP3996138B2 (ja) 2004-03-26 2004-03-26 低密着性材料及び樹脂成形型

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020067006019A Division KR100796883B1 (ko) 2004-03-26 2005-03-03 밀착성의 평가 방법

Publications (2)

Publication Number Publication Date
KR20070094017A KR20070094017A (ko) 2007-09-19
KR100840831B1 true KR100840831B1 (ko) 2008-06-23

Family

ID=35056055

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020077017541A Expired - Fee Related KR100840831B1 (ko) 2004-03-26 2005-03-03 수지 성형용 틀
KR1020067006019A Expired - Fee Related KR100796883B1 (ko) 2004-03-26 2005-03-03 밀착성의 평가 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020067006019A Expired - Fee Related KR100796883B1 (ko) 2004-03-26 2005-03-03 밀착성의 평가 방법

Country Status (7)

Country Link
US (4) US7614293B2 (enExample)
EP (1) EP1728611A4 (enExample)
JP (1) JP3996138B2 (enExample)
KR (2) KR100840831B1 (enExample)
CN (2) CN100595047C (enExample)
TW (1) TW200600307A (enExample)
WO (1) WO2005092587A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3996138B2 (ja) * 2004-03-26 2007-10-24 Ｔｏｗａ株式会社 低密着性材料及び樹脂成形型
JP2006131429A (ja) 2004-11-02 2006-05-25 Towa Corp 低密着性材料及び樹脂成形型
JP3974152B2 (ja) * 2006-01-26 2007-09-12 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料
JP4230492B2 (ja) 2006-04-11 2009-02-25 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料
FR2907638B1 (fr) * 2006-10-30 2009-01-23 Jacquet Panification Procede de fabrication de produits de boulangerie,tels que pain de mie et produits cuits ainsi obtenus
JP5554898B2 (ja) * 2008-03-24 2014-07-23 Ｔｏｗａ株式会社 低密着性材料及びその製造方法、成形型及びその製造方法、並びに、防汚性材料及びその製造方法
JP5561992B2 (ja) * 2009-10-09 2014-07-30 Ｔｏｗａ株式会社 低密着性材料、防汚性材料、成形型、及び、それらの製造方法
KR102149448B1 (ko) * 2014-02-21 2020-08-28 삼성전자주식회사 이미지를 처리하기 위한 전자 장치 및 방법
JP6462454B2 (ja) * 2015-03-30 2019-01-30 Ｔｏｗａ株式会社 成形型および低密着性材料
DE102015206995B4 (de) * 2015-04-17 2024-02-22 Robert Bosch Gmbh Verfahren zur Bestimmung der Haftfestigkeit von Schichten eines keramischen Sensorelements zur Erfassung mindestens einer Eigenschaft eines Messgases in einem Messgasraum
CN111948136B (zh) * 2020-08-25 2023-07-07 温州大学 一种树脂钻剥离强度检测方法及其制样设备
CN112351591B (zh) * 2020-11-17 2022-05-27 中国电子科技集团公司第四十六研究所 高抗剥强度的聚四氟乙烯基微波复合介质材料基板制备方法
CN113405986B (zh) * 2021-06-11 2023-09-08 深圳技术大学 精密玻璃模压界面粘结强度表征和控制方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103078A (ja) * 1983-11-09 1985-06-07 日本タングステン株式会社 導電性ジルコニア基焼結材料及びその製造方法
JPH0338314A (ja) * 1989-07-05 1991-02-19 Souzou Kagaku:Kk 成形金型

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3447936A (en) * 1965-10-07 1969-06-03 Blaw Knox Co Mold coating composition,particularly for centrifugal molds
EP0078525A2 (en) * 1981-10-30 1983-05-11 Aktieselskabet Aalborg Portland-Cement-Fabrik A method of improving characteristic of a body
SU1073691A1 (ru) * 1982-08-25 1984-02-15 Предприятие П/Я В-8616 Способ определени адгезионной прочности
DE3683086D1 (de) * 1985-06-06 1992-02-06 Remet Corp Giessen von reaktionsfaehigen metallen in keramische formen.
US4703806A (en) * 1986-07-11 1987-11-03 Howmet Turbine Components Corporation Ceramic shell mold facecoat and core coating systems for investment casting of reactive metals
US5535811A (en) * 1987-01-28 1996-07-16 Remet Corporation Ceramic shell compositions for casting of reactive metals
DE68915146T2 (de) * 1988-07-15 1994-09-15 Toshiba Tungaloy Co Ltd Giessform zum giessen optischer teile sowie verfahren zur herstellung.
EP0437345A3 (en) * 1990-01-10 1992-08-19 Taiyo Manufacturing Works Co., Ltd. Mold used for fabricating thermoplastic resin articles
JPH04211912A (ja) * 1990-01-10 1992-08-03 Taiyo Kosakusho:Kk 熱可塑性樹脂成形用金型
JPH05215668A (ja) * 1990-12-19 1993-08-24 Sumitomo Bakelite Co Ltd 半導体封止用成形材料の離型性評価方法
JP3212124B2 (ja) * 1991-04-04 2001-09-25 川崎製鉄株式会社 高融点金属鋳造用のロストワックス鋳型フェースコート材料およびそれを用いた鋳型による鋳造品の製造方法
JPH07187774A (ja) * 1993-12-24 1995-07-25 Shinagawa Refract Co Ltd 高強度ジルコニア質焼結体及びその製造方法並びに粉砕用部品材料及びセラミックスダイス
JPH07329099A (ja) 1994-06-03 1995-12-19 Sumitomo Bayer Urethane Kk ポリウレタン樹脂成形品を製造する方法
TW302527B (enExample) * 1994-11-17 1997-04-11 Hitachi Ltd
CN1131605A (zh) * 1994-11-17 1996-09-25 株式会社日立制作所 模塑方法与模塑设备
US5741446A (en) * 1995-05-26 1998-04-21 Mitsubishi Engineering-Plastics Corp. Method of producing a molded article using a mold assembly with an insert block
JPH10277061A (ja) * 1997-04-04 1998-10-20 Injietsukusu:Kk 支台歯模型および歯冠修復物の製造方法
JP3472093B2 (ja) * 1997-08-15 2003-12-02 シャープ株式会社 カラー画像形成装置
JPH1164211A (ja) * 1997-08-22 1999-03-05 Central Res Inst Of Electric Power Ind 皮膜の密着性評価方法
JP4161423B2 (ja) * 1997-10-30 2008-10-08 住友電気工業株式会社 窒化アルミニウム焼結体及びそのメタライズ基板
US6619368B1 (en) * 1997-12-15 2003-09-16 Pcc Structurals, Inc. Method for imaging inclusions in investment castings
JP2001110801A (ja) * 1999-10-05 2001-04-20 Takeshi Yao パターン形成方法、並びに電子素子、光学素子及び回路基板
JP3862941B2 (ja) * 2000-07-21 2006-12-27 リンテック株式会社 高精細防眩性ハードコートフィルム
US6783719B2 (en) * 2001-01-19 2004-08-31 Korry Electronics, Co. Mold with metal oxide surface compatible with ionic release agents
TW552188B (en) * 2001-11-16 2003-09-11 Towa Corp Apparatus and method for evaluating degree of adhesion of adherents to mold surface, apparatus and method for surface treatment of mold surface and method and apparatus for cleaning mold used for molding resin
DE10208800A1 (de) * 2002-03-01 2003-09-18 Harald Fuchs Haftsensor zur berührungsfreien Messung der Haftungseigenschaften von Oberflächen
JP4065148B2 (ja) 2002-06-26 2008-03-19 Ｔｏｗａ株式会社 樹脂成形方法
JP2004146556A (ja) * 2002-10-24 2004-05-20 Towa Corp 樹脂封止方法、樹脂封止装置、及び樹脂シート
TW200420431A (en) * 2002-11-20 2004-10-16 Shinetsu Chemical Co Heat resistant coated member, making method, and treatment using the same
TWI262176B (en) * 2003-04-25 2006-09-21 Hon Hai Prec Ind Co Ltd Mold for molding optical glass products and method for making the mold
JP2005001239A (ja) * 2003-06-12 2005-01-06 Towa Corp 樹脂成形型用材料及び樹脂成形型
JP2005193610A (ja) * 2004-01-09 2005-07-21 Towa Corp 複合材料及び樹脂成形型
JP4518808B2 (ja) * 2004-02-09 2010-08-04 Ｔｏｗａ株式会社 導電性多孔質材料、その材料からなる樹脂成形型、及びその材料の製造方法
JP3996138B2 (ja) * 2004-03-26 2007-10-24 Ｔｏｗａ株式会社 低密着性材料及び樹脂成形型
JP2006131429A (ja) * 2004-11-02 2006-05-25 Towa Corp 低密着性材料及び樹脂成形型
JP4749707B2 (ja) * 2004-12-17 2011-08-17 Ｔｏｗａ株式会社 樹脂成形型及び樹脂成形方法
JP3974152B2 (ja) * 2006-01-26 2007-09-12 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料
JP4230492B2 (ja) * 2006-04-11 2009-02-25 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103078A (ja) * 1983-11-09 1985-06-07 日本タングステン株式会社 導電性ジルコニア基焼結材料及びその製造方法
JPH0338314A (ja) * 1989-07-05 1991-02-19 Souzou Kagaku:Kk 成形金型

Also Published As

Publication number Publication date
CN1842403A (zh) 2006-10-04
US20120076886A1 (en) 2012-03-29
US20080254286A1 (en) 2008-10-16
CN100595047C (zh) 2010-03-24
TW200600307A (en) 2006-01-01
TWI308517B (enExample) 2009-04-11
US7614293B2 (en) 2009-11-10
KR100796883B1 (ko) 2008-01-22
KR20060056402A (ko) 2006-05-24
JP2005274478A (ja) 2005-10-06
EP1728611A1 (en) 2006-12-06
JP3996138B2 (ja) 2007-10-24
CN101264648B (zh) 2012-09-19
EP1728611A4 (en) 2013-09-18
CN101264648A (zh) 2008-09-17
KR20070094017A (ko) 2007-09-19
WO2005092587A1 (ja) 2005-10-06
US20110042857A1 (en) 2011-02-24
US20100012816A1 (en) 2010-01-21

Similar Documents

Publication Publication Date Title
US20110042857A1 (en) Method of evaluating adhesion property, low-adhesion material, and mold for molding resin
US20100047557A1 (en) Ceramic and/or powder-metallurgical composite shaped body and method for the production thereof
US5925451A (en) Composite ceramic board and process for the productivity thereof
KR20200125973A (ko) 3d 세라믹 구조체
JP2006131429A5 (enExample)
JP2006131429A (ja) 低密着性材料及び樹脂成形型
KR100923623B1 (ko) 저밀착성 재료, 수지 성형틀 및 방오성 재료
JP4134238B2 (ja) 密着性の評価方法
CN116730739A (zh) 基于氯化铝作粘结剂的氧化铝陶瓷零件的3dp制造方法
JP3974152B2 (ja) 低密着性材料、樹脂成形型及び防汚性材料
TWI284634B (en) Conductive porous material, resin molding using it, and process for producing conductive porous material
JP7138826B1 (ja) 封孔処理された金属複合体および金型並びに封孔処理された金属複合体の製造方法
KR100355349B1 (ko) 반응결합 탄화규소의 제조방법
JPS61222192A (ja) 電子回路用基板

Legal Events

Date Code Title Description
A107 Divisional application of patent
A201 Request for examination
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A16-div-PA0104

St.27 status event code: A-0-1-A10-A18-div-PA0104

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

PR1002 Payment of registration fee

Fee payment year number: 1

St.27 status event code: A-2-2-U10-U12-oth-PR1002

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

Fee payment year number: 4

St.27 status event code: A-4-4-U10-U11-oth-PR1001

PR1001 Payment of annual fee

Fee payment year number: 5

St.27 status event code: A-4-4-U10-U11-oth-PR1001

FPAY Annual fee payment

Payment date: 20130422

Year of fee payment: 6

PR1001 Payment of annual fee

Fee payment year number: 6

St.27 status event code: A-4-4-U10-U11-oth-PR1001

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

St.27 status event code: A-5-5-R10-R13-asn-PN2301

FPAY Annual fee payment

Payment date: 20140502

Year of fee payment: 7

PR1001 Payment of annual fee

Fee payment year number: 7

St.27 status event code: A-4-4-U10-U11-oth-PR1001

FPAY Annual fee payment

Payment date: 20150508

Year of fee payment: 8

PR1001 Payment of annual fee

Fee payment year number: 8

St.27 status event code: A-4-4-U10-U11-oth-PR1001

FPAY Annual fee payment

Payment date: 20160428

Year of fee payment: 9

PR1001 Payment of annual fee

Fee payment year number: 9

St.27 status event code: A-4-4-U10-U11-oth-PR1001

FPAY Annual fee payment

Payment date: 20170410

Year of fee payment: 10

PR1001 Payment of annual fee

Fee payment year number: 10

St.27 status event code: A-4-4-U10-U11-oth-PR1001

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

Not in force date: 20180618

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

St.27 status event code: A-4-4-U10-U13-oth-PC1903

PC1903 Unpaid annual fee

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20180618

St.27 status event code: N-4-6-H10-H13-oth-PC1903