KR100795252B1 - 감광성 수지 조성물 및 이 조성물을 이용한 패턴 형성 방법 - Google Patents

감광성 수지 조성물 및 이 조성물을 이용한 패턴 형성 방법 Download PDF

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Publication number
KR100795252B1
KR100795252B1 KR1020067005036A KR20067005036A KR100795252B1 KR 100795252 B1 KR100795252 B1 KR 100795252B1 KR 1020067005036 A KR1020067005036 A KR 1020067005036A KR 20067005036 A KR20067005036 A KR 20067005036A KR 100795252 B1 KR100795252 B1 KR 100795252B1
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KR
South Korea
Prior art keywords
resin composition
photosensitive resin
pattern
formula
atom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020067005036A
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English (en)
Korean (ko)
Other versions
KR20060095954A (ko
Inventor
히로키 마에다
토루 다카하시
나오야 가츠마타
Original Assignee
도쿄 오카 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from JP2004093624A external-priority patent/JP4237088B2/ja
Application filed by 도쿄 오카 고교 가부시키가이샤 filed Critical 도쿄 오카 고교 가부시키가이샤
Publication of KR20060095954A publication Critical patent/KR20060095954A/ko
Application granted granted Critical
Publication of KR100795252B1 publication Critical patent/KR100795252B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
KR1020067005036A 2004-03-26 2004-12-15 감광성 수지 조성물 및 이 조성물을 이용한 패턴 형성 방법 Expired - Lifetime KR100795252B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004093624A JP4237088B2 (ja) 2003-07-24 2004-03-26 感光性樹脂組成物および該組成物を用いたパターン形成方法
JPJP-P-2004-00093624 2004-03-26

Publications (2)

Publication Number Publication Date
KR20060095954A KR20060095954A (ko) 2006-09-05
KR100795252B1 true KR100795252B1 (ko) 2008-01-15

Family

ID=35056346

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067005036A Expired - Lifetime KR100795252B1 (ko) 2004-03-26 2004-12-15 감광성 수지 조성물 및 이 조성물을 이용한 패턴 형성 방법

Country Status (6)

Country Link
US (1) US20060188820A1 (OSRAM)
EP (1) EP1729175B1 (OSRAM)
KR (1) KR100795252B1 (OSRAM)
CN (1) CN1849560B (OSRAM)
TW (1) TW200532376A (OSRAM)
WO (1) WO2005093514A1 (OSRAM)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4276407B2 (ja) * 2002-05-08 2009-06-10 ヘンケル コーポレイション 光カチオン硬化型エポキシ樹脂組成物
US8052828B2 (en) * 2005-01-21 2011-11-08 Tokyo Okha Kogyo Co., Ltd. Photosensitive laminate film for forming top plate portion of precision fine space and method of forming precision fine space
JP4702784B2 (ja) 2005-08-08 2011-06-15 ソニー株式会社 液体吐出型記録ヘッドの流路構成材料
WO2007094396A1 (ja) * 2006-02-16 2007-08-23 Tokyo Ohka Kogyo Co., Ltd. 感光性樹脂組成物およびこれを用いたパターン形成方法
WO2008007764A1 (fr) * 2006-07-14 2008-01-17 Nippon Kayaku Kabushiki Kaisha Composition de résine photosensible, produit stratifié en cette composition, objet durci en cette composition, et procédé de traçage de motif à partir de cette composition
JP2008180879A (ja) * 2007-01-24 2008-08-07 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物及びこれを用いたレジストパターンの形成方法
JP5039442B2 (ja) * 2007-06-15 2012-10-03 東京応化工業株式会社 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法
DE102007063698B4 (de) * 2007-09-13 2010-10-28 Carl Zeiss Vision Gmbh Optisches Bauelement mit Oberflächenbeschichtung
JP2010150362A (ja) * 2008-12-25 2010-07-08 Sumitomo Electric Ind Ltd フィルム状接着剤及び異方導電性接着剤
US9599893B2 (en) * 2014-09-25 2017-03-21 Canon Kabushiki Kaisha Production process for optically shaped product and production process for liquid discharge head
WO2016153044A1 (ja) 2015-03-26 2016-09-29 東京応化工業株式会社 ネガ型感光性組成物、パターン形成方法
CN111033379A (zh) * 2017-08-28 2020-04-17 住友电木株式会社 负型感光性树脂组合物、半导体装置和电子设备

Citations (3)

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JPH09325491A (ja) * 1996-05-31 1997-12-16 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性積層体及びフレキシブルプリント板の製造法
JP2001348482A (ja) * 2000-06-07 2001-12-18 Shin Etsu Chem Co Ltd 放射線硬化型シリコーン含有剥離性組成物及び剥離フィルム
JP2003238691A (ja) * 2002-02-15 2003-08-27 Jsr Corp 光硬化性樹脂組成物

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EP0153904B1 (de) * 1984-02-10 1988-09-14 Ciba-Geigy Ag Verfahren zur Herstellung einer Schutzschicht oder einer Reliefabbildung
US4882245A (en) * 1985-10-28 1989-11-21 International Business Machines Corporation Photoresist composition and printed circuit boards and packages made therewith
CA1289803C (en) * 1985-10-28 1991-10-01 Robert J. Cox Photoresist composition and printed circuit boards and packages made therewith
US5026624A (en) * 1989-03-03 1991-06-25 International Business Machines Corporation Composition for photo imaging
JP2991313B2 (ja) * 1991-07-15 1999-12-20 インターナショナル・ビジネス・マシーンズ・コーポレイション フォトイメージング用の改良された組成物
JPH09268205A (ja) * 1996-03-29 1997-10-14 Asahi Denka Kogyo Kk 光学的立体造形用樹脂組成物および光学的立体造形法
JPH09304927A (ja) * 1996-05-20 1997-11-28 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性積層体及びフレキシブルプリント板の製造法
EP0927726B1 (en) * 1996-09-19 2004-11-10 Nippon Soda Co., Ltd. Photocatalytic composition
JP3437069B2 (ja) * 1996-09-19 2003-08-18 日本曹達株式会社 光触媒組成物
JP4204113B2 (ja) * 1997-12-04 2009-01-07 株式会社Ａｄｅｋａ 新規な芳香族スルホニウム化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光造形用樹脂組成物ならびに光学的立体造形法
JPH11323094A (ja) * 1998-05-21 1999-11-26 Nippon Kayaku Co Ltd 光カチオン重合性エポキシ樹脂系固形組成物及び物品
JP4093335B2 (ja) * 2000-01-26 2008-06-04 日本化薬株式会社 光カチオン硬化型ドライフィルムレジスト及びその硬化物
JP2001274849A (ja) * 2000-03-27 2001-10-05 Toshiba Corp インターフェイス回路
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JP4743736B2 (ja) * 2001-08-31 2011-08-10 株式会社Adeka 光学的立体造形用樹脂組成物およびこれを用いた光学的立体造形方法
US6818379B2 (en) * 2001-12-03 2004-11-16 Sumitomo Chemical Company, Limited Sulfonium salt and use thereof
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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09325491A (ja) * 1996-05-31 1997-12-16 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性積層体及びフレキシブルプリント板の製造法
JP2001348482A (ja) * 2000-06-07 2001-12-18 Shin Etsu Chem Co Ltd 放射線硬化型シリコーン含有剥離性組成物及び剥離フィルム
JP2003238691A (ja) * 2002-02-15 2003-08-27 Jsr Corp 光硬化性樹脂組成物

Also Published As

Publication number Publication date
EP1729175A4 (en) 2007-07-04
TWI305868B (OSRAM) 2009-02-01
US20060188820A1 (en) 2006-08-24
CN1849560B (zh) 2011-12-07
WO2005093514A1 (ja) 2005-10-06
TW200532376A (en) 2005-10-01
EP1729175A1 (en) 2006-12-06
CN1849560A (zh) 2006-10-18
KR20060095954A (ko) 2006-09-05
EP1729175B1 (en) 2013-03-27

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