KR100776314B1 - 기판 세정 장치 - Google Patents

기판 세정 장치 Download PDF

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Publication number
KR100776314B1
KR100776314B1 KR1020010047491A KR20010047491A KR100776314B1 KR 100776314 B1 KR100776314 B1 KR 100776314B1 KR 1020010047491 A KR1020010047491 A KR 1020010047491A KR 20010047491 A KR20010047491 A KR 20010047491A KR 100776314 B1 KR100776314 B1 KR 100776314B1
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KR
South Korea
Prior art keywords
substrate
cleaning
roller
cleaning member
rotating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020010047491A
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English (en)
Korean (ko)
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KR20020013419A (ko
Inventor
소토자키히로시
오이카와후미토시
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20020013419A publication Critical patent/KR20020013419A/ko
Application granted granted Critical
Publication of KR100776314B1 publication Critical patent/KR100776314B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
KR1020010047491A 2000-08-09 2001-08-07 기판 세정 장치 Expired - Lifetime KR100776314B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000241794A JP2002052370A (ja) 2000-08-09 2000-08-09 基板洗浄装置
JPJP-P-2000-00241794 2000-08-09

Publications (2)

Publication Number Publication Date
KR20020013419A KR20020013419A (ko) 2002-02-20
KR100776314B1 true KR100776314B1 (ko) 2007-11-13

Family

ID=18732932

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010047491A Expired - Lifetime KR100776314B1 (ko) 2000-08-09 2001-08-07 기판 세정 장치

Country Status (3)

Country Link
US (1) US6851152B2 (https=)
JP (1) JP2002052370A (https=)
KR (1) KR100776314B1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101508513B1 (ko) 2013-07-22 2015-04-07 주식회사 케이씨텍 기판 세정에 사용되는 기판 회전 장치
KR101527898B1 (ko) * 2013-07-31 2015-06-10 세메스 주식회사 지지 유닛, 기판 처리 장치, 기판 처리 설비, 그리고 기판 처리 방법

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* Cited by examiner, † Cited by third party
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US6904637B2 (en) * 2001-10-03 2005-06-14 Applied Materials, Inc. Scrubber with sonic nozzle
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
KR20080005974A (ko) * 2005-04-25 2008-01-15 어플라이드 머티어리얼스, 인코포레이티드 기판의 에지를 세정하기 위한 방법 및 장치
US20070095367A1 (en) * 2005-10-28 2007-05-03 Yaxin Wang Apparatus and method for atomic layer cleaning and polishing
US7938130B2 (en) * 2006-03-31 2011-05-10 Ebara Corporation Substrate holding rotating mechanism, and substrate processing apparatus
US9202725B2 (en) * 2006-07-24 2015-12-01 Planar Semiconductor, Inc. Holding and rotary driving mechanism for flat objects
US7823241B2 (en) * 2007-03-22 2010-11-02 Taiwan Semiconductor Manufacturing Co., Ltd. System for cleaning a wafer
US20090217953A1 (en) * 2008-02-28 2009-09-03 Hui Chen Drive roller for a cleaning system
KR101958874B1 (ko) 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 기판처리장치, 기판처리방법, 기판 파지기구, 및 기판 파지방법
US8844546B2 (en) * 2008-10-01 2014-09-30 Applied Materials, Inc. Apparatus and method for cleaning semiconductor substrate using pressurized fluid
JP5535687B2 (ja) * 2010-03-01 2014-07-02 株式会社荏原製作所 基板洗浄方法及び基板洗浄装置
TWI420616B (zh) * 2010-08-05 2013-12-21 Au Optronics Corp 基板清洗機台與基板清洗方法
US9190881B1 (en) 2011-08-02 2015-11-17 Tooltek Engineering Corporation Rotary-powered mechanical oscillator
JP2014130881A (ja) * 2012-12-28 2014-07-10 Ebara Corp 研磨装置
KR20150075357A (ko) * 2013-12-25 2015-07-03 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 장치 및 기판 처리 장치
JP2016174077A (ja) * 2015-03-17 2016-09-29 株式会社東芝 基板洗浄装置および基板洗浄方法
US10096460B2 (en) * 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
CN106898570B (zh) * 2017-04-14 2023-06-20 常州亿晶光电科技有限公司 硅片清洁装置
JP7348021B2 (ja) 2019-10-15 2023-09-20 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP7491774B2 (ja) * 2020-08-24 2024-05-28 株式会社荏原製作所 基板保持回転機構、基板処理装置
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers
JP7679204B2 (ja) * 2021-01-25 2025-05-19 株式会社荏原製作所 基板洗浄装置、基板洗浄方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0645302A (ja) * 1992-07-24 1994-02-18 Tokyo Electron Ltd 処理装置
JPH08130200A (ja) * 1994-10-31 1996-05-21 Sigma Merutetsuku Kk 基板の洗浄方法と洗浄装置

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JP2584999B2 (ja) 1987-06-24 1997-02-26 本多電子株式会社 超音波駆動装置
US5485644A (en) * 1993-03-18 1996-01-23 Dainippon Screen Mfg. Co., Ltd. Substrate treating apparatus
US5861066A (en) * 1996-05-01 1999-01-19 Ontrak Systems, Inc. Method and apparatus for cleaning edges of contaminated substrates
US6230753B1 (en) 1996-07-15 2001-05-15 Lam Research Corporation Wafer cleaning apparatus
US5924154A (en) * 1996-08-29 1999-07-20 Ontrak Systems, Inc. Brush assembly apparatus
EP0837493B8 (en) 1996-10-21 2007-11-07 Ebara Corporation Cleaning apparatus
US5937469A (en) 1996-12-03 1999-08-17 Intel Corporation Apparatus for mechanically cleaning the edges of wafers
US5725414A (en) 1996-12-30 1998-03-10 Intel Corporation Apparatus for cleaning the side-edge and top-edge of a semiconductor wafer
JP3549141B2 (ja) * 1997-04-21 2004-08-04 大日本スクリーン製造株式会社 基板処理装置および基板保持装置
US5933902A (en) * 1997-11-18 1999-08-10 Frey; Bernhard M. Wafer cleaning system
JPH11179646A (ja) * 1997-12-19 1999-07-06 Speedfam Co Ltd 洗浄装置
US6202658B1 (en) 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
US6594847B1 (en) * 2000-03-28 2003-07-22 Lam Research Corporation Single wafer residue, thin film removal and clean
US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
US6427566B1 (en) * 2000-03-31 2002-08-06 Lam Research Corporation Self-aligning cylindrical mandrel assembly and wafer preparation apparatus including the same
US6439245B1 (en) * 2000-06-30 2002-08-27 Lam Research Corporation Method for transferring wafers from a conveyor system to a wafer processing station

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0645302A (ja) * 1992-07-24 1994-02-18 Tokyo Electron Ltd 処理装置
JPH08130200A (ja) * 1994-10-31 1996-05-21 Sigma Merutetsuku Kk 基板の洗浄方法と洗浄装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101508513B1 (ko) 2013-07-22 2015-04-07 주식회사 케이씨텍 기판 세정에 사용되는 기판 회전 장치
KR101527898B1 (ko) * 2013-07-31 2015-06-10 세메스 주식회사 지지 유닛, 기판 처리 장치, 기판 처리 설비, 그리고 기판 처리 방법

Also Published As

Publication number Publication date
US6851152B2 (en) 2005-02-08
US20020022445A1 (en) 2002-02-21
JP2002052370A (ja) 2002-02-19
KR20020013419A (ko) 2002-02-20

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