KR100742679B1 - 프린트 배선판 및 그 제조 방법 - Google Patents

프린트 배선판 및 그 제조 방법 Download PDF

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Publication number
KR100742679B1
KR100742679B1 KR1020050101764A KR20050101764A KR100742679B1 KR 100742679 B1 KR100742679 B1 KR 100742679B1 KR 1020050101764 A KR1020050101764 A KR 1020050101764A KR 20050101764 A KR20050101764 A KR 20050101764A KR 100742679 B1 KR100742679 B1 KR 100742679B1
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South Korea
Prior art keywords
conductor layer
base substrate
laminated
layer
substrate
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Expired - Fee Related
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KR1020050101764A
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English (en)
Korean (ko)
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KR20060052260A (ko
Inventor
가쓰히코 다카하시
고지 쓰루사키
노리유키 미치바
히로토시 다니노
Original Assignee
가부시키가이샤후지쿠라
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Publication of KR20060052260A publication Critical patent/KR20060052260A/ko
Application granted granted Critical
Publication of KR100742679B1 publication Critical patent/KR100742679B1/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
KR1020050101764A 2004-10-28 2005-10-27 프린트 배선판 및 그 제조 방법 Expired - Fee Related KR100742679B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00313814 2004-10-28
JP2004313814A JP2006128360A (ja) 2004-10-28 2004-10-28 プリント配線板およびその製造方法

Publications (2)

Publication Number Publication Date
KR20060052260A KR20060052260A (ko) 2006-05-19
KR100742679B1 true KR100742679B1 (ko) 2007-07-25

Family

ID=36722754

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050101764A Expired - Fee Related KR100742679B1 (ko) 2004-10-28 2005-10-27 프린트 배선판 및 그 제조 방법

Country Status (4)

Country Link
JP (1) JP2006128360A (https=)
KR (1) KR100742679B1 (https=)
CN (1) CN1767720A (https=)
TW (1) TW200631483A (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100754080B1 (ko) 2006-07-13 2007-08-31 삼성전기주식회사 리지드-플렉서블 인쇄회로기판 및 그 제조방법
KR100771310B1 (ko) 2006-08-22 2007-10-29 삼성전기주식회사 리지드-플렉서블 인쇄회로기판 및 그 제조방법
US8071883B2 (en) 2006-10-23 2011-12-06 Ibiden Co., Ltd. Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same
US7982135B2 (en) 2006-10-30 2011-07-19 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
WO2009113202A1 (ja) 2008-03-10 2009-09-17 イビデン株式会社 フレキシブル配線板及びその製造方法
JP2010232585A (ja) * 2009-03-30 2010-10-14 Toppan Printing Co Ltd 多層配線基板およびその製造方法
JP2011082317A (ja) * 2009-10-07 2011-04-21 Sumitomo Electric Printed Circuit Inc フレキシブルプリント配線板及びこれを備える電子機器
CN103327738B (zh) * 2012-03-22 2016-03-09 富葵精密组件(深圳)有限公司 软硬结合电路板及其制作方法
CN104602448B (zh) * 2013-10-30 2017-11-03 鹏鼎控股(深圳)股份有限公司 可挠式电路板及其制作方法
JP5913401B2 (ja) * 2014-02-26 2016-04-27 レノボ・シンガポール・プライベート・リミテッド 引出構造、キーボードユニット及び携帯用情報機器
TWI517775B (zh) 2014-03-06 2016-01-11 相互股份有限公司 印刷電路板及其製法
CN105592638B (zh) * 2014-10-20 2018-10-30 鹏鼎控股(深圳)股份有限公司 刚挠结合板及其制作方法
TWI713420B (zh) * 2019-04-01 2020-12-11 新揚科技股份有限公司 電路板結構
CN110913577A (zh) * 2019-12-24 2020-03-24 江苏弘信华印电路科技有限公司 一种六层软硬结合板的叠构结构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05191050A (ja) * 1992-01-13 1993-07-30 Hitachi Chem Co Ltd リジッドフレックス配線板の製造方法
JPH0750455A (ja) * 1993-08-06 1995-02-21 Mitsui Toatsu Chem Inc リジッドフレックスプリント配線板およびその製造方法
JPH07193370A (ja) * 1993-12-25 1995-07-28 Ibiden Co Ltd フレックスリジッドプリント基板及びその製造方法
JPH0955562A (ja) * 1995-08-11 1997-02-25 Cmk Corp プリント配線板
US20010010303A1 (en) 1997-02-14 2001-08-02 A. Roland Caron Multilayer combined rigid/flex printed circuit board containing flexible soldermask

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05191050A (ja) * 1992-01-13 1993-07-30 Hitachi Chem Co Ltd リジッドフレックス配線板の製造方法
JPH0750455A (ja) * 1993-08-06 1995-02-21 Mitsui Toatsu Chem Inc リジッドフレックスプリント配線板およびその製造方法
JPH07193370A (ja) * 1993-12-25 1995-07-28 Ibiden Co Ltd フレックスリジッドプリント基板及びその製造方法
JPH0955562A (ja) * 1995-08-11 1997-02-25 Cmk Corp プリント配線板
US20010010303A1 (en) 1997-02-14 2001-08-02 A. Roland Caron Multilayer combined rigid/flex printed circuit board containing flexible soldermask

Also Published As

Publication number Publication date
JP2006128360A (ja) 2006-05-18
TWI302080B (https=) 2008-10-11
CN1767720A (zh) 2006-05-03
KR20060052260A (ko) 2006-05-19
TW200631483A (en) 2006-09-01

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