KR100714476B1 - 반도체 장치 및 그 제조 방법 - Google Patents

반도체 장치 및 그 제조 방법 Download PDF

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Publication number
KR100714476B1
KR100714476B1 KR1020050113818A KR20050113818A KR100714476B1 KR 100714476 B1 KR100714476 B1 KR 100714476B1 KR 1020050113818 A KR1020050113818 A KR 1020050113818A KR 20050113818 A KR20050113818 A KR 20050113818A KR 100714476 B1 KR100714476 B1 KR 100714476B1
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KR
South Korea
Prior art keywords
via hole
diffusion barrier
wiring
semiconductor device
lower wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020050113818A
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English (en)
Korean (ko)
Inventor
오준환
맹동조
김순호
Original Assignee
삼성전자주식회사
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Publication date
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Priority to KR1020050113818A priority Critical patent/KR100714476B1/ko
Priority to US11/591,762 priority patent/US7482684B2/en
Priority to JP2006312571A priority patent/JP2007150301A/ja
Application granted granted Critical
Publication of KR100714476B1 publication Critical patent/KR100714476B1/ko
Priority to US12/336,028 priority patent/US7629239B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/425—Barrier, adhesion or liner layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
    • H10W20/034—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics bottomless barrier, adhesion or liner layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/052—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers by treatments not introducing additional elements therein
    • H10W20/0526—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers by treatments not introducing additional elements therein by thermal treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/064—Manufacture or treatment of conductive parts of the interconnections by modifying the conductivity of conductive parts, e.g. by alloying

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020050113818A 2005-11-25 2005-11-25 반도체 장치 및 그 제조 방법 Expired - Fee Related KR100714476B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020050113818A KR100714476B1 (ko) 2005-11-25 2005-11-25 반도체 장치 및 그 제조 방법
US11/591,762 US7482684B2 (en) 2005-11-25 2006-11-02 Semiconductor device with a dopant region in a lower wire
JP2006312571A JP2007150301A (ja) 2005-11-25 2006-11-20 半導体装置およびその製造方法
US12/336,028 US7629239B2 (en) 2005-11-25 2008-12-16 Method of fabricating a semiconductor device with a dopant region in a lower wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050113818A KR100714476B1 (ko) 2005-11-25 2005-11-25 반도체 장치 및 그 제조 방법

Publications (1)

Publication Number Publication Date
KR100714476B1 true KR100714476B1 (ko) 2007-05-07

Family

ID=38086643

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050113818A Expired - Fee Related KR100714476B1 (ko) 2005-11-25 2005-11-25 반도체 장치 및 그 제조 방법

Country Status (3)

Country Link
US (2) US7482684B2 (https=)
JP (1) JP2007150301A (https=)
KR (1) KR100714476B1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7122898B1 (en) * 2005-05-09 2006-10-17 International Business Machines Corporation Electrical programmable metal resistor
KR100714476B1 (ko) * 2005-11-25 2007-05-07 삼성전자주식회사 반도체 장치 및 그 제조 방법
JP5498751B2 (ja) * 2009-10-05 2014-05-21 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
TW201532247A (zh) 2013-10-16 2015-08-16 康佛森智財管理公司 形成嵌入動態隨機存取記憶體電容器的成本效益佳的方法
US9997457B2 (en) * 2013-12-20 2018-06-12 Intel Corporation Cobalt based interconnects and methods of fabrication thereof
CN113140501B (zh) * 2020-01-17 2024-10-15 长鑫存储技术有限公司 半导体器件及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060001313A (ko) * 2004-06-30 2006-01-06 주식회사 하이닉스반도체 반도체 소자의 금속 배선 형성 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2850380B2 (ja) * 1989-07-11 1999-01-27 セイコーエプソン株式会社 半導体装置の製造方法
US6100184A (en) * 1997-08-20 2000-08-08 Sematech, Inc. Method of making a dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer
JPH11330235A (ja) * 1998-05-11 1999-11-30 Sony Corp 半導体装置の絶縁層加工方法および半導体装置の絶縁層加工装置
JPH11340234A (ja) * 1998-05-29 1999-12-10 Matsushita Electron Corp 半導体装置の製造方法
JP3329380B2 (ja) * 1999-09-21 2002-09-30 日本電気株式会社 半導体装置およびその製造方法
KR100385227B1 (ko) 2001-02-12 2003-05-27 삼성전자주식회사 구리 다층 배선을 가지는 반도체 장치 및 그 형성방법
KR100413828B1 (ko) 2001-12-13 2004-01-03 삼성전자주식회사 반도체 장치 및 그 형성방법
KR100402428B1 (ko) * 2001-12-18 2003-10-17 주식회사 하이닉스반도체 반도체 소자의 금속 배선 형성 방법
JP2003249547A (ja) * 2002-02-22 2003-09-05 Mitsubishi Electric Corp 配線間の接続構造及びその製造方法
JP2004349609A (ja) * 2003-05-26 2004-12-09 Renesas Technology Corp 半導体装置およびその製造方法
JP2006270080A (ja) * 2005-02-25 2006-10-05 Toshiba Corp 半導体装置及びその製造方法
KR100714476B1 (ko) * 2005-11-25 2007-05-07 삼성전자주식회사 반도체 장치 및 그 제조 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060001313A (ko) * 2004-06-30 2006-01-06 주식회사 하이닉스반도체 반도체 소자의 금속 배선 형성 방법

Also Published As

Publication number Publication date
JP2007150301A (ja) 2007-06-14
US7629239B2 (en) 2009-12-08
US20090098730A1 (en) 2009-04-16
US7482684B2 (en) 2009-01-27
US20070120242A1 (en) 2007-05-31

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