KR100647216B1 - 고체 촬상 장치 및 그 제조 방법 - Google Patents

고체 촬상 장치 및 그 제조 방법 Download PDF

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Publication number
KR100647216B1
KR100647216B1 KR1020030067842A KR20030067842A KR100647216B1 KR 100647216 B1 KR100647216 B1 KR 100647216B1 KR 1020030067842 A KR1020030067842 A KR 1020030067842A KR 20030067842 A KR20030067842 A KR 20030067842A KR 100647216 B1 KR100647216 B1 KR 100647216B1
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South Korea
Prior art keywords
substrate
imaging device
rib
solid
state imaging
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KR1020030067842A
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Korean (ko)
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KR20040093362A (ko
Inventor
미나미오마사노리
야마우치고우이치
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마쯔시다덴기산교 가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
KR1020030067842A 2003-04-28 2003-09-30 고체 촬상 장치 및 그 제조 방법 Expired - Fee Related KR100647216B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003123843A JP3898666B2 (ja) 2003-04-28 2003-04-28 固体撮像装置およびその製造方法
JPJP-P-2003-00123843 2003-04-28

Publications (2)

Publication Number Publication Date
KR20040093362A KR20040093362A (ko) 2004-11-05
KR100647216B1 true KR100647216B1 (ko) 2006-11-17

Family

ID=32985562

Family Applications (1)

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KR1020030067842A Expired - Fee Related KR100647216B1 (ko) 2003-04-28 2003-09-30 고체 촬상 장치 및 그 제조 방법

Country Status (6)

Country Link
US (1) US7273765B2 (https=)
EP (1) EP1473776A3 (https=)
JP (1) JP3898666B2 (https=)
KR (1) KR100647216B1 (https=)
CN (1) CN100490162C (https=)
TW (1) TWI253750B (https=)

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KR100652375B1 (ko) * 2004-06-29 2006-12-01 삼성전자주식회사 와이어 본딩 패키지를 포함하는 이미지 센서 모듈 구조물및 그 제조방법
DE102006005419B4 (de) 2006-02-03 2019-05-02 Infineon Technologies Ag Mikroelektromechanisches Halbleiterbauelement mit Hohlraumstruktur und Verfahren zur Herstellung desselben
US7807506B2 (en) * 2006-02-03 2010-10-05 Infineon Technologies Ag Microelectromechanical semiconductor component with cavity structure and method for producing the same
KR100766505B1 (ko) * 2006-10-03 2007-10-15 삼성전자주식회사 카메라 모듈 및 그 제조 방법
TWI313943B (en) * 2006-10-24 2009-08-21 Chipmos Technologies Inc Light emitting chip package and manufacturing thereof
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JP6899244B2 (ja) * 2016-04-20 2021-07-07 ローム株式会社 半導体装置
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JP2020129629A (ja) * 2019-02-12 2020-08-27 エイブリック株式会社 光センサ装置およびその製造方法

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Also Published As

Publication number Publication date
CN100490162C (zh) 2009-05-20
EP1473776A2 (en) 2004-11-03
TW200406912A (en) 2004-05-01
TWI253750B (en) 2006-04-21
US7273765B2 (en) 2007-09-25
KR20040093362A (ko) 2004-11-05
EP1473776A3 (en) 2006-04-05
JP3898666B2 (ja) 2007-03-28
US20040212717A1 (en) 2004-10-28
JP2004327918A (ja) 2004-11-18
CN1542982A (zh) 2004-11-03

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