KR100638798B1 - 반도체 웨이퍼 표면의 화학기계적 폴리싱 장치 및 방법 - Google Patents

반도체 웨이퍼 표면의 화학기계적 폴리싱 장치 및 방법 Download PDF

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Publication number
KR100638798B1
KR100638798B1 KR1020017006843A KR20017006843A KR100638798B1 KR 100638798 B1 KR100638798 B1 KR 100638798B1 KR 1020017006843 A KR1020017006843 A KR 1020017006843A KR 20017006843 A KR20017006843 A KR 20017006843A KR 100638798 B1 KR100638798 B1 KR 100638798B1
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KR
South Korea
Prior art keywords
wafer
polishing
housing
pad
pin
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Expired - Fee Related
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KR1020017006843A
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English (en)
Korean (ko)
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KR20010089531A (ko
Inventor
텔리에호메이욘
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에이에스엠 누툴, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
KR1020017006843A 1998-12-01 1999-11-19 반도체 웨이퍼 표면의 화학기계적 폴리싱 장치 및 방법 Expired - Fee Related KR100638798B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/201,928 US6103628A (en) 1998-12-01 1998-12-01 Reverse linear polisher with loadable housing
US09/201,928 1998-12-01

Publications (2)

Publication Number Publication Date
KR20010089531A KR20010089531A (ko) 2001-10-06
KR100638798B1 true KR100638798B1 (ko) 2006-10-25

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KR1020017006843A Expired - Fee Related KR100638798B1 (ko) 1998-12-01 1999-11-19 반도체 웨이퍼 표면의 화학기계적 폴리싱 장치 및 방법

Country Status (10)

Country Link
US (2) US6103628A (enExample)
EP (1) EP1135236B1 (enExample)
JP (1) JP2002531933A (enExample)
KR (1) KR100638798B1 (enExample)
CN (1) CN1131765C (enExample)
AT (1) ATE280014T1 (enExample)
AU (1) AU1629900A (enExample)
DE (1) DE69921354T2 (enExample)
TW (1) TW425332B (enExample)
WO (1) WO2000032356A1 (enExample)

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US7129160B2 (en) * 2002-08-29 2006-10-31 Micron Technology, Inc. Method for simultaneously removing multiple conductive materials from microelectronic substrates
US7192335B2 (en) 2002-08-29 2007-03-20 Micron Technology, Inc. Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
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US7134934B2 (en) * 2000-08-30 2006-11-14 Micron Technology, Inc. Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
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US6503131B1 (en) * 2001-08-16 2003-01-07 Applied Materials, Inc. Integrated platen assembly for a chemical mechanical planarization system
US7121919B2 (en) * 2001-08-30 2006-10-17 Micron Technology, Inc. Chemical mechanical polishing system and process
US6838149B2 (en) * 2001-12-13 2005-01-04 3M Innovative Properties Company Abrasive article for the deposition and polishing of a conductive material
US6776693B2 (en) 2001-12-19 2004-08-17 Applied Materials Inc. Method and apparatus for face-up substrate polishing
US6722946B2 (en) * 2002-01-17 2004-04-20 Nutool, Inc. Advanced chemical mechanical polishing system with smart endpoint detection
US20030146102A1 (en) * 2002-02-05 2003-08-07 Applied Materials, Inc. Method for forming copper interconnects
CN1653600A (zh) * 2002-03-13 2005-08-10 Asm努突尔股份有限公司 铜和阻障层之整合化学机械抛光的方法和设备
US6939203B2 (en) 2002-04-18 2005-09-06 Asm Nutool, Inc. Fluid bearing slide assembly for workpiece polishing
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US7138039B2 (en) * 2003-01-21 2006-11-21 Applied Materials, Inc. Liquid isolation of contact rings
US7087144B2 (en) * 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
US7025861B2 (en) * 2003-02-06 2006-04-11 Applied Materials Contact plating apparatus
US7018273B1 (en) 2003-06-27 2006-03-28 Lam Research Corporation Platen with diaphragm and method for optimizing wafer polishing
US7100954B2 (en) 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
US20050016861A1 (en) * 2003-07-24 2005-01-27 Thomas Laursen Method for planarizing a work piece
US7112122B2 (en) * 2003-09-17 2006-09-26 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
US8530359B2 (en) 2003-10-20 2013-09-10 Novellus Systems, Inc. Modulated metal removal using localized wet etching
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US7195544B2 (en) * 2004-03-23 2007-03-27 Cabot Microelectronics Corporation CMP porous pad with component-filled pores
US6955588B1 (en) 2004-03-31 2005-10-18 Lam Research Corporation Method of and platen for controlling removal rate characteristics in chemical mechanical planarization
US20050218000A1 (en) * 2004-04-06 2005-10-06 Applied Materials, Inc. Conditioning of contact leads for metal plating systems
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JP2017148931A (ja) * 2016-02-19 2017-08-31 株式会社荏原製作所 研磨装置および研磨方法
KR102339948B1 (ko) * 2019-07-02 2021-12-17 (주)미래컴퍼니 연마 시스템 및 연마 방법
CN111955945A (zh) * 2020-08-27 2020-11-20 代永金 一种中医药柜的驱动装置
CN116833900B (zh) * 2023-07-31 2024-01-26 广东工业大学 一种用于半导体晶片化学机械抛光的磁流变弹性抛光垫、制备方法及其应用
CN117340689A (zh) * 2023-11-03 2024-01-05 湖南普照信息材料有限公司 一种玻璃基板的抛光方法

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Also Published As

Publication number Publication date
DE69921354T2 (de) 2005-10-13
TW425332B (en) 2001-03-11
DE69921354D1 (de) 2004-11-25
ATE280014T1 (de) 2004-11-15
WO2000032356A1 (en) 2000-06-08
EP1135236B1 (en) 2004-10-20
CN1329533A (zh) 2002-01-02
US6207572B1 (en) 2001-03-27
AU1629900A (en) 2000-06-19
KR20010089531A (ko) 2001-10-06
US6103628A (en) 2000-08-15
EP1135236A1 (en) 2001-09-26
CN1131765C (zh) 2003-12-24
JP2002531933A (ja) 2002-09-24

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