JP2002531933A - 装填可能なハウジングを備えた反転可能な線形ポリッシャー - Google Patents

装填可能なハウジングを備えた反転可能な線形ポリッシャー

Info

Publication number
JP2002531933A
JP2002531933A JP2000585032A JP2000585032A JP2002531933A JP 2002531933 A JP2002531933 A JP 2002531933A JP 2000585032 A JP2000585032 A JP 2000585032A JP 2000585032 A JP2000585032 A JP 2000585032A JP 2002531933 A JP2002531933 A JP 2002531933A
Authority
JP
Japan
Prior art keywords
wafer
polishing
pad
housing
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000585032A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002531933A5 (enExample
Inventor
タリエー、ホマヨウン
Original Assignee
ナトゥール・インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ナトゥール・インコーポレイテッド filed Critical ナトゥール・インコーポレイテッド
Publication of JP2002531933A publication Critical patent/JP2002531933A/ja
Publication of JP2002531933A5 publication Critical patent/JP2002531933A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP2000585032A 1998-12-01 1999-11-19 装填可能なハウジングを備えた反転可能な線形ポリッシャー Withdrawn JP2002531933A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/201,928 US6103628A (en) 1998-12-01 1998-12-01 Reverse linear polisher with loadable housing
US09/201,928 1998-12-01
PCT/US1999/027477 WO2000032356A1 (en) 1998-12-01 1999-11-19 Reverse linear polisher with loadable housing

Publications (2)

Publication Number Publication Date
JP2002531933A true JP2002531933A (ja) 2002-09-24
JP2002531933A5 JP2002531933A5 (enExample) 2007-01-18

Family

ID=22747860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000585032A Withdrawn JP2002531933A (ja) 1998-12-01 1999-11-19 装填可能なハウジングを備えた反転可能な線形ポリッシャー

Country Status (10)

Country Link
US (2) US6103628A (enExample)
EP (1) EP1135236B1 (enExample)
JP (1) JP2002531933A (enExample)
KR (1) KR100638798B1 (enExample)
CN (1) CN1131765C (enExample)
AT (1) ATE280014T1 (enExample)
AU (1) AU1629900A (enExample)
DE (1) DE69921354T2 (enExample)
TW (1) TW425332B (enExample)
WO (1) WO2000032356A1 (enExample)

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US6468139B1 (en) * 1998-12-01 2002-10-22 Nutool, Inc. Polishing apparatus and method with a refreshing polishing belt and loadable housing
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US6244935B1 (en) * 1999-02-04 2001-06-12 Applied Materials, Inc. Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet
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US6520833B1 (en) * 2000-06-30 2003-02-18 Lam Research Corporation Oscillating fixed abrasive CMP system and methods for implementing the same
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US7078308B2 (en) * 2002-08-29 2006-07-18 Micron Technology, Inc. Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate
US7094131B2 (en) 2000-08-30 2006-08-22 Micron Technology, Inc. Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
US7160176B2 (en) * 2000-08-30 2007-01-09 Micron Technology, Inc. Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
US7153195B2 (en) 2000-08-30 2006-12-26 Micron Technology, Inc. Methods and apparatus for selectively removing conductive material from a microelectronic substrate
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US7220166B2 (en) * 2000-08-30 2007-05-22 Micron Technology, Inc. Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
US7129160B2 (en) * 2002-08-29 2006-10-31 Micron Technology, Inc. Method for simultaneously removing multiple conductive materials from microelectronic substrates
US7192335B2 (en) 2002-08-29 2007-03-20 Micron Technology, Inc. Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
US7112121B2 (en) 2000-08-30 2006-09-26 Micron Technology, Inc. Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
US7134934B2 (en) * 2000-08-30 2006-11-14 Micron Technology, Inc. Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
US6867448B1 (en) 2000-08-31 2005-03-15 Micron Technology, Inc. Electro-mechanically polished structure
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US6607425B1 (en) 2000-12-21 2003-08-19 Lam Research Corporation Pressurized membrane platen design for improving performance in CMP applications
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AU2002316240A1 (en) * 2001-06-12 2002-12-23 Nutool, Inc. Improved method and apparatus for bi-directionally polishing a workpiece
US6503131B1 (en) * 2001-08-16 2003-01-07 Applied Materials, Inc. Integrated platen assembly for a chemical mechanical planarization system
US7121919B2 (en) * 2001-08-30 2006-10-17 Micron Technology, Inc. Chemical mechanical polishing system and process
US6838149B2 (en) * 2001-12-13 2005-01-04 3M Innovative Properties Company Abrasive article for the deposition and polishing of a conductive material
US6776693B2 (en) 2001-12-19 2004-08-17 Applied Materials Inc. Method and apparatus for face-up substrate polishing
US6722946B2 (en) * 2002-01-17 2004-04-20 Nutool, Inc. Advanced chemical mechanical polishing system with smart endpoint detection
US20030146102A1 (en) * 2002-02-05 2003-08-07 Applied Materials, Inc. Method for forming copper interconnects
CN1653600A (zh) * 2002-03-13 2005-08-10 Asm努突尔股份有限公司 铜和阻障层之整合化学机械抛光的方法和设备
US6939203B2 (en) 2002-04-18 2005-09-06 Asm Nutool, Inc. Fluid bearing slide assembly for workpiece polishing
US7799200B1 (en) 2002-07-29 2010-09-21 Novellus Systems, Inc. Selective electrochemical accelerator removal
US7138039B2 (en) * 2003-01-21 2006-11-21 Applied Materials, Inc. Liquid isolation of contact rings
US7087144B2 (en) * 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
US7025861B2 (en) * 2003-02-06 2006-04-11 Applied Materials Contact plating apparatus
US7018273B1 (en) 2003-06-27 2006-03-28 Lam Research Corporation Platen with diaphragm and method for optimizing wafer polishing
US7100954B2 (en) 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
US20050016861A1 (en) * 2003-07-24 2005-01-27 Thomas Laursen Method for planarizing a work piece
US7112122B2 (en) * 2003-09-17 2006-09-26 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
US8530359B2 (en) 2003-10-20 2013-09-10 Novellus Systems, Inc. Modulated metal removal using localized wet etching
US8158532B2 (en) 2003-10-20 2012-04-17 Novellus Systems, Inc. Topography reduction and control by selective accelerator removal
US7153777B2 (en) 2004-02-20 2006-12-26 Micron Technology, Inc. Methods and apparatuses for electrochemical-mechanical polishing
US7648622B2 (en) 2004-02-27 2010-01-19 Novellus Systems, Inc. System and method for electrochemical mechanical polishing
US7195544B2 (en) * 2004-03-23 2007-03-27 Cabot Microelectronics Corporation CMP porous pad with component-filled pores
US6955588B1 (en) 2004-03-31 2005-10-18 Lam Research Corporation Method of and platen for controlling removal rate characteristics in chemical mechanical planarization
US20050218000A1 (en) * 2004-04-06 2005-10-06 Applied Materials, Inc. Conditioning of contact leads for metal plating systems
US7285195B2 (en) * 2004-06-24 2007-10-23 Applied Materials, Inc. Electric field reducing thrust plate
US7566391B2 (en) 2004-09-01 2009-07-28 Micron Technology, Inc. Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media
US20070014958A1 (en) * 2005-07-08 2007-01-18 Chaplin Ernest R Hanger labels, label assemblies and methods for forming the same
US8168540B1 (en) 2009-12-29 2012-05-01 Novellus Systems, Inc. Methods and apparatus for depositing copper on tungsten
JP2017148931A (ja) * 2016-02-19 2017-08-31 株式会社荏原製作所 研磨装置および研磨方法
KR102339948B1 (ko) * 2019-07-02 2021-12-17 (주)미래컴퍼니 연마 시스템 및 연마 방법
CN111955945A (zh) * 2020-08-27 2020-11-20 代永金 一种中医药柜的驱动装置
CN116833900B (zh) * 2023-07-31 2024-01-26 广东工业大学 一种用于半导体晶片化学机械抛光的磁流变弹性抛光垫、制备方法及其应用
CN117340689A (zh) * 2023-11-03 2024-01-05 湖南普照信息材料有限公司 一种玻璃基板的抛光方法

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Also Published As

Publication number Publication date
DE69921354T2 (de) 2005-10-13
TW425332B (en) 2001-03-11
KR100638798B1 (ko) 2006-10-25
DE69921354D1 (de) 2004-11-25
ATE280014T1 (de) 2004-11-15
WO2000032356A1 (en) 2000-06-08
EP1135236B1 (en) 2004-10-20
CN1329533A (zh) 2002-01-02
US6207572B1 (en) 2001-03-27
AU1629900A (en) 2000-06-19
KR20010089531A (ko) 2001-10-06
US6103628A (en) 2000-08-15
EP1135236A1 (en) 2001-09-26
CN1131765C (zh) 2003-12-24

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