KR100626186B1 - 본딩 암 요동형 본딩장치 - Google Patents

본딩 암 요동형 본딩장치 Download PDF

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Publication number
KR100626186B1
KR100626186B1 KR1020050004161A KR20050004161A KR100626186B1 KR 100626186 B1 KR100626186 B1 KR 100626186B1 KR 1020050004161 A KR1020050004161 A KR 1020050004161A KR 20050004161 A KR20050004161 A KR 20050004161A KR 100626186 B1 KR100626186 B1 KR 100626186B1
Authority
KR
South Korea
Prior art keywords
bonding
bonding arm
arm
shaft portion
rotation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020050004161A
Other languages
English (en)
Korean (ko)
Other versions
KR20050083022A (ko
Inventor
가쿠타니오사무
곤도유타카
세이노요시히코
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20050083022A publication Critical patent/KR20050083022A/ko
Application granted granted Critical
Publication of KR100626186B1 publication Critical patent/KR100626186B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J13/00—Circuit arrangements for providing remote monitoring or remote control of equipment in a power distribution network
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/904—Wire bonding

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Wire Bonding (AREA)
  • Manipulator (AREA)
  • Butt Welding And Welding Of Specific Article (AREA)
KR1020050004161A 2004-02-20 2005-01-17 본딩 암 요동형 본딩장치 Expired - Fee Related KR100626186B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004044576A JP4141394B2 (ja) 2004-02-20 2004-02-20 ボンディングアーム揺動型ボンディング装置
JPJP-P-2004-00044576 2004-02-20

Publications (2)

Publication Number Publication Date
KR20050083022A KR20050083022A (ko) 2005-08-24
KR100626186B1 true KR100626186B1 (ko) 2006-09-20

Family

ID=34858065

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050004161A Expired - Fee Related KR100626186B1 (ko) 2004-02-20 2005-01-17 본딩 암 요동형 본딩장치

Country Status (4)

Country Link
US (1) US7389805B2 (https=)
JP (1) JP4141394B2 (https=)
KR (1) KR100626186B1 (https=)
TW (1) TW200529342A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4616779B2 (ja) * 2006-03-06 2011-01-19 株式会社新川 ホーンホルダ揺動型ボンディング装置
JP4343985B2 (ja) * 2008-01-24 2009-10-14 株式会社新川 ボンディング装置及びボンディング装置のボンディングステージ高さ調整方法
CA3100435C (en) 2008-02-15 2024-01-30 Ceres, Inc. Drought and heat tolerance in plants
CN114798399B (zh) * 2022-03-14 2023-06-06 上海工程技术大学 一种超声换能器固定装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2755667B2 (ja) * 1989-03-27 1998-05-20 株式会社東芝 モータ駆動回路及びワイヤボンディング装置
US5114244A (en) * 1991-09-04 1992-05-19 Dunham James L Compliant bearing surface with enclosed fluid support
JP2638375B2 (ja) * 1992-02-20 1997-08-06 株式会社日立製作所 連続溶融金属メッキ装置及び連続溶融金属メッキ装置用軸受
JP4010186B2 (ja) 2002-05-30 2007-11-21 日本電気株式会社 ボンディング装置

Also Published As

Publication number Publication date
JP4141394B2 (ja) 2008-08-27
US7389805B2 (en) 2008-06-24
KR20050083022A (ko) 2005-08-24
TWI330874B (https=) 2010-09-21
TW200529342A (en) 2005-09-01
JP2005236104A (ja) 2005-09-02
US20050184127A1 (en) 2005-08-25

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