KR100592121B1 - 플립 칩 조립을 위한 무세정 플럭스 - Google Patents

플립 칩 조립을 위한 무세정 플럭스 Download PDF

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Publication number
KR100592121B1
KR100592121B1 KR1020007010254A KR20007010254A KR100592121B1 KR 100592121 B1 KR100592121 B1 KR 100592121B1 KR 1020007010254 A KR1020007010254 A KR 1020007010254A KR 20007010254 A KR20007010254 A KR 20007010254A KR 100592121 B1 KR100592121 B1 KR 100592121B1
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KR
South Korea
Prior art keywords
substrate
die
flux
flip chip
clean flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020007010254A
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English (en)
Korean (ko)
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KR20010041942A (ko
Inventor
마스터라엔.
스타오리온케이.
가다도마리아지.
칸모함마드주바이르
Original Assignee
어드밴스드 마이크로 디바이시즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 어드밴스드 마이크로 디바이시즈, 인코포레이티드 filed Critical 어드밴스드 마이크로 디바이시즈, 인코포레이티드
Publication of KR20010041942A publication Critical patent/KR20010041942A/ko
Application granted granted Critical
Publication of KR100592121B1 publication Critical patent/KR100592121B1/ko
Assigned to 글로벌파운드리즈 인크. reassignment 글로벌파운드리즈 인크. 권리의 전부이전등록 Assignors: 어드밴스드 마이크로 디바이시즈, 인코포레이티드
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020007010254A 1998-03-17 1999-03-17 플립 칩 조립을 위한 무세정 플럭스 Expired - Fee Related KR100592121B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/040,643 1998-03-17
US09/040,643 US6103549A (en) 1998-03-17 1998-03-17 No clean flux for flip chip assembly
US9/040,643 1998-03-17
PCT/US1999/005868 WO1999048146A1 (en) 1998-03-17 1999-03-17 No clean flux for flip chip assembly

Publications (2)

Publication Number Publication Date
KR20010041942A KR20010041942A (ko) 2001-05-25
KR100592121B1 true KR100592121B1 (ko) 2006-06-22

Family

ID=21912121

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007010254A Expired - Fee Related KR100592121B1 (ko) 1998-03-17 1999-03-17 플립 칩 조립을 위한 무세정 플럭스

Country Status (5)

Country Link
US (1) US6103549A (https=)
EP (1) EP1066650A1 (https=)
JP (1) JP2002507838A (https=)
KR (1) KR100592121B1 (https=)
WO (1) WO1999048146A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6429238B1 (en) * 1999-06-10 2002-08-06 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
US6475828B1 (en) * 1999-11-10 2002-11-05 Lsi Logic Corporation Method of using both a non-filled flux underfill and a filled flux underfill to manufacture a flip-chip
US6656765B1 (en) * 2000-02-02 2003-12-02 Amkor Technology, Inc. Fabricating very thin chip size semiconductor packages
US7547579B1 (en) * 2000-04-06 2009-06-16 Micron Technology, Inc. Underfill process
US6333210B1 (en) 2000-05-25 2001-12-25 Advanced Micro Devices, Inc. Process of ensuring detect free placement by solder coating on package pads
US6528169B2 (en) 2000-07-06 2003-03-04 3M Innovative Properties Company No-flow flux adhesive compositions
US6333253B1 (en) * 2000-08-24 2001-12-25 Advanced Micro Devices, Inc. Pattern-block flux deposition
US6412680B1 (en) * 2000-09-26 2002-07-02 Agere Systems Guardian Corp. Dual-in-line BGA ball mounter
US6713318B2 (en) * 2001-03-28 2004-03-30 Intel Corporation Flip chip interconnection using no-clean flux
US6935553B2 (en) * 2002-04-16 2005-08-30 Senju Metal Industry Co., Ltd. Reflow soldering method
US6887319B2 (en) 2002-04-16 2005-05-03 Senju Metal Industry Co., Ltd. Residue-free solder paste
US6835593B2 (en) * 2002-08-01 2004-12-28 Rohm Co., Ltd. Method for manufacturing semiconductor device
US7842948B2 (en) 2004-02-27 2010-11-30 Nvidia Corporation Flip chip semiconductor die internal signal access system and method
JP2007189210A (ja) * 2005-12-13 2007-07-26 Shin Etsu Chem Co Ltd フリップチップ型半導体装置の組立方法及びその方法を用いて製作された半導体装置
US7767032B2 (en) 2006-06-30 2010-08-03 W.C. Heraeus Holding GmbH No-clean low-residue solder paste for semiconductor device applications
JP5920143B2 (ja) * 2012-09-25 2016-05-18 豊田合成株式会社 Ｌｅｄチップの実装方法
US20170173745A1 (en) 2015-12-22 2017-06-22 International Business Machines Corporation No clean flux composition and methods for use thereof
US12138714B2 (en) * 2018-03-09 2024-11-12 Origin Company, Limited Flux, solder paste, soldering process, method for producing soldered product, and method for producing BGA package

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03238195A (ja) * 1990-02-16 1991-10-23 Nippon Alpha Metals Kk フラックス組成物
JPH05243331A (ja) * 1992-03-02 1993-09-21 Sharp Corp 半導体装置の実装方法
US6077725A (en) * 1992-09-03 2000-06-20 Lucent Technologies Inc Method for assembling multichip modules
JPH0758447A (ja) * 1993-08-18 1995-03-03 Nippon Signal Co Ltd:The 電子部品の実装方法
JPH0825082A (ja) * 1994-07-07 1996-01-30 Harima Chem Inc 仮固定性フラックス
US5872051A (en) * 1995-08-02 1999-02-16 International Business Machines Corporation Process for transferring material to semiconductor chip conductive pads using a transfer substrate
US5647123A (en) * 1995-10-16 1997-07-15 Motorola, Inc. Method for improving distribution of underfill between a flip chip die and a circuit board
JPH09153519A (ja) * 1995-11-30 1997-06-10 Citizen Watch Co Ltd 半導体の実装構造
US5704116A (en) * 1996-05-03 1998-01-06 Motorola, Inc. Method of holding a component using an anhydride fluxing agent
US5953814A (en) * 1998-02-27 1999-09-21 Delco Electronics Corp. Process for producing flip chip circuit board assembly exhibiting enhanced reliability

Also Published As

Publication number Publication date
KR20010041942A (ko) 2001-05-25
US6103549A (en) 2000-08-15
EP1066650A1 (en) 2001-01-10
WO1999048146A1 (en) 1999-09-23
JP2002507838A (ja) 2002-03-12

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