JP2002507838A - フリップチップアセンブリのための洗浄不要フラックス - Google Patents

フリップチップアセンブリのための洗浄不要フラックス

Info

Publication number
JP2002507838A
JP2002507838A JP2000537259A JP2000537259A JP2002507838A JP 2002507838 A JP2002507838 A JP 2002507838A JP 2000537259 A JP2000537259 A JP 2000537259A JP 2000537259 A JP2000537259 A JP 2000537259A JP 2002507838 A JP2002507838 A JP 2002507838A
Authority
JP
Japan
Prior art keywords
substrate
die
cleaning
flux
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000537259A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002507838A5 (https=
Inventor
マスター，ラージ・エヌ
スター，オリオン・ケイ
グアーダド，マリア・ジィ
カーン，モハンマド・ズーバイア
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of JP2002507838A publication Critical patent/JP2002507838A/ja
Publication of JP2002507838A5 publication Critical patent/JP2002507838A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2000537259A 1998-03-17 1999-03-17 フリップチップアセンブリのための洗浄不要フラックス Pending JP2002507838A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/040,643 1998-03-17
US09/040,643 US6103549A (en) 1998-03-17 1998-03-17 No clean flux for flip chip assembly
PCT/US1999/005868 WO1999048146A1 (en) 1998-03-17 1999-03-17 No clean flux for flip chip assembly

Publications (2)

Publication Number Publication Date
JP2002507838A true JP2002507838A (ja) 2002-03-12
JP2002507838A5 JP2002507838A5 (https=) 2006-04-06

Family

ID=21912121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000537259A Pending JP2002507838A (ja) 1998-03-17 1999-03-17 フリップチップアセンブリのための洗浄不要フラックス

Country Status (5)

Country Link
US (1) US6103549A (https=)
EP (1) EP1066650A1 (https=)
JP (1) JP2002507838A (https=)
KR (1) KR100592121B1 (https=)
WO (1) WO1999048146A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007189210A (ja) * 2005-12-13 2007-07-26 Shin Etsu Chem Co Ltd フリップチップ型半導体装置の組立方法及びその方法を用いて製作された半導体装置
JP2014067782A (ja) * 2012-09-25 2014-04-17 Toyoda Gosei Co Ltd Ｌｅｄチップの実装方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6429238B1 (en) * 1999-06-10 2002-08-06 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
US6475828B1 (en) * 1999-11-10 2002-11-05 Lsi Logic Corporation Method of using both a non-filled flux underfill and a filled flux underfill to manufacture a flip-chip
US6656765B1 (en) * 2000-02-02 2003-12-02 Amkor Technology, Inc. Fabricating very thin chip size semiconductor packages
US7547579B1 (en) * 2000-04-06 2009-06-16 Micron Technology, Inc. Underfill process
US6333210B1 (en) 2000-05-25 2001-12-25 Advanced Micro Devices, Inc. Process of ensuring detect free placement by solder coating on package pads
US6528169B2 (en) 2000-07-06 2003-03-04 3M Innovative Properties Company No-flow flux adhesive compositions
US6333253B1 (en) * 2000-08-24 2001-12-25 Advanced Micro Devices, Inc. Pattern-block flux deposition
US6412680B1 (en) * 2000-09-26 2002-07-02 Agere Systems Guardian Corp. Dual-in-line BGA ball mounter
US6713318B2 (en) * 2001-03-28 2004-03-30 Intel Corporation Flip chip interconnection using no-clean flux
US6935553B2 (en) * 2002-04-16 2005-08-30 Senju Metal Industry Co., Ltd. Reflow soldering method
US6887319B2 (en) 2002-04-16 2005-05-03 Senju Metal Industry Co., Ltd. Residue-free solder paste
US6835593B2 (en) * 2002-08-01 2004-12-28 Rohm Co., Ltd. Method for manufacturing semiconductor device
US7842948B2 (en) 2004-02-27 2010-11-30 Nvidia Corporation Flip chip semiconductor die internal signal access system and method
US7767032B2 (en) 2006-06-30 2010-08-03 W.C. Heraeus Holding GmbH No-clean low-residue solder paste for semiconductor device applications
US20170173745A1 (en) 2015-12-22 2017-06-22 International Business Machines Corporation No clean flux composition and methods for use thereof
US12138714B2 (en) * 2018-03-09 2024-11-12 Origin Company, Limited Flux, solder paste, soldering process, method for producing soldered product, and method for producing BGA package

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03238195A (ja) * 1990-02-16 1991-10-23 Nippon Alpha Metals Kk フラックス組成物
JPH05243331A (ja) * 1992-03-02 1993-09-21 Sharp Corp 半導体装置の実装方法
JPH0758447A (ja) * 1993-08-18 1995-03-03 Nippon Signal Co Ltd:The 電子部品の実装方法
JPH0825082A (ja) * 1994-07-07 1996-01-30 Harima Chem Inc 仮固定性フラックス
JPH09153519A (ja) * 1995-11-30 1997-06-10 Citizen Watch Co Ltd 半導体の実装構造
US5647123A (en) * 1995-10-16 1997-07-15 Motorola, Inc. Method for improving distribution of underfill between a flip chip die and a circuit board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6077725A (en) * 1992-09-03 2000-06-20 Lucent Technologies Inc Method for assembling multichip modules
US5872051A (en) * 1995-08-02 1999-02-16 International Business Machines Corporation Process for transferring material to semiconductor chip conductive pads using a transfer substrate
US5704116A (en) * 1996-05-03 1998-01-06 Motorola, Inc. Method of holding a component using an anhydride fluxing agent
US5953814A (en) * 1998-02-27 1999-09-21 Delco Electronics Corp. Process for producing flip chip circuit board assembly exhibiting enhanced reliability

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03238195A (ja) * 1990-02-16 1991-10-23 Nippon Alpha Metals Kk フラックス組成物
JPH05243331A (ja) * 1992-03-02 1993-09-21 Sharp Corp 半導体装置の実装方法
JPH0758447A (ja) * 1993-08-18 1995-03-03 Nippon Signal Co Ltd:The 電子部品の実装方法
JPH0825082A (ja) * 1994-07-07 1996-01-30 Harima Chem Inc 仮固定性フラックス
US5647123A (en) * 1995-10-16 1997-07-15 Motorola, Inc. Method for improving distribution of underfill between a flip chip die and a circuit board
JPH09153519A (ja) * 1995-11-30 1997-06-10 Citizen Watch Co Ltd 半導体の実装構造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007189210A (ja) * 2005-12-13 2007-07-26 Shin Etsu Chem Co Ltd フリップチップ型半導体装置の組立方法及びその方法を用いて製作された半導体装置
JP2014067782A (ja) * 2012-09-25 2014-04-17 Toyoda Gosei Co Ltd Ｌｅｄチップの実装方法

Also Published As

Publication number Publication date
KR20010041942A (ko) 2001-05-25
US6103549A (en) 2000-08-15
KR100592121B1 (ko) 2006-06-22
EP1066650A1 (en) 2001-01-10
WO1999048146A1 (en) 1999-09-23

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