KR100556088B1 - 바륨 및 스트론튬을 함유하는 산화 박막의 성장 방법 - Google Patents
바륨 및 스트론튬을 함유하는 산화 박막의 성장 방법 Download PDFInfo
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- KR100556088B1 KR100556088B1 KR1020017003180A KR20017003180A KR100556088B1 KR 100556088 B1 KR100556088 B1 KR 100556088B1 KR 1020017003180 A KR1020017003180 A KR 1020017003180A KR 20017003180 A KR20017003180 A KR 20017003180A KR 100556088 B1 KR100556088 B1 KR 100556088B1
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- Prior art keywords
- thin film
- oxide thin
- group
- titanium
- growing oxide
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 65
- 239000010409 thin film Substances 0.000 title claims abstract description 52
- 229910052788 barium Inorganic materials 0.000 title claims abstract description 35
- 229910052712 strontium Inorganic materials 0.000 title claims abstract description 28
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 title claims abstract description 23
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 239000002243 precursor Substances 0.000 claims abstract description 35
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 claims abstract description 18
- 239000010408 film Substances 0.000 claims description 49
- 239000010936 titanium Substances 0.000 claims description 29
- 229910052760 oxygen Inorganic materials 0.000 claims description 21
- 229930195733 hydrocarbon Natural products 0.000 claims description 18
- 239000001301 oxygen Substances 0.000 claims description 18
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 17
- 150000001875 compounds Chemical class 0.000 claims description 16
- 229910052719 titanium Inorganic materials 0.000 claims description 15
- -1 cyclopentadienyl compound Chemical class 0.000 claims description 14
- 150000002430 hydrocarbons Chemical class 0.000 claims description 14
- 239000003446 ligand Substances 0.000 claims description 13
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 11
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 claims description 11
- 150000003609 titanium compounds Chemical class 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 8
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 6
- 125000004122 cyclic group Chemical group 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 5
- 238000000137 annealing Methods 0.000 claims description 5
- 125000004429 atom Chemical group 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 5
- 230000007935 neutral effect Effects 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 239000011593 sulfur Substances 0.000 claims description 5
- 229910052717 sulfur Inorganic materials 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 125000003342 alkenyl group Chemical group 0.000 claims description 4
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 125000002877 alkyl aryl group Chemical group 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 4
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 4
- 125000005842 heteroatom Chemical group 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 229920000768 polyamine Polymers 0.000 claims description 4
- 229910052711 selenium Inorganic materials 0.000 claims description 4
- 239000011669 selenium Substances 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 125000001424 substituent group Chemical group 0.000 claims description 4
- 125000000446 sulfanediyl group Chemical group *S* 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical compound N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 3
- 150000004703 alkoxides Chemical class 0.000 claims description 3
- 150000004820 halides Chemical class 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- QDZRBIRIPNZRSG-UHFFFAOYSA-N titanium nitrate Chemical class [O-][N+](=O)O[Ti](O[N+]([O-])=O)(O[N+]([O-])=O)O[N+]([O-])=O QDZRBIRIPNZRSG-UHFFFAOYSA-N 0.000 claims description 3
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Natural products C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 claims description 2
- 239000002262 Schiff base Substances 0.000 claims description 2
- 150000004753 Schiff bases Chemical class 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910004121 SrRuO Inorganic materials 0.000 claims description 2
- 125000003282 alkyl amino group Chemical group 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims description 2
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 229910052785 arsenic Inorganic materials 0.000 claims description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 2
- 150000001721 carbon Chemical group 0.000 claims description 2
- 150000007942 carboxylates Chemical class 0.000 claims description 2
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 claims description 2
- 125000003454 indenyl group Chemical group C1(C=CC2=CC=CC=C12)* 0.000 claims description 2
- 229910017464 nitrogen compound Inorganic materials 0.000 claims description 2
- 150000002830 nitrogen compounds Chemical class 0.000 claims description 2
- 125000002097 pentamethylcyclopentadienyl group Chemical group 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 229910052714 tellurium Inorganic materials 0.000 claims description 2
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 2
- 150000003568 thioethers Chemical class 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 3
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000003877 atomic layer epitaxy Methods 0.000 description 19
- 239000000463 material Substances 0.000 description 15
- 238000000151 deposition Methods 0.000 description 12
- 230000008021 deposition Effects 0.000 description 12
- 239000012528 membrane Substances 0.000 description 10
- 238000005229 chemical vapour deposition Methods 0.000 description 9
- 229910002367 SrTiO Inorganic materials 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 238000010926 purge Methods 0.000 description 5
- 238000006557 surface reaction Methods 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000004377 microelectronic Methods 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002887 superconductor Substances 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- XWEUUHFMEWZZNX-UHFFFAOYSA-N C(C)(C)C1=C(C(C=C1)(C(C)C)[Sr]C1(C(=C(C=C1)C(C)C)C(C)C)C(C)C)C(C)C Chemical compound C(C)(C)C1=C(C(C=C1)(C(C)C)[Sr]C1(C(=C(C=C1)C(C)C)C(C)C)C(C)C)C(C)C XWEUUHFMEWZZNX-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- 229910002826 PrBa Inorganic materials 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 238000000277 atomic layer chemical vapour deposition Methods 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- OSVXSBDYLRYLIG-UHFFFAOYSA-N dioxidochlorine(.) Chemical compound O=Cl=O OSVXSBDYLRYLIG-UHFFFAOYSA-N 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 125000002524 organometallic group Chemical group 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 150000003438 strontium compounds Chemical class 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 229910001868 water Inorganic materials 0.000 description 2
- CHEANNSDVJOIBS-MHZLTWQESA-N (3s)-3-cyclopropyl-3-[3-[[3-(5,5-dimethylcyclopenten-1-yl)-4-(2-fluoro-5-methoxyphenyl)phenyl]methoxy]phenyl]propanoic acid Chemical compound COC1=CC=C(F)C(C=2C(=CC(COC=3C=C(C=CC=3)[C@@H](CC(O)=O)C3CC3)=CC=2)C=2C(CCC=2)(C)C)=C1 CHEANNSDVJOIBS-MHZLTWQESA-N 0.000 description 1
- ZBFBXTFQCKIUHU-UHFFFAOYSA-L 1,2,3,5,5-pentamethylcyclopenta-1,3-diene;titanium(4+);dichloride Chemical compound [Cl-].[Cl-].[Ti+4].CC1=[C-]C(C)(C)C(C)=C1C.CC1=[C-]C(C)(C)C(C)=C1C ZBFBXTFQCKIUHU-UHFFFAOYSA-L 0.000 description 1
- YNJSNEKCXVFDKW-UHFFFAOYSA-N 3-(5-amino-1h-indol-3-yl)-2-azaniumylpropanoate Chemical compound C1=C(N)C=C2C(CC(N)C(O)=O)=CNC2=C1 YNJSNEKCXVFDKW-UHFFFAOYSA-N 0.000 description 1
- HNVQSKMSMUWYPC-UHFFFAOYSA-N C1(C=CC=C1)[Ti](N(C)C)(N(C)C)C1C=CC=C1 Chemical compound C1(C=CC=C1)[Ti](N(C)C)(N(C)C)C1C=CC=C1 HNVQSKMSMUWYPC-UHFFFAOYSA-N 0.000 description 1
- QUJWBBABMDGOEA-UHFFFAOYSA-N CC1=C(C(=C(C1(C)[Ba]C1(C(=C(C(=C1C)C)C)C)C)C)C)C Chemical compound CC1=C(C(=C(C1(C)[Ba]C1(C(=C(C(=C1C)C)C)C)C)C)C)C QUJWBBABMDGOEA-UHFFFAOYSA-N 0.000 description 1
- XZYIDIRMVBJDRM-UHFFFAOYSA-N CN(C)[Ti](N(C)C)(N(C)C)C(C)(C)C Chemical compound CN(C)[Ti](N(C)C)(N(C)C)C(C)(C)C XZYIDIRMVBJDRM-UHFFFAOYSA-N 0.000 description 1
- 239000004155 Chlorine dioxide Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- LCKIEQZJEYYRIY-UHFFFAOYSA-N Titanium ion Chemical compound [Ti+4] LCKIEQZJEYYRIY-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 235000019398 chlorine dioxide Nutrition 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- VJDVOZLYDLHLSM-UHFFFAOYSA-N diethylazanide;titanium(4+) Chemical compound [Ti+4].CC[N-]CC.CC[N-]CC.CC[N-]CC.CC[N-]CC VJDVOZLYDLHLSM-UHFFFAOYSA-N 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- LNKYFCABELSPAN-UHFFFAOYSA-N ethyl(methyl)azanide;titanium(4+) Chemical compound [Ti+4].CC[N-]C.CC[N-]C.CC[N-]C.CC[N-]C LNKYFCABELSPAN-UHFFFAOYSA-N 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 150000004694 iodide salts Chemical class 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- CKRYLEYIENXWNN-UHFFFAOYSA-N methyl(propan-2-yl)azanide;titanium(4+) Chemical compound [Ti+4].C[N-]C(C)C.C[N-]C(C)C.C[N-]C(C)C.C[N-]C(C)C CKRYLEYIENXWNN-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 150000002927 oxygen compounds Chemical class 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- VUWPOFFYSGYZQR-UHFFFAOYSA-L tert-butylcyclopentane;dichlorotitanium Chemical compound Cl[Ti]Cl.CC(C)(C)[C]1[CH][CH][CH][CH]1.CC(C)(C)[C]1[CH][CH][CH][CH]1 VUWPOFFYSGYZQR-UHFFFAOYSA-L 0.000 description 1
- MNWRORMXBIWXCI-UHFFFAOYSA-N tetrakis(dimethylamido)titanium Chemical compound CN(C)[Ti](N(C)C)(N(C)C)N(C)C MNWRORMXBIWXCI-UHFFFAOYSA-N 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
- H10N60/0436—Processes for depositing or forming copper oxide superconductor layers by chemical vapour deposition [CVD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/409—Oxides of the type ABO3 with A representing alkali, alkaline earth metal or lead and B representing a refractory metal, nickel, scandium or a lanthanide
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
- C30B29/22—Complex oxides
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- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
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Abstract
Description
원자층 화학 기상증착(ALCVD) 또는 원자층 증착(ALD: Atomic Layer Deposition)으로도 알려져 있는 원자층 에피택시(ALE: Atomic Layer Epitaxy)는 박막의 증착을 위한 공지된 방법이다(미국 특허 공보 제 4,085,430호). 이 방법에서, 박막은 교대로 일어나는 포화 표면 반응에 의해 증착된다. 이들 반응은 기체성 또는 기화 전구체를 반응기로 교대로 도입하고 전구체 펄스 사이에서 불활성 가스로 반응기를 정화함으로써 수행된다(티. 순토라, 고체 박막 215 (1992) 84; 니이니스퇴 등, 머티어리얼스 사이언스 및 엔지니어링 B 41 (1996) 23 참조). 추가로, ALE는 대형 표면상에서도 균일한 두께의 층을 증착하는데 이용될 수 있으며, 반응 사이클의 수에 의해 두께 및 조성을 제어하는 것이 정확하고 간단하다.
Claims (19)
- 기판 상에 산화 박막을 성장시키는 방법으로서,상기 막이, ALE 프로세스에 의해서, 전구체로서 바륨 또는 스트론튬의 시클로펜타디에닐 화합물을 하나 이상의 휘발성 티타늄 화합물과 반응 산소 전구체와 함께 사용함으로써 생성되는 것을 특징으로 하는,산화 박막의 성장 방법.
- 제 1 항에 있어서,상기 기판 상에 성장될 상기 산화 박막은 유전체인 것을 특징으로 하는,산화 박막의 성장 방법.
- 제 1 항 또는 제 2 항에 있어서,상기 산화 박막의 성장 방법은 1 내지 10 회의 연속적인 성장 사이클로 수행되며, 상기 하나의 성장 사이클은 Ba 화합물, Sr 화합물 또는 휘발성 티타늄 화합물을 공급하는 단계; 불활성 가스의 정화 단계; 산소용 전구체의 공급 단계; 및 제 2불활성 가스의 정화 단계로 이루어지는 것을 특징으로 하는,산화 박막의 성장 방법.
- 제 3 항에 있어서,상기 사이클에서 상기 바륨 또는 스트론튬의 시클로펜타디에닐 화합물과 상기 티타늄 화합물의 비는 0.8 내지 1.2인 것을 특징으로 하는,산화 박막의 성장 방법.
- 제 1 항 또는 제 2 항에 있어서,상기 휘발성 티타늄 화합물은 티타늄 할라이드, 티타늄 알콕시드, 티타늄 니트레이트(Ti(NO3)4), 티타늄의 알킬아미노 착물, 티타늄의 시클로펜타디에닐 착물, 티타늄의 시릴아미도 착물, 티타늄 디알킬디티오카르바메이트와 티타늄-β-디케토네이트로 이루어지는 그룹으로부터 선택되는 어느 하나인 것을 특징으로 하는,산화 박막의 성장 방법.
- 제 1 항 또는 제 2 항에 있어서,상기 막 성장 기판은 백금(pt), RuO2, IrO2, SrRuO3, LaSrCoO3, IrO2/Ir, RuO2/Pt, 실리카(SiO2), 질화실리콘과 실리콘으로 이루어지는 그룹으로부터 선택되는 어느 하나의 표면인 것을 특징으로 하는,산화 박막의 성장 방법.
- 제 1 항 또는 제 2 항에 있어서,사용된 상기 반응 산소 전구체는 산소(O2), 수증기, 과산화수소, 과산화 수소의 수용액과 오존으로 이루어지는 그룹으로부터 선택되는 어느 하나인 것을 특징으로 하는,산화 박막의 성장 방법.
- 제 1 항에 있어서,상기 전구체의 화학식은 M(Cp)2 또는 M(Cp)2Ln 이며,여기서 M은 Sr 또는 Ba이고;Cp는 Cp'RmH5-m 형태의 융합 또는 싱글 시클로펜타디에닐 그룹이며,여기서 m은 0 내지 5의 정수이고,R은 탄화수소 그룹이며, 상기 탄화수소 그룹은 동일하거나 상이하며;상기 Cp 그룹은 동일하거나 상이하며,Ln은 하나 또는 수 개의 원자에 의해 금속에 결합하는 중성 첨가생성물 리간드인 것을 특징으로 하는,산화 박막의 성장 방법.
- 제 1 항에 있어서,상기 Sr 또는 Ba에 대한 전구체는 M(Cp)X 또는 M(Cp)XLn 형태이며,여기서, M은 Sr 또는 Ba이고;Cp는 Cp'RmH5-m 형태의 융합 또는 싱글 시클로펜타디에닐 그룹이며,여기서 m은 0 내지 5의 정수이고,R은 탄화수소 그룹이며, 상기 R은 동일하거나 다르며;X는 -1가를 가진, Cp와 다른 리간드이며,L은 하나 또는 수 개의 원자에 의해 금속에 결합하는 중성 첨가생성물 리간드인 것을 특징으로 하는,산화 박막의 성장 방법.
- 제 8 항 또는 제 9 항에 있어서,상기 시클로펜타디에닐 그룹은 시클로펜타디에닐, 펜타메틸시클로펜타디에닐, 트리이소프로필시클로펜타디에닐, 인데닐과 플루오레닐로 이루어지는 그룹으로부터 선택되는 어느 하나인 것을 특징으로 하는,산화 박막의 성장 방법.
- 제 8 항 또는 제 9 항에 있어서,상기 Cp 그룹은 동일한 분자 내에 함유되어 있는 것을 특징으로 하는,산화 박막의 성장 방법.
- 제 11 항에 있어서,상기 두 Cp 그룹 사이의 브리지는 치환 또는 비치환 C1-C6 탄소 체인으로 구성되어 있는 것을 특징으로 하는,산화 박막의 성장 방법.
- 제 12 항에 있어서,상기 브리지를 형성하는 탄소 체인은 실리콘, 질소, 인, 세레늄과 황으로 이루어지는 그룹으로부터 선택되는 어느 하나인 헤테로원자를 함유하는 것을 특징으로 하는,산화 박막의 성장 방법.
- 제 8 항 또는 제 9 항에 있어서,상기 R은 치환되거나 치환되지 않은 순환형, 선형 또는 분지형 알킬, 알케닐, 아릴, 알킬아릴, 아릴알킬, 알콕시, 티오, 아미노, 시아노와 시릴 그룹으로 이루어지는 그룹으로부터 선택되는 어느 하나인 것을 특징으로 하는,산화 박막의 성장 방법.
- 제 8 항 또는 제 9 항에 있어서,상기 중성 첨가생성물 리간드 L은,(i) 탄화수소,(ii) 산소 함유 탄화수소,(iii) 질소 함유 탄화수소,(iv) 황 함유 탄화수소,(v) 인 함유 탄화수소,(vi) 비소 함유 탄화수소,(vii) 셀레늄 함유 탄화수소와,(viii) 텔루륨 함유 탄화수소로 이루어지는 그룹으로부터 선택되는 어느 하나인 것을 특징으로 하는,산화 박막의 성장 방법.
- 제 8 항 또는 제 9 항에 있어서,상기 L은,(a) 아민 또는 폴리아민,(b) 비피리딘,(c) 아래 식에 의해 표시된 리간드:상기 식에서, G는 -O-, -S-, 또는 -NR1-이고, R1은 수소 또는 치환형 또는 비치환형, 순환형, 선형 또는 분지형, 알킬, 알케닐, 아릴, 알킬아릴, 아릴알킬, 알콕시, 티오, 시아노 또는 시릴 그룹이며, 상기 식에 따른 링의 각 탄소 원자내에는 상호 동일하거나 다른 R1과 같은 치환체가 있으며,(d) 에테르와,(e) 티오에테르로 이루어지는 그룹으로부터 선택되는 어느 하나인 것을 특징으로 하는,산화 박막의 성장 방법.
- 제 8 항 또는 제 9 항에 있어서,상기 L은 에테르, 폴리에테르, 아민, 폴리아민, 비피리딘과 테트라하이드로프란으로 이루어지는 그룹으로부터 선택되는 어느 하나인 것을 특징으로 하는,산화 박막의 성장 방법.
- 제 9 항에 있어서,상기 X는 β-케토네이트 또는 대응하는 황 또는 질소 화합물, 알킬, 할라이드, 아미드, 알콕시드, 카르복실레이트와 쉬프계(Schiff base)로 이루어지는 그룹으로부터 선택되는 어느 하나인 것을 특징으로 하는,산화 박막의 성장 방법.
- 제 1 항 또는 제 2 항에 있어서,상기 막의 성장은 250-300℃에서 일어나고, 상기 성장후의 후어닐링은 상기 성장 온도보다 높은 온도에서 일어나는 것을 특징으로 하는,산화 박막의 성장 방법.
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WO2000015865A1 (en) | 2000-03-23 |
FI108375B (fi) | 2002-01-15 |
JP2002525426A (ja) | 2002-08-13 |
FI981959A0 (fi) | 1998-09-11 |
JP4514337B2 (ja) | 2010-07-28 |
FI981959A (fi) | 2000-03-12 |
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