ES2060622T3 - Metodo para la fabricacion de superconductores de elevada tc, que tienen estructura estratificada. - Google Patents

Metodo para la fabricacion de superconductores de elevada tc, que tienen estructura estratificada.

Info

Publication number
ES2060622T3
ES2060622T3 ES88108908T ES88108908T ES2060622T3 ES 2060622 T3 ES2060622 T3 ES 2060622T3 ES 88108908 T ES88108908 T ES 88108908T ES 88108908 T ES88108908 T ES 88108908T ES 2060622 T3 ES2060622 T3 ES 2060622T3
Authority
ES
Spain
Prior art keywords
inlets
superconductors
elevated
manufacture
constituent components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES88108908T
Other languages
English (en)
Inventor
Volker Dr Graf
Carl Alexander Prof Dr Muller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of ES2060622T3 publication Critical patent/ES2060622T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
    • C30B29/68—Crystals with laminate structure, e.g. "superlattices"
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H10N60/0268—Manufacture or treatment of devices comprising copper oxide
    • H10N60/0296—Processes for depositing or forming superconductor layers
    • H10N60/0576—Processes for depositing or forming superconductor layers characterised by the substrate
    • H10N60/0604—Monocrystalline substrates, e.g. epitaxial growth
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/80—Constructional details
    • H10N60/85—Superconducting active materials
    • H10N60/855—Ceramic materials
    • H10N60/857—Ceramic materials comprising copper oxide

Abstract

ESTE ES UN METODO PARA FABRICAR ESTRUCTURAS LAMINADAS DE COMPONENTES ARTIFICIALES SUPERCONDUCTORES DE ALTA-TC CUYA PARTE SUPERIOR DE CRISTAL EN GRANO (7) TIENE UNA ESTRUCTURA ENREJADA DEL COMPONENTE SUPERCONDUCTOR PARA SER FABRICADA, LAMINAS DE OXIDO (4, 5, 6) DE TODOS LOS COMPONENTES CONSTITUYENTES SON EPITAXIALMENTE CRECIDAS EN UNA PREDETERMINADA SECUENCIA ASI COMO PARA CREAR UNA ESTRUCTURA SANDWICH NO ENCONTRADA EN CRISTALES NATURALES. LA DISPOSICION EPITAXIAL DE LOS COMPONENTES CONSTITUYENTES ES FORMADA EN UNA CAMARA DE REACCION QUE TIENEN FACILIDADES DE EVAPORACION, ENTRADAS DE GASES META-ORGANICOS Y ENTRADA PARA GASES DE FONDO INCLUIDO OXIGENO.
ES88108908T 1988-06-03 1988-06-03 Metodo para la fabricacion de superconductores de elevada tc, que tienen estructura estratificada. Expired - Lifetime ES2060622T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP88108908A EP0344352B1 (en) 1988-06-03 1988-06-03 Method for making artificial layered high-Tc superconductors

Publications (1)

Publication Number Publication Date
ES2060622T3 true ES2060622T3 (es) 1994-12-01

Family

ID=8199027

Family Applications (1)

Application Number Title Priority Date Filing Date
ES88108908T Expired - Lifetime ES2060622T3 (es) 1988-06-03 1988-06-03 Metodo para la fabricacion de superconductores de elevada tc, que tienen estructura estratificada.

Country Status (8)

Country Link
US (1) US5439876A (es)
EP (1) EP0344352B1 (es)
JP (1) JPH0761920B2 (es)
AT (1) ATE112418T1 (es)
BR (1) BR8902555A (es)
CA (1) CA1330193C (es)
DE (1) DE3851701T2 (es)
ES (1) ES2060622T3 (es)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69219817T2 (de) * 1991-03-22 1997-10-16 Canon Kk Metalloxidisches Material
EP0586774B1 (en) * 1992-09-11 1997-05-02 International Business Machines Corporation Process for manufacturing thin films by multilayer deposition
US5972430A (en) * 1997-11-26 1999-10-26 Advanced Technology Materials, Inc. Digital chemical vapor deposition (CVD) method for forming a multi-component oxide layer
FI108375B (fi) * 1998-09-11 2002-01-15 Asm Microchemistry Oy Menetelmõ eristõvien oksidiohutkalvojen valmistamiseksi
US20060219157A1 (en) 2001-06-28 2006-10-05 Antti Rahtu Oxide films containing titanium
US7208041B2 (en) * 2000-02-23 2007-04-24 Ceracomp Co., Ltd. Method for single crystal growth of perovskite oxides
US6620723B1 (en) 2000-06-27 2003-09-16 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US7964505B2 (en) 2005-01-19 2011-06-21 Applied Materials, Inc. Atomic layer deposition of tungsten materials
US7101795B1 (en) 2000-06-28 2006-09-05 Applied Materials, Inc. Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer
US7405158B2 (en) 2000-06-28 2008-07-29 Applied Materials, Inc. Methods for depositing tungsten layers employing atomic layer deposition techniques
US6551929B1 (en) 2000-06-28 2003-04-22 Applied Materials, Inc. Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques
US7732327B2 (en) 2000-06-28 2010-06-08 Applied Materials, Inc. Vapor deposition of tungsten materials
US6825447B2 (en) 2000-12-29 2004-11-30 Applied Materials, Inc. Apparatus and method for uniform substrate heating and contaminate collection
US6998579B2 (en) 2000-12-29 2006-02-14 Applied Materials, Inc. Chamber for uniform substrate heating
US6765178B2 (en) * 2000-12-29 2004-07-20 Applied Materials, Inc. Chamber for uniform substrate heating
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US6613656B2 (en) 2001-02-13 2003-09-02 Micron Technology, Inc. Sequential pulse deposition
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6660126B2 (en) 2001-03-02 2003-12-09 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6734020B2 (en) 2001-03-07 2004-05-11 Applied Materials, Inc. Valve control system for atomic layer deposition chamber
US7211144B2 (en) 2001-07-13 2007-05-01 Applied Materials, Inc. Pulsed nucleation deposition of tungsten layers
US7085616B2 (en) 2001-07-27 2006-08-01 Applied Materials, Inc. Atomic layer deposition apparatus
US6936906B2 (en) 2001-09-26 2005-08-30 Applied Materials, Inc. Integration of barrier layer and seed layer
US7049226B2 (en) 2001-09-26 2006-05-23 Applied Materials, Inc. Integration of ALD tantalum nitride for copper metallization
US6916398B2 (en) 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
US6729824B2 (en) 2001-12-14 2004-05-04 Applied Materials, Inc. Dual robot processing system
US6620670B2 (en) 2002-01-18 2003-09-16 Applied Materials, Inc. Process conditions and precursors for atomic layer deposition (ALD) of AL2O3
US6998014B2 (en) 2002-01-26 2006-02-14 Applied Materials, Inc. Apparatus and method for plasma assisted deposition
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US6827978B2 (en) 2002-02-11 2004-12-07 Applied Materials, Inc. Deposition of tungsten films
US6833161B2 (en) 2002-02-26 2004-12-21 Applied Materials, Inc. Cyclical deposition of tungsten nitride for metal oxide gate electrode
US7439191B2 (en) 2002-04-05 2008-10-21 Applied Materials, Inc. Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications
US6846516B2 (en) 2002-04-08 2005-01-25 Applied Materials, Inc. Multiple precursor cyclical deposition system
US6720027B2 (en) 2002-04-08 2004-04-13 Applied Materials, Inc. Cyclical deposition of a variable content titanium silicon nitride layer
US6875271B2 (en) 2002-04-09 2005-04-05 Applied Materials, Inc. Simultaneous cyclical deposition in different processing regions
US6869838B2 (en) 2002-04-09 2005-03-22 Applied Materials, Inc. Deposition of passivation layers for active matrix liquid crystal display (AMLCD) applications
US7279432B2 (en) 2002-04-16 2007-10-09 Applied Materials, Inc. System and method for forming an integrated barrier layer
US6821563B2 (en) * 2002-10-02 2004-11-23 Applied Materials, Inc. Gas distribution system for cyclical layer deposition
US8202364B2 (en) * 2002-10-11 2012-06-19 Ceracomp Co., Ltd. Method for solid-state single crystal growth
KR100564092B1 (ko) * 2002-10-11 2006-03-27 주식회사 세라콤 고상 단결정 성장 방법
US7262133B2 (en) 2003-01-07 2007-08-28 Applied Materials, Inc. Enhancement of copper line reliability using thin ALD tan film to cap the copper line
US7211508B2 (en) 2003-06-18 2007-05-01 Applied Materials, Inc. Atomic layer deposition of tantalum based barrier materials
JP4938534B2 (ja) * 2007-04-12 2012-05-23 アルバックテクノ株式会社 真空溶解装置およびルツボユニット
US20110293830A1 (en) 2010-02-25 2011-12-01 Timo Hatanpaa Precursors and methods for atomic layer deposition of transition metal oxides
US9062390B2 (en) 2011-09-12 2015-06-23 Asm International N.V. Crystalline strontium titanate and methods of forming the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE393967B (sv) * 1974-11-29 1977-05-31 Sateko Oy Forfarande och for utforande av stroleggning mellan lagren i ett virkespaket
FI64878C (fi) * 1982-05-10 1984-01-10 Lohja Ab Oy Kombinationsfilm foer isynnerhet tunnfilmelektroluminensstrukturer
JPS6096599A (ja) * 1983-10-31 1985-05-30 Nippon Telegr & Teleph Corp <Ntt> 酸化物超伝導体薄膜の製造方法
GB2162862B (en) * 1984-07-26 1988-10-19 Japan Res Dev Corp A method of growing a thin film single crystalline semiconductor
US4854264A (en) * 1986-12-10 1989-08-08 Fuji Seiki Inc. Vacuum evaporating apparatus
US4983575A (en) * 1987-03-25 1991-01-08 Hitachi, Ltd. Superconducting thin films made of stacked composite oxide layers
JPH0719922B2 (ja) * 1987-07-29 1995-03-06 松下電器産業株式会社 超電導体および集積化超電導装置
DE3854828T2 (de) * 1987-08-24 1996-08-22 Sumitomo Electric Industries Verfahren zur Herstellung einer dünnen Schicht aus zusammengesetztem supraleitendem Oxyd
JPS6465885A (en) * 1987-09-07 1989-03-13 Sanyo Electric Co Manufacture of superconducting thin film

Also Published As

Publication number Publication date
EP0344352A1 (en) 1989-12-06
DE3851701T2 (de) 1995-03-30
EP0344352B1 (en) 1994-09-28
DE3851701D1 (de) 1994-11-03
JPH029795A (ja) 1990-01-12
JPH0761920B2 (ja) 1995-07-05
CA1330193C (en) 1994-06-14
US5439876A (en) 1995-08-08
BR8902555A (pt) 1990-01-23
ATE112418T1 (de) 1994-10-15

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