KR100487455B1 - 사진석판술에 의해 유도된 표면 패턴(들)이 있는 연마용 중합체 패드 및 이에 관련된 방법 - Google Patents
사진석판술에 의해 유도된 표면 패턴(들)이 있는 연마용 중합체 패드 및 이에 관련된 방법 Download PDFInfo
- Publication number
- KR100487455B1 KR100487455B1 KR10-1999-7006289A KR19997006289A KR100487455B1 KR 100487455 B1 KR100487455 B1 KR 100487455B1 KR 19997006289 A KR19997006289 A KR 19997006289A KR 100487455 B1 KR100487455 B1 KR 100487455B1
- Authority
- KR
- South Korea
- Prior art keywords
- pad
- precursor
- pattern
- substrate
- photomask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000005498 polishing Methods 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 229920000642 polymer Polymers 0.000 claims abstract description 7
- 239000002243 precursor Substances 0.000 claims description 51
- 239000000758 substrate Substances 0.000 claims description 25
- 230000005670 electromagnetic radiation Effects 0.000 claims description 20
- 239000012705 liquid precursor Substances 0.000 claims description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 125000005641 methacryl group Chemical group 0.000 claims description 9
- 230000003287 optical effect Effects 0.000 claims description 8
- -1 acryl Chemical group 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 239000002002 slurry Substances 0.000 claims description 7
- 125000000524 functional group Chemical group 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 235000012239 silicon dioxide Nutrition 0.000 claims description 5
- 150000003673 urethanes Chemical class 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 229920006397 acrylic thermoplastic Polymers 0.000 claims description 3
- 150000001408 amides Chemical class 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 150000002170 ethers Chemical class 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 229920001730 Moisture cure polyurethane Polymers 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 230000004888 barrier function Effects 0.000 claims 2
- 230000035515 penetration Effects 0.000 claims 2
- 239000010419 fine particle Substances 0.000 claims 1
- 238000007517 polishing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 11
- 238000000206 photolithography Methods 0.000 abstract description 7
- 238000003754 machining Methods 0.000 abstract description 6
- 238000001459 lithography Methods 0.000 abstract 1
- 238000000016 photochemical curing Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 229920013730 reactive polymer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ILBBNQMSDGAAPF-UHFFFAOYSA-N 1-(6-hydroxy-6-methylcyclohexa-2,4-dien-1-yl)propan-1-one Chemical compound CCC(=O)C1C=CC=CC1(C)O ILBBNQMSDGAAPF-UHFFFAOYSA-N 0.000 description 1
- OAMHTTBNEJBIKA-UHFFFAOYSA-N 2,2,2-trichloro-1-phenylethanone Chemical compound ClC(Cl)(Cl)C(=O)C1=CC=CC=C1 OAMHTTBNEJBIKA-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- AOGNACZDZNOTSN-UHFFFAOYSA-N 2,3-dihydroxy-1,2-diphenylpropan-1-one Chemical compound C=1C=CC=CC=1C(O)(CO)C(=O)C1=CC=CC=C1 AOGNACZDZNOTSN-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3449297P | 1997-01-13 | 1997-01-13 | |
| US60/034,492 | 1997-01-13 | ||
| PCT/US1998/000317 WO1998030356A1 (en) | 1997-01-13 | 1998-01-12 | Polymeric polishing pad having photolithographically induced surface pattern(s) and methods relating thereto |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20000070068A KR20000070068A (ko) | 2000-11-25 |
| KR100487455B1 true KR100487455B1 (ko) | 2005-05-09 |
Family
ID=21876756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-1999-7006289A Expired - Lifetime KR100487455B1 (ko) | 1997-01-13 | 1998-01-12 | 사진석판술에 의해 유도된 표면 패턴(들)이 있는 연마용 중합체 패드 및 이에 관련된 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6036579A (enExample) |
| EP (1) | EP0984846B1 (enExample) |
| JP (1) | JP4163756B2 (enExample) |
| KR (1) | KR100487455B1 (enExample) |
| DE (1) | DE69827789T2 (enExample) |
| WO (1) | WO1998030356A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011013894A1 (ko) * | 2009-07-30 | 2011-02-03 | 서강대학교 산학협력단 | 기공이 형성된 cmp 연마패드와 그의 제조방법 |
| KR20210123187A (ko) | 2020-03-31 | 2021-10-13 | 비젼포커스 인크. | 블루라이트 커트 콘택트 렌즈, 그 조성물 및 제조 방법 |
Families Citing this family (68)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2658218C (en) * | 1998-04-17 | 2014-10-28 | Innogenetics N.V. | Improved immunodiagnostic assays using reducing agents |
| US6290589B1 (en) * | 1998-12-09 | 2001-09-18 | Applied Materials, Inc. | Polishing pad with a partial adhesive coating |
| KR100585480B1 (ko) * | 1999-01-21 | 2006-06-02 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 | 개선된 연마 패드 및 기판의 연마 방법 |
| US6234875B1 (en) | 1999-06-09 | 2001-05-22 | 3M Innovative Properties Company | Method of modifying a surface |
| WO2001064396A1 (en) * | 2000-02-28 | 2001-09-07 | Rodel Holdings, Inc. | Polishing pad surface texture formed by solid phase droplets |
| WO2001083167A1 (en) * | 2000-05-03 | 2001-11-08 | Rodel Holdings, Inc. | Polishing pad with a seam which is reinforced with caulking material |
| US6736709B1 (en) | 2000-05-27 | 2004-05-18 | Rodel Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
| US6860802B1 (en) | 2000-05-27 | 2005-03-01 | Rohm And Haas Electric Materials Cmp Holdings, Inc. | Polishing pads for chemical mechanical planarization |
| US6749485B1 (en) | 2000-05-27 | 2004-06-15 | Rodel Holdings, Inc. | Hydrolytically stable grooved polishing pads for chemical mechanical planarization |
| DE60114183T2 (de) * | 2000-05-27 | 2006-07-13 | Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark | Polierkissen zum chemisch-mechanischen planarisieren |
| US6685537B1 (en) * | 2000-06-05 | 2004-02-03 | Speedfam-Ipec Corporation | Polishing pad window for a chemical mechanical polishing tool |
| US6592443B1 (en) * | 2000-08-30 | 2003-07-15 | Micron Technology, Inc. | Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
| US6652764B1 (en) * | 2000-08-31 | 2003-11-25 | Micron Technology, Inc. | Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
| JP2002141315A (ja) * | 2000-11-02 | 2002-05-17 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤用cmpパッド及び基板の研磨方法 |
| KR100905266B1 (ko) | 2000-12-01 | 2009-06-29 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
| WO2002070200A1 (en) | 2001-03-01 | 2002-09-12 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
| US20050107007A1 (en) * | 2001-12-28 | 2005-05-19 | Shoichi Furukawa | Polishing pad process for producing the same and method of polishing |
| US7037184B2 (en) * | 2003-01-22 | 2006-05-02 | Raytech Innovation Solutions, Llc | Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same |
| US6852020B2 (en) * | 2003-01-22 | 2005-02-08 | Raytech Innovative Solutions, Inc. | Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same |
| US20030194959A1 (en) * | 2002-04-15 | 2003-10-16 | Cabot Microelectronics Corporation | Sintered polishing pad with regions of contrasting density |
| US20050276967A1 (en) * | 2002-05-23 | 2005-12-15 | Cabot Microelectronics Corporation | Surface textured microporous polishing pads |
| US7025668B2 (en) * | 2002-06-18 | 2006-04-11 | Raytech Innovative Solutions, Llc | Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers |
| EP1594656B1 (en) * | 2003-02-18 | 2007-09-12 | Parker-Hannifin Corporation | Polishing article for electro-chemical mechanical polishing |
| US6802761B1 (en) * | 2003-03-20 | 2004-10-12 | Hitachi Global Storage Technologies Netherlands B.V. | Pattern-electroplated lapping plates for reduced loads during single slider lapping and process for their fabrication |
| US6852982B1 (en) * | 2003-07-14 | 2005-02-08 | Fei Company | Magnetic lens |
| US20050069949A1 (en) * | 2003-09-30 | 2005-03-31 | International Business Machines Corporation | Microfabricated Fluidic Structures |
| US20050069462A1 (en) * | 2003-09-30 | 2005-03-31 | International Business Machines Corporation | Microfluidics Packaging |
| US7204742B2 (en) * | 2004-03-25 | 2007-04-17 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
| JP4845347B2 (ja) * | 2004-05-17 | 2011-12-28 | 東洋ゴム工業株式会社 | 研磨パッドおよびその製造方法 |
| TWI254354B (en) * | 2004-06-29 | 2006-05-01 | Iv Technologies Co Ltd | An inlaid polishing pad and a method of producing the same |
| CA2603275C (en) * | 2005-04-14 | 2010-07-13 | Saint-Gobain Abrasives, Inc. | Method of forming structured abrasive article |
| US20070049164A1 (en) * | 2005-08-26 | 2007-03-01 | Thomson Clifford O | Polishing pad and method for manufacturing polishing pads |
| US8192249B2 (en) * | 2009-03-12 | 2012-06-05 | Hitachi Global Storage Technologies Netherlands, B.V. | Systems and methods for polishing a magnetic disk |
| KR101044279B1 (ko) * | 2009-07-30 | 2011-06-28 | 서강대학교산학협력단 | Cmp 연마패드와 그의 제조방법 |
| TWI423307B (zh) | 2010-11-05 | 2014-01-11 | Far Eastern New Century Corp | 製造微結構的方法 |
| KR20130124331A (ko) * | 2010-12-07 | 2013-11-13 | 제이에스알 가부시끼가이샤 | 화학 기계 연마 패드 및 그것을 이용한 화학 기계 연마 방법 |
| US8828650B2 (en) | 2011-09-13 | 2014-09-09 | Far Eastern New Century Corporation | Method for making a retarder |
| US8801949B2 (en) | 2011-09-22 | 2014-08-12 | Dow Global Technologies Llc | Method of forming open-network polishing pads |
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| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| CN109075057B (zh) * | 2016-03-09 | 2023-10-20 | 应用材料公司 | 垫结构及制造方法 |
| US10596763B2 (en) | 2017-04-21 | 2020-03-24 | Applied Materials, Inc. | Additive manufacturing with array of energy sources |
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| US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
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| KR20210042171A (ko) | 2018-09-04 | 2021-04-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 진보한 폴리싱 패드들을 위한 제형들 |
| JP7321052B2 (ja) * | 2019-10-17 | 2023-08-04 | 東京エレクトロン株式会社 | 基板処理装置および装置洗浄方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US34492A (en) | 1862-02-25 | Improvement in portable filters | ||
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- 1998-01-12 KR KR10-1999-7006289A patent/KR100487455B1/ko not_active Expired - Lifetime
- 1998-01-12 US US09/005,708 patent/US6036579A/en not_active Expired - Lifetime
- 1998-01-12 WO PCT/US1998/000317 patent/WO1998030356A1/en not_active Ceased
- 1998-01-12 JP JP53109098A patent/JP4163756B2/ja not_active Expired - Lifetime
- 1998-01-12 EP EP98903401A patent/EP0984846B1/en not_active Expired - Lifetime
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2000
- 2000-02-02 US US09/496,327 patent/US6210254B1/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011013894A1 (ko) * | 2009-07-30 | 2011-02-03 | 서강대학교 산학협력단 | 기공이 형성된 cmp 연마패드와 그의 제조방법 |
| KR20210123187A (ko) | 2020-03-31 | 2021-10-13 | 비젼포커스 인크. | 블루라이트 커트 콘택트 렌즈, 그 조성물 및 제조 방법 |
| KR20230108250A (ko) | 2020-03-31 | 2023-07-18 | 비젼포커스 인크. | 블루라이트 커트 콘택트 렌즈, 그 조성물 및 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001507997A (ja) | 2001-06-19 |
| EP0984846A4 (en) | 2000-03-15 |
| JP4163756B2 (ja) | 2008-10-08 |
| KR20000070068A (ko) | 2000-11-25 |
| EP0984846A1 (en) | 2000-03-15 |
| US6210254B1 (en) | 2001-04-03 |
| WO1998030356A1 (en) | 1998-07-16 |
| DE69827789T2 (de) | 2005-11-10 |
| DE69827789D1 (de) | 2004-12-30 |
| US6036579A (en) | 2000-03-14 |
| EP0984846B1 (en) | 2004-11-24 |
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